JP5375708B2 - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法 Download PDF

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Publication number
JP5375708B2
JP5375708B2 JP2010074492A JP2010074492A JP5375708B2 JP 5375708 B2 JP5375708 B2 JP 5375708B2 JP 2010074492 A JP2010074492 A JP 2010074492A JP 2010074492 A JP2010074492 A JP 2010074492A JP 5375708 B2 JP5375708 B2 JP 5375708B2
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Japan
Prior art keywords
electrode
solder
solder particles
circuit board
electronic component
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JP2010074492A
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Japanese (ja)
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JP2011210773A5 (https=
JP2011210773A (ja
Inventor
大輔 櫻井
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Panasonic Corp
Panasonic Holdings Corp
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Panasonic Corp
Matsushita Electric Industrial Co Ltd
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Priority to JP2010074492A priority Critical patent/JP5375708B2/ja
Priority to US13/040,318 priority patent/US8367539B2/en
Priority to KR1020110021213A priority patent/KR101655926B1/ko
Priority to TW100108737A priority patent/TWI518808B/zh
Priority to CN201110081344.6A priority patent/CN102208388B/zh
Publication of JP2011210773A publication Critical patent/JP2011210773A/ja
Publication of JP2011210773A5 publication Critical patent/JP2011210773A5/ja
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    • H10W72/01235—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using blanket deposition in liquid form, e.g. spin coating, spray coating or immersion coating by plating, e.g. electroless plating or electroplating
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JP2010074492A 2010-03-29 2010-03-29 半導体装置の製造方法 Active JP5375708B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2010074492A JP5375708B2 (ja) 2010-03-29 2010-03-29 半導体装置の製造方法
US13/040,318 US8367539B2 (en) 2010-03-29 2011-03-04 Semiconductor device and semiconductor device manufacturing method
KR1020110021213A KR101655926B1 (ko) 2010-03-29 2011-03-10 반도체장치 및 반도체장치의 제조방법
TW100108737A TWI518808B (zh) 2010-03-29 2011-03-15 半導體裝置及半導體裝置之製造方法
CN201110081344.6A CN102208388B (zh) 2010-03-29 2011-03-24 半导体装置以及半导体装置的制造方法

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Application Number Priority Date Filing Date Title
JP2010074492A JP5375708B2 (ja) 2010-03-29 2010-03-29 半導体装置の製造方法

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JP2011210773A JP2011210773A (ja) 2011-10-20
JP2011210773A5 JP2011210773A5 (https=) 2013-02-14
JP5375708B2 true JP5375708B2 (ja) 2013-12-25

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US (1) US8367539B2 (https=)
JP (1) JP5375708B2 (https=)
KR (1) KR101655926B1 (https=)
CN (1) CN102208388B (https=)
TW (1) TWI518808B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9331042B2 (en) 2012-01-17 2016-05-03 Panasonic Intellectual Property Management Co., Ltd. Semiconductor device manufacturing method and semiconductor device

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013183094A (ja) * 2012-03-02 2013-09-12 Nec Corp 電子部品の実装方法及び半導体装置
JP2013214557A (ja) * 2012-03-30 2013-10-17 Olympus Corp 電極形成体、配線基板、および半導体装置
JP5923725B2 (ja) * 2012-05-15 2016-05-25 パナソニックＩｐマネジメント株式会社 電子部品の実装構造体
EP2747132B1 (en) * 2012-12-18 2018-11-21 IMEC vzw A method for transferring a graphene sheet to metal contact bumps of a substrate for use in semiconductor device package
JP6089732B2 (ja) * 2013-01-30 2017-03-08 日立金属株式会社 導電性部材の接続構造、導電性部材の接続方法、及び光モジュール
US8969191B2 (en) * 2013-07-16 2015-03-03 Taiwan Semiconductor Manufacturing Co., Ltd. Mechanisms for forming package structure
US9583470B2 (en) * 2013-12-19 2017-02-28 Intel Corporation Electronic device with solder pads including projections
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