JP5604071B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP5604071B2
JP5604071B2 JP2009220009A JP2009220009A JP5604071B2 JP 5604071 B2 JP5604071 B2 JP 5604071B2 JP 2009220009 A JP2009220009 A JP 2009220009A JP 2009220009 A JP2009220009 A JP 2009220009A JP 5604071 B2 JP5604071 B2 JP 5604071B2
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JP
Japan
Prior art keywords
film
capacitor
terminal
voltage
transistor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2009220009A
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English (en)
Japanese (ja)
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JP2010109340A (ja
JP2010109340A5 (enExample
Inventor
隆徳 松嵜
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semiconductor Energy Laboratory Co Ltd
Original Assignee
Semiconductor Energy Laboratory Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semiconductor Energy Laboratory Co Ltd filed Critical Semiconductor Energy Laboratory Co Ltd
Priority to JP2009220009A priority Critical patent/JP5604071B2/ja
Publication of JP2010109340A publication Critical patent/JP2010109340A/ja
Publication of JP2010109340A5 publication Critical patent/JP2010109340A5/ja
Application granted granted Critical
Publication of JP5604071B2 publication Critical patent/JP5604071B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
    • G11C11/402—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells with charge regeneration individual to each memory cell, i.e. internal refresh
    • G11C11/4023—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells with charge regeneration individual to each memory cell, i.e. internal refresh using field effect transistors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H10B12/01—Manufacture or treatment
    • H10B12/09—Manufacture or treatment with simultaneous manufacture of the peripheral circuit region and memory cells
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B99/00—Subject matter not provided for in other groups of this subclass

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Memories (AREA)
  • Thin Film Transistor (AREA)
  • Dram (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Semiconductor Integrated Circuits (AREA)
JP2009220009A 2008-10-02 2009-09-25 半導体装置 Expired - Fee Related JP5604071B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009220009A JP5604071B2 (ja) 2008-10-02 2009-09-25 半導体装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008257339 2008-10-02
JP2008257339 2008-10-02
JP2009220009A JP5604071B2 (ja) 2008-10-02 2009-09-25 半導体装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2014168942A Division JP5763817B2 (ja) 2008-10-02 2014-08-22 半導体装置

Publications (3)

Publication Number Publication Date
JP2010109340A JP2010109340A (ja) 2010-05-13
JP2010109340A5 JP2010109340A5 (enExample) 2012-11-01
JP5604071B2 true JP5604071B2 (ja) 2014-10-08

Family

ID=42073354

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2009220009A Expired - Fee Related JP5604071B2 (ja) 2008-10-02 2009-09-25 半導体装置
JP2014168942A Expired - Fee Related JP5763817B2 (ja) 2008-10-02 2014-08-22 半導体装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2014168942A Expired - Fee Related JP5763817B2 (ja) 2008-10-02 2014-08-22 半導体装置

Country Status (6)

Country Link
US (2) US8199551B2 (enExample)
JP (2) JP5604071B2 (enExample)
KR (2) KR101596227B1 (enExample)
CN (1) CN102171812B (enExample)
TW (1) TWI501383B (enExample)
WO (1) WO2010038581A1 (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101596227B1 (ko) * 2008-10-02 2016-02-22 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
JP5470054B2 (ja) * 2009-01-22 2014-04-16 株式会社半導体エネルギー研究所 半導体装置
US8928466B2 (en) * 2010-08-04 2015-01-06 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP2012059958A (ja) * 2010-09-09 2012-03-22 Rohm Co Ltd 半導体装置およびその製造方法
US8659015B2 (en) * 2011-03-04 2014-02-25 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US8488387B2 (en) * 2011-05-02 2013-07-16 Macronix International Co., Ltd. Thermally assisted dielectric charge trapping flash
WO2014199507A1 (ja) * 2013-06-14 2014-12-18 ルネサスエレクトロニクス株式会社 通信制御装置及び実装基板
US9437752B2 (en) * 2014-03-12 2016-09-06 QuTel, Inc. Compact memory structure including tunneling diode
US9460788B2 (en) * 2014-07-09 2016-10-04 Crossbar, Inc. Non-volatile memory cell utilizing volatile switching two terminal device and a MOS transistor
US10263065B2 (en) * 2015-11-04 2019-04-16 Globalfoundries Inc. Metal resistor forming method using ion implantation
JP6789729B2 (ja) * 2016-08-31 2020-11-25 キヤノン株式会社 半導体装置、液体吐出ヘッド用基板、液体吐出ヘッド、及び液体吐出装置
US10217723B2 (en) 2016-10-07 2019-02-26 Mediatek Inc. Semiconductor package with improved bandwidth
US10685983B2 (en) 2016-11-11 2020-06-16 Semiconductor Energy Laboratory Co., Ltd. Transistor, semiconductor device, and electronic device
JP7090473B2 (ja) 2018-05-24 2022-06-24 ラピスセミコンダクタ株式会社 フラグ保持回路及びフラグ保持方法
JP7079661B2 (ja) 2018-05-24 2022-06-02 ラピスセミコンダクタ株式会社 フラグ保持回路及びフラグ保持方法
JP2025088973A (ja) * 2023-12-01 2025-06-12 東芝テック株式会社 無線タグ通信装置、無線タグ通信システム及びプログラム

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2819520B2 (ja) 1991-05-07 1998-10-30 インターナショナル・ビジネス・マシーンズ・コーポレイション Ｄｒａｍセル
US7071910B1 (en) 1991-10-16 2006-07-04 Semiconductor Energy Laboratory Co., Ltd. Electrooptical device and method of driving and manufacturing the same
US7253440B1 (en) 1991-10-16 2007-08-07 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device having at least first and second thin film transistors
US6759680B1 (en) 1991-10-16 2004-07-06 Semiconductor Energy Laboratory Co., Ltd. Display device having thin film transistors
JP3448248B2 (ja) * 1991-10-16 2003-09-22 株式会社半導体エネルギー研究所 アクティブマトリクス型電気光学表示装置の駆動方法
JP2784615B2 (ja) 1991-10-16 1998-08-06 株式会社半導体エネルギー研究所 電気光学表示装置およびその駆動方法
JPH06310673A (ja) * 1993-04-27 1994-11-04 Toshiba Corp 半導体記憶装置
JP3397516B2 (ja) * 1995-06-08 2003-04-14 三菱電機株式会社 半導体記憶装置及び半導体集積回路装置
US5883829A (en) * 1997-06-27 1999-03-16 Texas Instruments Incorporated Memory cell having negative differential resistance devices
JP3770721B2 (ja) * 1998-01-13 2006-04-26 沖電気工業株式会社 キャパシタ寄生抵抗の測定方法、およびその評価方法
KR100298439B1 (ko) * 1998-06-30 2001-08-07 김영환 비휘발성 강유전체 메모리
DE19854418C2 (de) * 1998-11-25 2002-04-25 Infineon Technologies Ag Halbleiterbauelement mit zumindest einem Kondensator sowie Verfahren zu dessen Herstellung
US7259654B2 (en) 2000-02-28 2007-08-21 Magellan Technology Pty Limited Radio frequency identification transponder
AUPQ589400A0 (en) 2000-02-28 2000-03-23 Magellan Technology Pty Limited Rfid transponders
US7248145B2 (en) 2000-02-28 2007-07-24 Magellan Technology Oty Limited Radio frequency identification transponder
JP2002093154A (ja) * 2000-09-11 2002-03-29 Oki Electric Ind Co Ltd 強誘電体メモリ
US6980459B2 (en) * 2002-10-24 2005-12-27 Texas Instruments Incorporated Non-volatile SRAM
US6955967B2 (en) * 2003-06-27 2005-10-18 Freescale Semiconductor, Inc. Non-volatile memory having a reference transistor and method for forming
US7130234B2 (en) * 2003-12-12 2006-10-31 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US7319633B2 (en) * 2003-12-19 2008-01-15 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US7082073B2 (en) * 2004-12-03 2006-07-25 Micron Technology, Inc. System and method for reducing power consumption during extended refresh periods of dynamic random access memory devices
KR101219068B1 (ko) * 2005-05-19 2013-01-18 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 이를 이용한 무선 통신 시스템
FR2891653A1 (fr) * 2005-10-05 2007-04-06 St Microelectronics Sa Procede d'ecriture par bloc dans une memoire
US7209384B1 (en) * 2005-12-08 2007-04-24 Juhan Kim Planar capacitor memory cell and its applications
KR101299932B1 (ko) * 2006-03-10 2013-08-27 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
EP1914669B1 (en) * 2006-10-18 2011-04-20 Semiconductor Energy Laboratory Co., Ltd. RFID tag
JP2008123074A (ja) 2006-11-09 2008-05-29 Renesas Technology Corp 半導体集積回路装置
JP5094099B2 (ja) * 2006-12-04 2012-12-12 株式会社半導体エネルギー研究所 半導体装置の作製方法
KR101596227B1 (ko) * 2008-10-02 2016-02-22 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
JP5470054B2 (ja) * 2009-01-22 2014-04-16 株式会社半導体エネルギー研究所 半導体装置

Also Published As

Publication number Publication date
KR20140124811A (ko) 2014-10-27
JP2010109340A (ja) 2010-05-13
WO2010038581A1 (en) 2010-04-08
US8199551B2 (en) 2012-06-12
KR20110084412A (ko) 2011-07-22
KR101596228B1 (ko) 2016-02-22
JP5763817B2 (ja) 2015-08-12
TWI501383B (zh) 2015-09-21
US8842459B2 (en) 2014-09-23
CN102171812B (zh) 2014-02-12
TW201030943A (en) 2010-08-16
JP2015015484A (ja) 2015-01-22
KR101596227B1 (ko) 2016-02-22
US20100085792A1 (en) 2010-04-08
US20120236621A1 (en) 2012-09-20
CN102171812A (zh) 2011-08-31

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