KR101596227B1 - 반도체 장치 - Google Patents

반도체 장치 Download PDF

Info

Publication number
KR101596227B1
KR101596227B1 KR1020117009827A KR20117009827A KR101596227B1 KR 101596227 B1 KR101596227 B1 KR 101596227B1 KR 1020117009827 A KR1020117009827 A KR 1020117009827A KR 20117009827 A KR20117009827 A KR 20117009827A KR 101596227 B1 KR101596227 B1 KR 101596227B1
Authority
KR
South Korea
Prior art keywords
transistor
terminal
electrically connected
capacitor
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020117009827A
Other languages
English (en)
Korean (ko)
Other versions
KR20110084412A (ko
Inventor
다카노리 마츠쟈키
Original Assignee
가부시키가이샤 한도오따이 에네루기 켄큐쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 한도오따이 에네루기 켄큐쇼 filed Critical 가부시키가이샤 한도오따이 에네루기 켄큐쇼
Publication of KR20110084412A publication Critical patent/KR20110084412A/ko
Application granted granted Critical
Publication of KR101596227B1 publication Critical patent/KR101596227B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/401Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
    • G11C11/402Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells with charge regeneration individual to each memory cell, i.e. internal refresh
    • G11C11/4023Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells with charge regeneration individual to each memory cell, i.e. internal refresh using field effect transistors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B12/00Dynamic random access memory [DRAM] devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B12/00Dynamic random access memory [DRAM] devices
    • H10B12/01Manufacture or treatment
    • H10B12/09Manufacture or treatment with simultaneous manufacture of the peripheral circuit region and memory cells
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B99/00Subject matter not provided for in other groups of this subclass

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Memories (AREA)
  • Thin Film Transistor (AREA)
  • Dram (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Semiconductor Integrated Circuits (AREA)
KR1020117009827A 2008-10-02 2009-09-01 반도체 장치 Expired - Fee Related KR101596227B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2008-257339 2008-10-02
JP2008257339 2008-10-02

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020147024504A Division KR101596228B1 (ko) 2008-10-02 2009-09-01 반도체 장치

Publications (2)

Publication Number Publication Date
KR20110084412A KR20110084412A (ko) 2011-07-22
KR101596227B1 true KR101596227B1 (ko) 2016-02-22

Family

ID=42073354

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020117009827A Expired - Fee Related KR101596227B1 (ko) 2008-10-02 2009-09-01 반도체 장치
KR1020147024504A Expired - Fee Related KR101596228B1 (ko) 2008-10-02 2009-09-01 반도체 장치

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020147024504A Expired - Fee Related KR101596228B1 (ko) 2008-10-02 2009-09-01 반도체 장치

Country Status (6)

Country Link
US (2) US8199551B2 (enExample)
JP (2) JP5604071B2 (enExample)
KR (2) KR101596227B1 (enExample)
CN (1) CN102171812B (enExample)
TW (1) TWI501383B (enExample)
WO (1) WO2010038581A1 (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101596227B1 (ko) * 2008-10-02 2016-02-22 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
JP5470054B2 (ja) * 2009-01-22 2014-04-16 株式会社半導体エネルギー研究所 半導体装置
US8928466B2 (en) * 2010-08-04 2015-01-06 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP2012059958A (ja) * 2010-09-09 2012-03-22 Rohm Co Ltd 半導体装置およびその製造方法
US8659015B2 (en) * 2011-03-04 2014-02-25 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US8488387B2 (en) * 2011-05-02 2013-07-16 Macronix International Co., Ltd. Thermally assisted dielectric charge trapping flash
WO2014199507A1 (ja) * 2013-06-14 2014-12-18 ルネサスエレクトロニクス株式会社 通信制御装置及び実装基板
US9437752B2 (en) * 2014-03-12 2016-09-06 QuTel, Inc. Compact memory structure including tunneling diode
US9460788B2 (en) * 2014-07-09 2016-10-04 Crossbar, Inc. Non-volatile memory cell utilizing volatile switching two terminal device and a MOS transistor
US10263065B2 (en) * 2015-11-04 2019-04-16 Globalfoundries Inc. Metal resistor forming method using ion implantation
JP6789729B2 (ja) * 2016-08-31 2020-11-25 キヤノン株式会社 半導体装置、液体吐出ヘッド用基板、液体吐出ヘッド、及び液体吐出装置
US10217723B2 (en) 2016-10-07 2019-02-26 Mediatek Inc. Semiconductor package with improved bandwidth
US10685983B2 (en) 2016-11-11 2020-06-16 Semiconductor Energy Laboratory Co., Ltd. Transistor, semiconductor device, and electronic device
JP7090473B2 (ja) 2018-05-24 2022-06-24 ラピスセミコンダクタ株式会社 フラグ保持回路及びフラグ保持方法
JP7079661B2 (ja) 2018-05-24 2022-06-02 ラピスセミコンダクタ株式会社 フラグ保持回路及びフラグ保持方法
JP2025088973A (ja) * 2023-12-01 2025-06-12 東芝テック株式会社 無線タグ通信装置、無線タグ通信システム及びプログラム

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003526148A (ja) 2000-02-28 2003-09-02 マゼラン テクノロジー ピーティーワイ.エルティーディー. 無線周波数識別トランスポンダ

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2819520B2 (ja) 1991-05-07 1998-10-30 インターナショナル・ビジネス・マシーンズ・コーポレイション Dramセル
US7071910B1 (en) 1991-10-16 2006-07-04 Semiconductor Energy Laboratory Co., Ltd. Electrooptical device and method of driving and manufacturing the same
US7253440B1 (en) 1991-10-16 2007-08-07 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device having at least first and second thin film transistors
US6759680B1 (en) 1991-10-16 2004-07-06 Semiconductor Energy Laboratory Co., Ltd. Display device having thin film transistors
JP3448248B2 (ja) * 1991-10-16 2003-09-22 株式会社半導体エネルギー研究所 アクティブマトリクス型電気光学表示装置の駆動方法
JP2784615B2 (ja) 1991-10-16 1998-08-06 株式会社半導体エネルギー研究所 電気光学表示装置およびその駆動方法
JPH06310673A (ja) * 1993-04-27 1994-11-04 Toshiba Corp 半導体記憶装置
JP3397516B2 (ja) * 1995-06-08 2003-04-14 三菱電機株式会社 半導体記憶装置及び半導体集積回路装置
US5883829A (en) * 1997-06-27 1999-03-16 Texas Instruments Incorporated Memory cell having negative differential resistance devices
JP3770721B2 (ja) * 1998-01-13 2006-04-26 沖電気工業株式会社 キャパシタ寄生抵抗の測定方法、およびその評価方法
KR100298439B1 (ko) * 1998-06-30 2001-08-07 김영환 비휘발성 강유전체 메모리
DE19854418C2 (de) * 1998-11-25 2002-04-25 Infineon Technologies Ag Halbleiterbauelement mit zumindest einem Kondensator sowie Verfahren zu dessen Herstellung
US7259654B2 (en) 2000-02-28 2007-08-21 Magellan Technology Pty Limited Radio frequency identification transponder
US7248145B2 (en) 2000-02-28 2007-07-24 Magellan Technology Oty Limited Radio frequency identification transponder
JP2002093154A (ja) * 2000-09-11 2002-03-29 Oki Electric Ind Co Ltd 強誘電体メモリ
US6980459B2 (en) * 2002-10-24 2005-12-27 Texas Instruments Incorporated Non-volatile SRAM
US6955967B2 (en) * 2003-06-27 2005-10-18 Freescale Semiconductor, Inc. Non-volatile memory having a reference transistor and method for forming
US7130234B2 (en) * 2003-12-12 2006-10-31 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US7319633B2 (en) * 2003-12-19 2008-01-15 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US7082073B2 (en) * 2004-12-03 2006-07-25 Micron Technology, Inc. System and method for reducing power consumption during extended refresh periods of dynamic random access memory devices
KR101219068B1 (ko) * 2005-05-19 2013-01-18 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 이를 이용한 무선 통신 시스템
FR2891653A1 (fr) * 2005-10-05 2007-04-06 St Microelectronics Sa Procede d'ecriture par bloc dans une memoire
US7209384B1 (en) * 2005-12-08 2007-04-24 Juhan Kim Planar capacitor memory cell and its applications
KR101299932B1 (ko) * 2006-03-10 2013-08-27 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
EP1914669B1 (en) * 2006-10-18 2011-04-20 Semiconductor Energy Laboratory Co., Ltd. RFID tag
JP2008123074A (ja) 2006-11-09 2008-05-29 Renesas Technology Corp 半導体集積回路装置
JP5094099B2 (ja) * 2006-12-04 2012-12-12 株式会社半導体エネルギー研究所 半導体装置の作製方法
KR101596227B1 (ko) * 2008-10-02 2016-02-22 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
JP5470054B2 (ja) * 2009-01-22 2014-04-16 株式会社半導体エネルギー研究所 半導体装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003526148A (ja) 2000-02-28 2003-09-02 マゼラン テクノロジー ピーティーワイ.エルティーディー. 無線周波数識別トランスポンダ

Also Published As

Publication number Publication date
KR20140124811A (ko) 2014-10-27
JP5604071B2 (ja) 2014-10-08
JP2010109340A (ja) 2010-05-13
WO2010038581A1 (en) 2010-04-08
US8199551B2 (en) 2012-06-12
KR20110084412A (ko) 2011-07-22
KR101596228B1 (ko) 2016-02-22
JP5763817B2 (ja) 2015-08-12
TWI501383B (zh) 2015-09-21
US8842459B2 (en) 2014-09-23
CN102171812B (zh) 2014-02-12
TW201030943A (en) 2010-08-16
JP2015015484A (ja) 2015-01-22
US20100085792A1 (en) 2010-04-08
US20120236621A1 (en) 2012-09-20
CN102171812A (zh) 2011-08-31

Similar Documents

Publication Publication Date Title
KR101596227B1 (ko) 반도체 장치
US8513977B2 (en) Data holding circuit
JP5041984B2 (ja) 整流回路、電源回路及び半導体装置
US8181882B2 (en) Semiconductor device
KR101516660B1 (ko) 반도체장치
US8520457B2 (en) Semiconductor device
KR20080044763A (ko) 반도체 장치 및 반도체 장치의 제조방법
US8353460B2 (en) Reset signal generation circuit and semiconductor device

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A107 Divisional application of patent
E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0104 Divisional application for international application

St.27 status event code: A-0-1-A10-A18-div-PA0104

St.27 status event code: A-0-1-A10-A16-div-PA0104

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

FPAY Annual fee payment

Payment date: 20190116

Year of fee payment: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

FPAY Annual fee payment

Payment date: 20200115

Year of fee payment: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20220217

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20220217

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000