KR101615497B1 - 발광소자 패키지 및 그 제조방법 - Google Patents

발광소자 패키지 및 그 제조방법 Download PDF

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KR101615497B1
KR101615497B1 KR1020090115559A KR20090115559A KR101615497B1 KR 101615497 B1 KR101615497 B1 KR 101615497B1 KR 1020090115559 A KR1020090115559 A KR 1020090115559A KR 20090115559 A KR20090115559 A KR 20090115559A KR 101615497 B1 KR101615497 B1 KR 101615497B1
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South Korea
Prior art keywords
led chip
molding
main body
emitting device
light emitting
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KR1020090115559A
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Korean (ko)
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KR20110058987A (ko
Inventor
박영삼
함헌주
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삼성전자주식회사
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Priority to KR1020090115559A priority Critical patent/KR101615497B1/ko
Priority to US12/944,401 priority patent/US8680585B2/en
Priority to JP2010252964A priority patent/JP2011114341A/ja
Publication of KR20110058987A publication Critical patent/KR20110058987A/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8514—Wavelength conversion means characterised by their shape, e.g. plate or foil
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
KR1020090115559A 2009-11-27 2009-11-27 발광소자 패키지 및 그 제조방법 Active KR101615497B1 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020090115559A KR101615497B1 (ko) 2009-11-27 2009-11-27 발광소자 패키지 및 그 제조방법
US12/944,401 US8680585B2 (en) 2009-11-27 2010-11-11 Light emitting diode package and method of manufacturing the same
JP2010252964A JP2011114341A (ja) 2009-11-27 2010-11-11 発光素子パッケージ及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020090115559A KR101615497B1 (ko) 2009-11-27 2009-11-27 발광소자 패키지 및 그 제조방법

Publications (2)

Publication Number Publication Date
KR20110058987A KR20110058987A (ko) 2011-06-02
KR101615497B1 true KR101615497B1 (ko) 2016-04-27

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Country Status (3)

Country Link
US (1) US8680585B2 (enExample)
JP (1) JP2011114341A (enExample)
KR (1) KR101615497B1 (enExample)

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US9024518B2 (en) * 2012-02-16 2015-05-05 Citizen Electronics Co., Ltd. Light-emitting diode and lighting device including the same
KR102242660B1 (ko) * 2013-09-11 2021-04-21 엘지디스플레이 주식회사 발광 다이오드 소자 및 이를 포함하는 백라이트 유닛과 이의 제조 방법
KR101488454B1 (ko) * 2013-09-16 2015-01-30 서울반도체 주식회사 Ｌｅｄ 패키지 및 그 제조방법
EP3086029A1 (en) * 2015-04-22 2016-10-26 Lumens Co., Ltd. Light emitting device package, backlight unit, and method of manufacturing light emitting apparatus
KR102374529B1 (ko) * 2015-05-29 2022-03-17 엘지디스플레이 주식회사 발광 다이오드 패키지와 그의 제조 방법, 이를 이용한 백라이트 유닛과 액정 표시 장치
KR101763893B1 (ko) * 2015-06-03 2017-08-01 주식회사 굿엘이디 광원 유닛 및 이의 제조 방법
KR101665102B1 (ko) 2015-06-10 2016-10-12 주식회사 레다즈 발광소자 패키지 및 그의 제조방법
US10008648B2 (en) 2015-10-08 2018-06-26 Semicon Light Co., Ltd. Semiconductor light emitting device
KR102426861B1 (ko) * 2015-12-02 2022-07-29 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광 소자 패키지
TWI608636B (zh) * 2016-01-28 2017-12-11 行家光電股份有限公司 具非對稱性光形的發光裝置及其製造方法
EP3200248B1 (en) * 2016-01-28 2020-09-30 Maven Optronics Co., Ltd. Light emitting device with asymmetrical radiation pattern and manufacturing method of the same
KR102116988B1 (ko) * 2016-08-11 2020-06-01 삼성전자 주식회사 광원 모듈, 이의 제조 방법, 및 이를 포함하는 백라이트 유닛
KR101865786B1 (ko) * 2016-11-09 2018-06-11 주식회사 세미콘라이트 반도체 발광소자 및 이의 제조 방법
KR101863538B1 (ko) * 2017-04-19 2018-06-04 주식회사 세미콘라이트 반도체 발광소자 및 이의 제조 방법
KR101877241B1 (ko) * 2017-06-29 2018-07-11 주식회사 세미콘라이트 반도체 발광소자
KR20190074233A (ko) * 2017-12-19 2019-06-27 서울반도체 주식회사 발광 소자 및 이를 포함하는 발광 모듈
JP6848997B2 (ja) * 2018-04-11 2021-03-24 日亜化学工業株式会社 発光装置
KR20200019514A (ko) * 2018-08-14 2020-02-24 서울반도체 주식회사 발광 다이오드 패키지 및 발광 다이오드 패키지를 포함하는 디스플레이 장치
JP6993589B2 (ja) * 2019-12-11 2022-02-04 日亜化学工業株式会社 発光装置及び発光装置を用いた面発光装置
JP7534626B2 (ja) 2020-12-17 2024-08-15 日亜化学工業株式会社 発光装置及び面状光源

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JP2008135709A (ja) * 2006-10-31 2008-06-12 Sharp Corp 発光装置、画像表示装置、およびその製造方法
KR20090047306A (ko) * 2007-11-07 2009-05-12 삼성전기주식회사 발광다이오드 패키지
WO2009093498A1 (ja) * 2008-01-22 2009-07-30 Alps Electric Co., Ltd. Ｌｅｄパッケージおよびその製造方法
JP2013005709A (ja) * 2011-06-20 2013-01-07 Hiromichi Kinoshita バッテリー大型発電システム

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KR20110058987A (ko) 2011-06-02
US20110127558A1 (en) 2011-06-02
JP2011114341A (ja) 2011-06-09
US8680585B2 (en) 2014-03-25

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