KR101602982B1 - 리드 프레임 기판과 그 제조 방법, 및 반도체 장치 - Google Patents

리드 프레임 기판과 그 제조 방법, 및 반도체 장치 Download PDF

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Publication number
KR101602982B1
KR101602982B1 KR1020117006885A KR20117006885A KR101602982B1 KR 101602982 B1 KR101602982 B1 KR 101602982B1 KR 1020117006885 A KR1020117006885 A KR 1020117006885A KR 20117006885 A KR20117006885 A KR 20117006885A KR 101602982 B1 KR101602982 B1 KR 101602982B1
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South Korea
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connection terminal
external connection
point
height
semiconductor element
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English (en)
Korean (ko)
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KR20110074514A (ko
Inventor
다께히또 쯔까모또
스스무 마니와
준꼬 도다
야스히로 사까이
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도판 인사츠 가부시키가이샤
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • H10W70/042—Etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/654—Top-view layouts
    • H10W70/656—Fan-in layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07353—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/331—Shapes of die-attach connectors
    • H10W72/334—Cross-sectional shape, i.e. in side view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Die Bonding (AREA)
KR1020117006885A 2008-09-30 2009-09-30 리드 프레임 기판과 그 제조 방법, 및 반도체 장치 Expired - Fee Related KR101602982B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008254312A JP5549066B2 (ja) 2008-09-30 2008-09-30 リードフレーム型基板とその製造方法、及び半導体装置
JPJP-P-2008-254312 2008-09-30

Publications (2)

Publication Number Publication Date
KR20110074514A KR20110074514A (ko) 2011-06-30
KR101602982B1 true KR101602982B1 (ko) 2016-03-11

Family

ID=42073232

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020117006885A Expired - Fee Related KR101602982B1 (ko) 2008-09-30 2009-09-30 리드 프레임 기판과 그 제조 방법, 및 반도체 장치

Country Status (6)

Country Link
US (1) US8558363B2 (https=)
JP (1) JP5549066B2 (https=)
KR (1) KR101602982B1 (https=)
CN (1) CN102165585B (https=)
TW (1) TWI502711B (https=)
WO (1) WO2010038452A1 (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI427716B (zh) * 2010-06-04 2014-02-21 矽品精密工業股份有限公司 無載具之半導體封裝件及其製法
US8673689B2 (en) * 2011-01-28 2014-03-18 Marvell World Trade Ltd. Single layer BGA substrate process
CN102244060B (zh) * 2011-06-02 2013-09-25 日月光半导体制造股份有限公司 封装基板及其制造方法
US8916421B2 (en) * 2011-08-31 2014-12-23 Freescale Semiconductor, Inc. Semiconductor device packaging having pre-encapsulation through via formation using lead frames with attached signal conduits
US9142502B2 (en) * 2011-08-31 2015-09-22 Zhiwei Gong Semiconductor device packaging having pre-encapsulation through via formation using drop-in signal conduits
US8597983B2 (en) 2011-11-18 2013-12-03 Freescale Semiconductor, Inc. Semiconductor device packaging having substrate with pre-encapsulation through via formation
JP2014072242A (ja) * 2012-09-27 2014-04-21 Rohm Co Ltd チップ部品およびその製造方法
KR101505088B1 (ko) * 2013-10-22 2015-03-23 앰코 테크놀로지 코리아 주식회사 반도체 패키지와 리드프레임 패들 구조 및 방법
JP6266351B2 (ja) * 2014-01-08 2018-01-24 新日本無線株式会社 センサ装置およびその製造方法
JP7182374B2 (ja) * 2017-05-15 2022-12-02 新光電気工業株式会社 リードフレーム及びその製造方法
JP7039245B2 (ja) * 2017-10-18 2022-03-22 新光電気工業株式会社 リードフレーム及びその製造方法と電子部品装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003309242A (ja) * 2002-04-15 2003-10-31 Dainippon Printing Co Ltd リードフレーム部材とリードフレーム部材の製造方法、及び該リードフレーム部材を用いた半導体パッケージとその製造方法
JP2003309241A (ja) 2002-04-15 2003-10-31 Dainippon Printing Co Ltd リードフレーム部材とリードフレーム部材の製造方法、及び該リードフレーム部材を用いた半導体パッケージとその製造方法
JP2005175261A (ja) 2003-12-12 2005-06-30 Fujitsu Ten Ltd 基板の電子部品実装構造および方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09307043A (ja) * 1996-05-10 1997-11-28 Dainippon Printing Co Ltd リードフレーム部材とその製造方法、および該リードフレーム部材を用いた半導体装置
JP3642911B2 (ja) 1997-02-05 2005-04-27 大日本印刷株式会社 リードフレーム部材とその製造方法
US6281568B1 (en) * 1998-10-21 2001-08-28 Amkor Technology, Inc. Plastic integrated circuit device package and leadframe having partially undercut leads and die pad
JP3169919B2 (ja) * 1998-12-21 2001-05-28 九州日本電気株式会社 ボールグリッドアレイ型半導体装置及びその製造方法
MY133357A (en) * 1999-06-30 2007-11-30 Hitachi Ltd A semiconductor device and a method of manufacturing the same
KR100677651B1 (ko) * 2001-04-13 2007-02-01 야마하 가부시키가이샤 반도체 소자 및 패키지와 그 제조방법
WO2003007373A1 (en) * 2001-07-09 2003-01-23 Sumitomo Metal Mining Co., Ltd. Lead frame and its manufacturing method
KR100993277B1 (ko) * 2002-04-30 2010-11-10 르네사스 일렉트로닉스 가부시키가이샤 반도체장치 및 전자 장치
KR100993579B1 (ko) * 2002-04-30 2010-11-10 르네사스 일렉트로닉스 가부시키가이샤 반도체장치 및 전자 장치
US7196409B2 (en) * 2003-03-07 2007-03-27 Nxp B.V. Semiconductor device, semiconductor body and method of manufacturing thereof
JP2004349316A (ja) * 2003-05-20 2004-12-09 Renesas Technology Corp 半導体装置及びその製造方法
JP4349063B2 (ja) * 2003-10-08 2009-10-21 株式会社村田製作所 弾性表面波装置の製造方法
JP2005191240A (ja) * 2003-12-25 2005-07-14 Renesas Technology Corp 半導体装置及びその製造方法
JP4417150B2 (ja) * 2004-03-23 2010-02-17 株式会社ルネサステクノロジ 半導体装置
TWI262587B (en) * 2005-03-08 2006-09-21 Yi-Ling Jang Leadframe and the manufacturing method thereof
US7687893B2 (en) * 2006-12-27 2010-03-30 Amkor Technology, Inc. Semiconductor package having leadframe with exposed anchor pads
US8008784B2 (en) * 2008-10-02 2011-08-30 Advanced Semiconductor Engineering, Inc. Package including a lead frame, a chip and a sealant

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003309242A (ja) * 2002-04-15 2003-10-31 Dainippon Printing Co Ltd リードフレーム部材とリードフレーム部材の製造方法、及び該リードフレーム部材を用いた半導体パッケージとその製造方法
JP2003309241A (ja) 2002-04-15 2003-10-31 Dainippon Printing Co Ltd リードフレーム部材とリードフレーム部材の製造方法、及び該リードフレーム部材を用いた半導体パッケージとその製造方法
JP2005175261A (ja) 2003-12-12 2005-06-30 Fujitsu Ten Ltd 基板の電子部品実装構造および方法

Also Published As

Publication number Publication date
WO2010038452A1 (ja) 2010-04-08
JP2010087221A (ja) 2010-04-15
TW201021186A (en) 2010-06-01
KR20110074514A (ko) 2011-06-30
US20110163435A1 (en) 2011-07-07
JP5549066B2 (ja) 2014-07-16
US8558363B2 (en) 2013-10-15
CN102165585B (zh) 2014-03-26
CN102165585A (zh) 2011-08-24
TWI502711B (zh) 2015-10-01

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