KR101631746B1 - 인쇄회로기판의 제조방법 및 인쇄회로기판 - Google Patents

인쇄회로기판의 제조방법 및 인쇄회로기판 Download PDF

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Publication number
KR101631746B1
KR101631746B1 KR1020140054695A KR20140054695A KR101631746B1 KR 101631746 B1 KR101631746 B1 KR 101631746B1 KR 1020140054695 A KR1020140054695 A KR 1020140054695A KR 20140054695 A KR20140054695 A KR 20140054695A KR 101631746 B1 KR101631746 B1 KR 101631746B1
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KR
South Korea
Prior art keywords
coating layer
layer
plating
forming
hole
Prior art date
Application number
KR1020140054695A
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English (en)
Korean (ko)
Other versions
KR20140133464A (ko
Inventor
정광춘
윤광백
한영구
윤동국
김수한
Original Assignee
주식회사 잉크테크
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Application filed by 주식회사 잉크테크 filed Critical 주식회사 잉크테크
Publication of KR20140133464A publication Critical patent/KR20140133464A/ko
Application granted granted Critical
Publication of KR101631746B1 publication Critical patent/KR101631746B1/ko

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
KR1020140054695A 2013-05-08 2014-05-08 인쇄회로기판의 제조방법 및 인쇄회로기판 KR101631746B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20130052070 2013-05-08
KR1020130052070 2013-05-08

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020150092355A Division KR101631801B1 (ko) 2013-05-08 2015-06-29 인쇄회로기판의 제조방법

Publications (2)

Publication Number Publication Date
KR20140133464A KR20140133464A (ko) 2014-11-19
KR101631746B1 true KR101631746B1 (ko) 2016-07-07

Family

ID=51867495

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020140054695A KR101631746B1 (ko) 2013-05-08 2014-05-08 인쇄회로기판의 제조방법 및 인쇄회로기판
KR1020150092355A KR101631801B1 (ko) 2013-05-08 2015-06-29 인쇄회로기판의 제조방법

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020150092355A KR101631801B1 (ko) 2013-05-08 2015-06-29 인쇄회로기판의 제조방법

Country Status (4)

Country Link
KR (2) KR101631746B1 (zh)
CN (1) CN105379436B (zh)
TW (1) TWI583280B (zh)
WO (1) WO2014182094A1 (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI566646B (zh) * 2015-10-06 2017-01-11 挺暉工業股份有限公司 柔性印刷電路板、連接器組件及電子裝置
CN109219259B (zh) * 2017-07-05 2021-09-14 宏启胜精密电子(秦皇岛)有限公司 柔性电路板及其制作方法
KR101957242B1 (ko) * 2017-07-26 2019-06-20 (주)잉크테크 인쇄회로기판 제조방법
KR102465117B1 (ko) * 2017-11-29 2022-11-11 주식회사 잉크테크 인쇄회로기판 제조방법
KR102081078B1 (ko) 2018-07-02 2020-02-25 도레이첨단소재 주식회사 연성동박적층필름 및 이의 제조방법
CN109475044B (zh) * 2018-12-07 2021-05-18 常熟东南相互电子有限公司 采用uv激光钻孔直接电镀制作fpc内层的方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05259226A (ja) * 1992-01-14 1993-10-08 Hitachi Cable Ltd スルーホール付電気回路構造物及びその製造方法
JPH06260756A (ja) * 1993-03-04 1994-09-16 Ibiden Co Ltd プリント配線板の製造方法
JP3207663B2 (ja) * 1994-03-22 2001-09-10 松下電器産業株式会社 プリント配線基板及びその製造方法
JP3279117B2 (ja) * 1995-03-01 2002-04-30 株式会社デンソー フレキシブル配線板の製造方法
CN1155827A (zh) * 1996-01-25 1997-07-30 金宝电子工业股份有限公司 纸质酚醛树脂线路板及其制造方法
US7345350B2 (en) * 2003-09-23 2008-03-18 Micron Technology, Inc. Process and integration scheme for fabricating conductive components, through-vias and semiconductor components including conductive through-wafer vias
KR100674293B1 (ko) * 2005-09-09 2007-01-24 삼성전기주식회사 전자부품이 내장된 인쇄회로기판의 제조방법
US8143617B2 (en) * 2007-07-03 2012-03-27 Panasonic Corporation Semiconductor device, semiconductor device manufacturing method and image display device
JP5076196B2 (ja) * 2007-10-29 2012-11-21 三菱電機株式会社 プリント配線板およびその製造方法
JP5245756B2 (ja) * 2008-11-20 2013-07-24 富士通株式会社 回路基板、多層回路基板および多層回路基板の製造方法
KR20100109698A (ko) * 2009-04-01 2010-10-11 삼성전기주식회사 인쇄회로기판의 제조방법
EP2475234A3 (en) * 2009-04-24 2012-09-19 Sumitomo Electric Industries, Ltd. Substrate for printed wiring board, printed wiring board, and methods for producing same

Also Published As

Publication number Publication date
WO2014182094A1 (ko) 2014-11-13
KR20150084724A (ko) 2015-07-22
TWI583280B (zh) 2017-05-11
KR20140133464A (ko) 2014-11-19
TW201509260A (zh) 2015-03-01
CN105379436B (zh) 2018-08-14
CN105379436A (zh) 2016-03-02
KR101631801B1 (ko) 2016-07-07

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