JP2011114341A - 発光素子パッケージ及びその製造方法 - Google Patents

発光素子パッケージ及びその製造方法 Download PDF

Info

Publication number
JP2011114341A
JP2011114341A JP2010252964A JP2010252964A JP2011114341A JP 2011114341 A JP2011114341 A JP 2011114341A JP 2010252964 A JP2010252964 A JP 2010252964A JP 2010252964 A JP2010252964 A JP 2010252964A JP 2011114341 A JP2011114341 A JP 2011114341A
Authority
JP
Japan
Prior art keywords
led chip
light emitting
emitting device
device package
axis direction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010252964A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011114341A5 (enExample
Inventor
Young Sam Park
サム パク、ヤン
Hun Joo Hahm
ジュ ハム、ホン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung LED Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung LED Co Ltd filed Critical Samsung LED Co Ltd
Publication of JP2011114341A publication Critical patent/JP2011114341A/ja
Publication of JP2011114341A5 publication Critical patent/JP2011114341A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8514—Wavelength conversion means characterised by their shape, e.g. plate or foil
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2010252964A 2009-11-27 2010-11-11 発光素子パッケージ及びその製造方法 Pending JP2011114341A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020090115559A KR101615497B1 (ko) 2009-11-27 2009-11-27 발광소자 패키지 및 그 제조방법
KR10-2009-0115559 2009-11-27

Publications (2)

Publication Number Publication Date
JP2011114341A true JP2011114341A (ja) 2011-06-09
JP2011114341A5 JP2011114341A5 (enExample) 2013-11-14

Family

ID=44068190

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010252964A Pending JP2011114341A (ja) 2009-11-27 2010-11-11 発光素子パッケージ及びその製造方法

Country Status (3)

Country Link
US (1) US8680585B2 (enExample)
JP (1) JP2011114341A (enExample)
KR (1) KR101615497B1 (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101763893B1 (ko) * 2015-06-03 2017-08-01 주식회사 굿엘이디 광원 유닛 및 이의 제조 방법
JP2017168819A (ja) * 2016-01-28 2017-09-21 マブン オプトロニックス カンパニー リミテッドＭａｖｅｎ Ｏｐｔｒｏｎｉｃｓ Ｃｏ．， Ｌｔｄ． 非対称放射パターンを有する発光素子およびその製造方法
KR20190118977A (ko) * 2018-04-11 2019-10-21 니치아 카가쿠 고교 가부시키가이샤 발광장치
JP2022031318A (ja) * 2019-12-11 2022-02-18 日亜化学工業株式会社 発光装置及び発光装置を用いた面発光装置
US11664479B2 (en) 2020-12-17 2023-05-30 Nichia Corporation Light emitting device and planar light source

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9024518B2 (en) * 2012-02-16 2015-05-05 Citizen Electronics Co., Ltd. Light-emitting diode and lighting device including the same
KR102242660B1 (ko) * 2013-09-11 2021-04-21 엘지디스플레이 주식회사 발광 다이오드 소자 및 이를 포함하는 백라이트 유닛과 이의 제조 방법
KR101488454B1 (ko) * 2013-09-16 2015-01-30 서울반도체 주식회사 Ｌｅｄ 패키지 및 그 제조방법
EP3086029A1 (en) * 2015-04-22 2016-10-26 Lumens Co., Ltd. Light emitting device package, backlight unit, and method of manufacturing light emitting apparatus
KR102374529B1 (ko) * 2015-05-29 2022-03-17 엘지디스플레이 주식회사 발광 다이오드 패키지와 그의 제조 방법, 이를 이용한 백라이트 유닛과 액정 표시 장치
KR101665102B1 (ko) 2015-06-10 2016-10-12 주식회사 레다즈 발광소자 패키지 및 그의 제조방법
US10008648B2 (en) 2015-10-08 2018-06-26 Semicon Light Co., Ltd. Semiconductor light emitting device
KR102426861B1 (ko) * 2015-12-02 2022-07-29 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광 소자 패키지
US10230030B2 (en) 2016-01-28 2019-03-12 Maven Optronics Co., Ltd. Light emitting device with asymmetrical radiation pattern and manufacturing method of the same
KR102116988B1 (ko) 2016-08-11 2020-06-01 삼성전자 주식회사 광원 모듈, 이의 제조 방법, 및 이를 포함하는 백라이트 유닛
KR101865786B1 (ko) * 2016-11-09 2018-06-11 주식회사 세미콘라이트 반도체 발광소자 및 이의 제조 방법
KR101863538B1 (ko) * 2017-04-19 2018-06-04 주식회사 세미콘라이트 반도체 발광소자 및 이의 제조 방법
KR101877241B1 (ko) * 2017-06-29 2018-07-11 주식회사 세미콘라이트 반도체 발광소자
KR20190074233A (ko) * 2017-12-19 2019-06-27 서울반도체 주식회사 발광 소자 및 이를 포함하는 발광 모듈
KR20200019514A (ko) * 2018-08-14 2020-02-24 서울반도체 주식회사 발광 다이오드 패키지 및 발광 다이오드 패키지를 포함하는 디스플레이 장치

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004039778A (ja) * 2002-07-02 2004-02-05 Matsushita Electric Ind Co Ltd 照明用発光素子
JP2008166462A (ja) * 2006-12-28 2008-07-17 Nichia Chem Ind Ltd 発光装置
JP2008226928A (ja) * 2007-03-08 2008-09-25 Sharp Corp 発光装置およびその製造方法、ならびに照明装置
KR20090047306A (ko) * 2007-11-07 2009-05-12 삼성전기주식회사 발광다이오드 패키지
WO2009093498A1 (ja) * 2008-01-22 2009-07-30 Alps Electric Co., Ltd. Ｌｅｄパッケージおよびその製造方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100586965B1 (ko) * 2004-05-27 2006-06-08 삼성전기주식회사 발광 다이오드 소자
KR100586968B1 (ko) * 2004-05-28 2006-06-08 삼성전기주식회사 Ｌｅｄ 패키지 및 이를 구비한 액정표시장치용 백라이트어셈블리
KR100576866B1 (ko) * 2004-06-16 2006-05-10 삼성전기주식회사 발광다이오드 및 그 제조방법
US7352011B2 (en) 2004-11-15 2008-04-01 Philips Lumileds Lighting Company, Llc Wide emitting lens for LED useful for backlighting
KR100631901B1 (ko) * 2005-01-31 2006-10-11 삼성전기주식회사 Ｌｅｄ 패키지 프레임 및 이를 채용하는 ｌｅｄ 패키지
DE102005061431B4 (de) * 2005-02-03 2020-01-02 Samsung Electronics Co., Ltd. LED-Einheit der Art Seitenausstrahlung
KR100674871B1 (ko) * 2005-06-01 2007-01-30 삼성전기주식회사 측면 발광형 엘이디 패키지 및 그 제조 방법
KR100691179B1 (ko) * 2005-06-01 2007-03-09 삼성전기주식회사 측면 발광형 엘이디 패키지 및 그 제조 방법
US8168989B2 (en) * 2005-09-20 2012-05-01 Renesas Electronics Corporation LED light source and method of manufacturing the same
KR20070055152A (ko) 2005-11-25 2007-05-30 서울반도체 주식회사 발광소자 및 이를 이용한 백라이트 유닛
KR100790741B1 (ko) * 2006-09-07 2008-01-02 삼성전기주식회사 엘이디 패키지용 렌즈의 제작 방법
JP2008135709A (ja) * 2006-10-31 2008-06-12 Sharp Corp 発光装置、画像表示装置、およびその製造方法
KR100930171B1 (ko) * 2006-12-05 2009-12-07 삼성전기주식회사 백색 발광장치 및 이를 이용한 백색 광원 모듈
US8258526B2 (en) * 2008-07-03 2012-09-04 Samsung Led Co., Ltd. Light emitting diode package including a lead frame with a cavity
JP2013005709A (ja) * 2011-06-20 2013-01-07 Hiromichi Kinoshita バッテリー大型発電システム

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004039778A (ja) * 2002-07-02 2004-02-05 Matsushita Electric Ind Co Ltd 照明用発光素子
JP2008166462A (ja) * 2006-12-28 2008-07-17 Nichia Chem Ind Ltd 発光装置
JP2008226928A (ja) * 2007-03-08 2008-09-25 Sharp Corp 発光装置およびその製造方法、ならびに照明装置
KR20090047306A (ko) * 2007-11-07 2009-05-12 삼성전기주식회사 발광다이오드 패키지
WO2009093498A1 (ja) * 2008-01-22 2009-07-30 Alps Electric Co., Ltd. Ｌｅｄパッケージおよびその製造方法

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101763893B1 (ko) * 2015-06-03 2017-08-01 주식회사 굿엘이디 광원 유닛 및 이의 제조 방법
JP2017168819A (ja) * 2016-01-28 2017-09-21 マブン オプトロニックス カンパニー リミテッドＭａｖｅｎ Ｏｐｔｒｏｎｉｃｓ Ｃｏ．， Ｌｔｄ． 非対称放射パターンを有する発光素子およびその製造方法
KR20190118977A (ko) * 2018-04-11 2019-10-21 니치아 카가쿠 고교 가부시키가이샤 발광장치
KR102738697B1 (ko) 2018-04-11 2024-12-06 니치아 카가쿠 고교 가부시키가이샤 발광장치
JP2022031318A (ja) * 2019-12-11 2022-02-18 日亜化学工業株式会社 発光装置及び発光装置を用いた面発光装置
JP7440780B2 (ja) 2019-12-11 2024-02-29 日亜化学工業株式会社 発光装置及び発光装置を用いた面発光装置
US11664479B2 (en) 2020-12-17 2023-05-30 Nichia Corporation Light emitting device and planar light source

Also Published As

Publication number Publication date
US8680585B2 (en) 2014-03-25
KR20110058987A (ko) 2011-06-02
US20110127558A1 (en) 2011-06-02
KR101615497B1 (ko) 2016-04-27

Similar Documents

Publication Publication Date Title
JP2011114341A (ja) 発光素子パッケージ及びその製造方法
US7042022B2 (en) Chip light emitting diode and fabrication method thereof
TWI502253B (zh) 具有光學地耦合至背面的發光二極體之薄邊緣背光
US10139077B2 (en) Optical lens, light emitting module and light unit having the same
JP5797393B2 (ja) 発光素子パッケージ
KR101515833B1 (ko) 광학 장치
CN102157504B (zh) 发光二极管封装和具有发光二极管封装的灯单元
US9039216B2 (en) Light emitting device package and light unit having the same
CN103375717B (zh) 发光器件
JP6732848B2 (ja) 非対称な形状の発光装置、当該発光装置を用いたバックライトモジュール、当該発光装置の製造方法
WO2011117934A1 (ja) 発光装置及びそれを用いたバックライトモジュール
CN101425555B (zh) 半导体发光器件和平面光源
KR101106176B1 (ko) 경사형 ｌｅｄ 패키지 및 그것을 포함하는 백라이트 유닛
JP5538479B2 (ja) Ｌｅｄ光源及びそれを用いた発光体
KR20200019514A (ko) 발광 다이오드 패키지 및 발광 다이오드 패키지를 포함하는 디스플레이 장치
KR20120079666A (ko) 발광소자 패키지
KR101877727B1 (ko) 렌즈 유닛 및 발광 장치
JP7538720B2 (ja) 面状発光装置
KR101724698B1 (ko) 백라이트 유닛 및 이를 구비한 표시 장치
KR20100048211A (ko) 발광 소자용 렌즈
CN101341602A (zh) Led光约束元件
KR101888603B1 (ko) 발광 소자 패키지 및 표시장치
KR20130045098A (ko) 발광 장치
KR101735310B1 (ko) 발광소자 패키지
KR101831278B1 (ko) 발광소자 패키지

Legal Events

Date Code Title Description
A711 Notification of change in applicant

Free format text: JAPANESE INTERMEDIATE CODE: A712

Effective date: 20120813

RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20130325

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130816

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20130816

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20131023

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20140312

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20140430

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140728

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20141118