KR101487301B1 - 나노 임프린트 공정에서의 기판 정렬 시스템 및 방법 - Google Patents
나노 임프린트 공정에서의 기판 정렬 시스템 및 방법 Download PDFInfo
- Publication number
- KR101487301B1 KR101487301B1 KR1020107001240A KR20107001240A KR101487301B1 KR 101487301 B1 KR101487301 B1 KR 101487301B1 KR 1020107001240 A KR1020107001240 A KR 1020107001240A KR 20107001240 A KR20107001240 A KR 20107001240A KR 101487301 B1 KR101487301 B1 KR 101487301B1
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- template
- grating
- template mold
- imprinted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 149
- 238000000034 method Methods 0.000 title claims abstract description 33
- 230000008569 process Effects 0.000 title description 9
- 230000004044 response Effects 0.000 claims abstract description 8
- 238000001514 detection method Methods 0.000 claims description 23
- 238000012545 processing Methods 0.000 claims description 4
- 230000008859 change Effects 0.000 claims description 3
- 238000004886 process control Methods 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 abstract description 6
- 238000001459 lithography Methods 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 11
- 238000000059 patterning Methods 0.000 description 10
- 238000005259 measurement Methods 0.000 description 7
- 239000012530 fluid Substances 0.000 description 5
- 239000002861 polymer material Substances 0.000 description 5
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 238000001015 X-ray lithography Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 229920002313 fluoropolymer Polymers 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000002164 ion-beam lithography Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000000427 thin-film deposition Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0277—Electrolithographic processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7049—Technique, e.g. interferometric
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Crystallography & Structural Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Theoretical Computer Science (AREA)
- Mathematical Physics (AREA)
- Multimedia (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US95100207P | 2007-07-20 | 2007-07-20 | |
| US60/951,002 | 2007-07-20 | ||
| US12/175,258 US7837907B2 (en) | 2007-07-20 | 2008-07-17 | Alignment system and method for a substrate in a nano-imprint process |
| US12/175,258 | 2008-07-17 | ||
| PCT/US2008/008817 WO2009014655A1 (en) | 2007-07-20 | 2008-07-18 | Alignment system and method for a substrate in a nano-imprint process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20100050462A KR20100050462A (ko) | 2010-05-13 |
| KR101487301B1 true KR101487301B1 (ko) | 2015-01-28 |
Family
ID=40281655
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020107001240A Active KR101487301B1 (ko) | 2007-07-20 | 2008-07-18 | 나노 임프린트 공정에서의 기판 정렬 시스템 및 방법 |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US7837907B2 (enExample) |
| EP (1) | EP2171537B1 (enExample) |
| JP (1) | JP4791597B2 (enExample) |
| KR (1) | KR101487301B1 (enExample) |
| CN (1) | CN101772733B (enExample) |
| AT (1) | ATE556357T1 (enExample) |
| MY (1) | MY150368A (enExample) |
| WO (1) | WO2009014655A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102165655B1 (ko) | 2019-07-25 | 2020-10-14 | 서원대학교산학협력단 | 패턴필름의 제조방법 및 상기 제조방법으로 제조된 패턴필름 |
Families Citing this family (51)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7630067B2 (en) * | 2004-11-30 | 2009-12-08 | Molecular Imprints, Inc. | Interferometric analysis method for the manufacture of nano-scale devices |
| US20070231421A1 (en) * | 2006-04-03 | 2007-10-04 | Molecular Imprints, Inc. | Enhanced Multi Channel Alignment |
| US7943080B2 (en) * | 2005-12-23 | 2011-05-17 | Asml Netherlands B.V. | Alignment for imprint lithography |
| US8012395B2 (en) * | 2006-04-18 | 2011-09-06 | Molecular Imprints, Inc. | Template having alignment marks formed of contrast material |
| US9573319B2 (en) | 2007-02-06 | 2017-02-21 | Canon Kabushiki Kaisha | Imprinting method and process for producing a member in which a mold contacts a pattern forming layer |
| US8945444B2 (en) * | 2007-12-04 | 2015-02-03 | Canon Nanotechnologies, Inc. | High throughput imprint based on contact line motion tracking control |
| US20090147237A1 (en) * | 2007-12-05 | 2009-06-11 | Molecular Imprints, Inc. | Spatial Phase Feature Location |
| US20100079653A1 (en) * | 2008-09-26 | 2010-04-01 | Apple Inc. | Portable computing system with a secondary image output |
| US7881603B2 (en) | 2008-09-26 | 2011-02-01 | Apple Inc. | Dichroic aperture for electronic imaging device |
| US8610726B2 (en) * | 2008-09-26 | 2013-12-17 | Apple Inc. | Computer systems and methods with projected display |
| US20100092599A1 (en) * | 2008-10-10 | 2010-04-15 | Molecular Imprints, Inc. | Complementary Alignment Marks for Imprint Lithography |
| US8345242B2 (en) | 2008-10-28 | 2013-01-01 | Molecular Imprints, Inc. | Optical system for use in stage control |
| US8432548B2 (en) * | 2008-11-04 | 2013-04-30 | Molecular Imprints, Inc. | Alignment for edge field nano-imprinting |
| US8231821B2 (en) * | 2008-11-04 | 2012-07-31 | Molecular Imprints, Inc. | Substrate alignment |
| US8715515B2 (en) * | 2009-03-23 | 2014-05-06 | Intevac, Inc. | Process for optimization of island to trench ratio in patterned media |
| JP2010267357A (ja) * | 2009-05-18 | 2010-11-25 | Hitachi High-Technologies Corp | パターンドメディアの製造方法及び製造装置 |
| US9164375B2 (en) * | 2009-06-19 | 2015-10-20 | Canon Nanotechnologies, Inc. | Dual zone template chuck |
| TWI431668B (zh) * | 2009-06-24 | 2014-03-21 | Ulvac Inc | 真空成膜裝置及真空成膜裝置之擋板位置檢測方法 |
| US8380878B2 (en) | 2009-08-13 | 2013-02-19 | Cox Communications, Inc. | Side loading |
| KR101116321B1 (ko) * | 2009-08-21 | 2012-03-09 | 에이피시스템 주식회사 | 기판 정렬 방법 |
| NL2005259A (en) * | 2009-09-29 | 2011-03-30 | Asml Netherlands Bv | Imprint lithography. |
| JP5563319B2 (ja) * | 2010-01-19 | 2014-07-30 | キヤノン株式会社 | インプリント装置、および物品の製造方法 |
| KR101772993B1 (ko) | 2010-02-05 | 2017-08-31 | 캐논 나노테크놀로지즈 인코퍼레이티드 | 고 콘트라스트 정렬 마크를 갖는 주형 |
| US8452077B2 (en) * | 2010-02-17 | 2013-05-28 | Applied Materials, Inc. | Method for imaging workpiece surfaces at high robot transfer speeds with correction of motion-induced distortion |
| US8620064B2 (en) * | 2010-02-17 | 2013-12-31 | Applied Materials, Inc. | Method for imaging workpiece surfaces at high robot transfer speeds with reduction or prevention of motion-induced distortion |
| US8698889B2 (en) * | 2010-02-17 | 2014-04-15 | Applied Materials, Inc. | Metrology system for imaging workpiece surfaces at high robot transfer speeds |
| NL2005975A (en) | 2010-03-03 | 2011-09-06 | Asml Netherlands Bv | Imprint lithography. |
| JP5539011B2 (ja) | 2010-05-14 | 2014-07-02 | キヤノン株式会社 | インプリント装置、検出装置、位置合わせ装置、及び物品の製造方法 |
| US8538132B2 (en) * | 2010-09-24 | 2013-09-17 | Apple Inc. | Component concentricity |
| KR101861644B1 (ko) | 2010-09-24 | 2018-05-28 | 캐논 나노테크놀로지즈 인코퍼레이티드 | 다단계 임프린팅을 통한 고콘트라스트 정렬 마크 |
| JP5635870B2 (ja) | 2010-10-22 | 2014-12-03 | 新日本無線株式会社 | 反射型フォトセンサを用いた位置検出装置 |
| JP6306501B2 (ja) | 2011-04-25 | 2018-04-04 | キヤノン ナノテクノロジーズ,インコーポレーテッド | テンプレートおよびテンプレートを基板と位置合わせするための方法 |
| US8834146B2 (en) | 2012-10-24 | 2014-09-16 | Massachusetts Institute Of Technology | System for passive alignment of surfaces |
| US9377683B2 (en) | 2013-03-22 | 2016-06-28 | HGST Netherlands B.V. | Imprint template with optically-detectable alignment marks and method for making using block copolymers |
| JP5909210B2 (ja) | 2013-07-11 | 2016-04-26 | キヤノン株式会社 | インプリント装置及び物品の製造方法 |
| JP6395352B2 (ja) * | 2013-07-12 | 2018-09-26 | キヤノン株式会社 | インプリント装置およびインプリント方法、それを用いた物品の製造方法 |
| US9356061B2 (en) | 2013-08-05 | 2016-05-31 | Apple Inc. | Image sensor with buried light shield and vertical gate |
| JP6499898B2 (ja) | 2014-05-14 | 2019-04-10 | 株式会社ニューフレアテクノロジー | 検査方法、テンプレート基板およびフォーカスオフセット方法 |
| US9797846B2 (en) | 2015-04-17 | 2017-10-24 | Nuflare Technology, Inc. | Inspection method and template |
| SG10201603103UA (en) | 2015-04-30 | 2016-11-29 | Canon Kk | Imprint device, substrate conveying device, imprinting method, and method for manufacturing article |
| JP6583747B2 (ja) * | 2015-09-29 | 2019-10-02 | 大日本印刷株式会社 | インプリント用のモールドおよびその製造方法 |
| NL2018564A (en) | 2016-03-30 | 2017-10-05 | Asml Netherlands Bv | Substrate edge detection |
| AU2017315774B2 (en) * | 2016-08-26 | 2021-05-13 | Molecular Imprints, Inc. | Edge sealant confinement and halo reduction for optical devices |
| KR102426957B1 (ko) * | 2017-10-17 | 2022-08-01 | 캐논 가부시끼가이샤 | 임프린트 장치, 및 물품의 제조 방법 |
| WO2019241398A1 (en) | 2018-06-12 | 2019-12-19 | Wendong Xing | Edge sealant application for optical devices |
| EP3827303B1 (en) | 2018-07-23 | 2023-07-05 | Magic Leap, Inc. | Optical device venting gaps for edge sealant and lamination dam |
| JP2020035924A (ja) * | 2018-08-30 | 2020-03-05 | キオクシア株式会社 | 原版 |
| WO2020081672A1 (en) | 2018-10-16 | 2020-04-23 | Magic Leap, Inc. | Methods and apparatuses for casting polymer products |
| JP7337682B2 (ja) * | 2019-12-18 | 2023-09-04 | キヤノン株式会社 | インプリント装置、インプリント方法、及び物品の製造方法 |
| CN113119642B (zh) * | 2021-04-13 | 2022-07-01 | 北京黎马敦太平洋包装有限公司 | 一种压印工作站 |
| CN114326340B (zh) * | 2022-01-14 | 2024-04-02 | 苏州新维度微纳科技有限公司 | 纳米压印对准方法及系统 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6417922B1 (en) * | 1997-12-29 | 2002-07-09 | Asml Netherlands B.V. | Alignment device and lithographic apparatus comprising such a device |
| US6919152B2 (en) * | 2000-07-16 | 2005-07-19 | Board Of Regents, The University Of Texas System | High resolution overlay alignment systems for imprint lithography |
| US7027156B2 (en) * | 2002-08-01 | 2006-04-11 | Molecular Imprints, Inc. | Scatterometry alignment for imprint lithography |
| US20070002298A1 (en) | 2005-06-30 | 2007-01-04 | Asml Netherlands B.V. | Lithographic apparatus substrate alignment |
Family Cites Families (64)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4024944A (en) * | 1975-12-24 | 1977-05-24 | Texas Instruments Incorporated | Semiconductor slice prealignment system |
| NL7606548A (nl) * | 1976-06-17 | 1977-12-20 | Philips Nv | Werkwijze en inrichting voor het uitrichten van een i.c.-patroon ten opzichte van een halfgelei- dend substraat. |
| NL8600639A (nl) * | 1986-03-12 | 1987-10-01 | Asm Lithography Bv | Werkwijze voor het ten opzichte van elkaar uitrichten van een masker en een substraat en inrichting voor het uitvoeren van de werkwijze. |
| JPH08167559A (ja) * | 1994-12-15 | 1996-06-25 | Nikon Corp | アライメント方法及び装置 |
| US6034378A (en) * | 1995-02-01 | 2000-03-07 | Nikon Corporation | Method of detecting position of mark on substrate, position detection apparatus using this method, and exposure apparatus using this position detection apparatus |
| JPH09297408A (ja) * | 1996-05-08 | 1997-11-18 | Nikon Corp | プリアライメント装置 |
| JPH1186346A (ja) * | 1997-09-09 | 1999-03-30 | Sony Corp | 光ディスク、光ディスクの製造方法及び光ディスク原盤の製造方法 |
| JP2000323461A (ja) * | 1999-05-11 | 2000-11-24 | Nec Corp | 微細パターン形成装置、その製造方法、および形成方法 |
| US7432634B2 (en) * | 2000-10-27 | 2008-10-07 | Board Of Regents, University Of Texas System | Remote center compliant flexure device |
| US6873087B1 (en) * | 1999-10-29 | 2005-03-29 | Board Of Regents, The University Of Texas System | High precision orientation alignment and gap control stages for imprint lithography processes |
| TWI231405B (en) * | 1999-12-22 | 2005-04-21 | Asml Netherlands Bv | Lithographic projection apparatus, position detection device, and method of manufacturing a device using a lithographic projection apparatus |
| TWI282909B (en) * | 1999-12-23 | 2007-06-21 | Asml Netherlands Bv | Lithographic apparatus and a method for manufacturing a device |
| US6462818B1 (en) * | 2000-06-22 | 2002-10-08 | Kla-Tencor Corporation | Overlay alignment mark design |
| US6696220B2 (en) * | 2000-10-12 | 2004-02-24 | Board Of Regents, The University Of Texas System | Template for room temperature, low pressure micro-and nano-imprint lithography |
| KR20030040378A (ko) * | 2000-08-01 | 2003-05-22 | 보드 오브 리전츠, 더 유니버시티 오브 텍사스 시스템 | 임프린트 리소그래피를 위한 투명한 템플릿과 기판사이의고정확성 갭 및 방향설정 감지 방법 |
| WO2002017383A2 (en) * | 2000-08-21 | 2002-02-28 | Board Of Regents, The University Of Texas System | Flexure based translation stage |
| US6486954B1 (en) * | 2000-09-01 | 2002-11-26 | Kla-Tencor Technologies Corporation | Overlay alignment measurement mark |
| US7387508B2 (en) * | 2004-06-01 | 2008-06-17 | Molecular Imprints Inc. | Compliant device for nano-scale manufacturing |
| US20060005657A1 (en) * | 2004-06-01 | 2006-01-12 | Molecular Imprints, Inc. | Method and system to control movement of a body for nano-scale manufacturing |
| US20050274219A1 (en) * | 2004-06-01 | 2005-12-15 | Molecular Imprints, Inc. | Method and system to control movement of a body for nano-scale manufacturing |
| TW556296B (en) * | 2000-12-27 | 2003-10-01 | Koninkl Philips Electronics Nv | Method of measuring alignment of a substrate with respect to a reference alignment mark |
| US20050064344A1 (en) * | 2003-09-18 | 2005-03-24 | University Of Texas System Board Of Regents | Imprint lithography templates having alignment marks |
| US7077992B2 (en) * | 2002-07-11 | 2006-07-18 | Molecular Imprints, Inc. | Step and repeat imprint lithography processes |
| US6932934B2 (en) * | 2002-07-11 | 2005-08-23 | Molecular Imprints, Inc. | Formation of discontinuous films during an imprint lithography process |
| AU2003261317A1 (en) * | 2002-08-01 | 2004-02-23 | Molecular Imprints, Inc. | Scatterometry alignment for imprint lithography |
| US6916584B2 (en) * | 2002-08-01 | 2005-07-12 | Molecular Imprints, Inc. | Alignment methods for imprint lithography |
| US7070405B2 (en) * | 2002-08-01 | 2006-07-04 | Molecular Imprints, Inc. | Alignment systems for imprint lithography |
| US6936194B2 (en) * | 2002-09-05 | 2005-08-30 | Molecular Imprints, Inc. | Functional patterning material for imprint lithography processes |
| US20040065252A1 (en) * | 2002-10-04 | 2004-04-08 | Sreenivasan Sidlgata V. | Method of forming a layer on a substrate to facilitate fabrication of metrology standards |
| US8349241B2 (en) * | 2002-10-04 | 2013-01-08 | Molecular Imprints, Inc. | Method to arrange features on a substrate to replicate features having minimal dimensional variability |
| US6929762B2 (en) * | 2002-11-13 | 2005-08-16 | Molecular Imprints, Inc. | Method of reducing pattern distortions during imprint lithography processes |
| MY136129A (en) * | 2002-12-13 | 2008-08-29 | Molecular Imprints Inc | Magnification correction employing out-of-plane distortion of a substrate |
| US7179396B2 (en) * | 2003-03-25 | 2007-02-20 | Molecular Imprints, Inc. | Positive tone bi-layer imprint lithography method |
| US7396475B2 (en) * | 2003-04-25 | 2008-07-08 | Molecular Imprints, Inc. | Method of forming stepped structures employing imprint lithography |
| US6951173B1 (en) * | 2003-05-14 | 2005-10-04 | Molecular Imprints, Inc. | Assembly and method for transferring imprint lithography templates |
| US7150622B2 (en) * | 2003-07-09 | 2006-12-19 | Molecular Imprints, Inc. | Systems for magnification and distortion correction for imprint lithography processes |
| US7136150B2 (en) * | 2003-09-25 | 2006-11-14 | Molecular Imprints, Inc. | Imprint lithography template having opaque alignment marks |
| JP2005116978A (ja) * | 2003-10-10 | 2005-04-28 | Sumitomo Heavy Ind Ltd | ナノインプリント装置及び方法 |
| JP2005153091A (ja) * | 2003-11-27 | 2005-06-16 | Hitachi Ltd | 転写方法及び転写装置 |
| US20050275311A1 (en) * | 2004-06-01 | 2005-12-15 | Molecular Imprints, Inc. | Compliant device for nano-scale manufacturing |
| US7768624B2 (en) * | 2004-06-03 | 2010-08-03 | Board Of Regents, The University Of Texas System | Method for obtaining force combinations for template deformation using nullspace and methods optimization techniques |
| US20050270516A1 (en) * | 2004-06-03 | 2005-12-08 | Molecular Imprints, Inc. | System for magnification and distortion correction during nano-scale manufacturing |
| EP1774407B1 (en) * | 2004-06-03 | 2017-08-09 | Board of Regents, The University of Texas System | System and method for improvement of alignment and overlay for microlithography |
| JP2006013400A (ja) * | 2004-06-29 | 2006-01-12 | Canon Inc | 2つの対象物間の相対的位置ずれ検出方法及び装置 |
| JP4550504B2 (ja) * | 2004-07-22 | 2010-09-22 | 株式会社日立製作所 | 記録媒体の製造方法 |
| US7650481B2 (en) * | 2004-11-24 | 2010-01-19 | Qualcomm Incorporated | Dynamic control of memory access speed |
| US20070231421A1 (en) * | 2006-04-03 | 2007-10-04 | Molecular Imprints, Inc. | Enhanced Multi Channel Alignment |
| US7630067B2 (en) * | 2004-11-30 | 2009-12-08 | Molecular Imprints, Inc. | Interferometric analysis method for the manufacture of nano-scale devices |
| US7292326B2 (en) * | 2004-11-30 | 2007-11-06 | Molecular Imprints, Inc. | Interferometric analysis for the manufacture of nano-scale devices |
| JP5198071B2 (ja) * | 2004-12-01 | 2013-05-15 | モレキュラー・インプリンツ・インコーポレーテッド | インプリントリソグラフィ・プロセスにおける熱管理のための露光方法 |
| KR100647314B1 (ko) * | 2005-01-31 | 2006-11-23 | 삼성전자주식회사 | 나노 임프린트 리소그래피용 정렬시스템 및 이를 채용한임프린트 리소그래피 방법 |
| JP4290177B2 (ja) * | 2005-06-08 | 2009-07-01 | キヤノン株式会社 | モールド、アライメント方法、パターン形成装置、パターン転写装置、及びチップの製造方法 |
| US7342642B2 (en) * | 2005-06-20 | 2008-03-11 | Asml Netherlands B.V. | Pre-aligning a substrate in a lithographic apparatus, device manufacturing method, and device manufactured by the manufacturing method |
| JP4987012B2 (ja) * | 2005-12-08 | 2012-07-25 | モレキュラー・インプリンツ・インコーポレーテッド | 基板の両面パターニングする方法及びシステム |
| US7670530B2 (en) * | 2006-01-20 | 2010-03-02 | Molecular Imprints, Inc. | Patterning substrates employing multiple chucks |
| JP4735280B2 (ja) * | 2006-01-18 | 2011-07-27 | 株式会社日立製作所 | パターン形成方法 |
| JP4736821B2 (ja) * | 2006-01-24 | 2011-07-27 | 株式会社日立製作所 | パターン形成方法およびパターン形成装置 |
| US7802978B2 (en) * | 2006-04-03 | 2010-09-28 | Molecular Imprints, Inc. | Imprinting of partial fields at the edge of the wafer |
| JP5306989B2 (ja) * | 2006-04-03 | 2013-10-02 | モレキュラー・インプリンツ・インコーポレーテッド | 複数のフィールド及びアライメント・マークを有する基板を同時にパターニングする方法 |
| JP4185941B2 (ja) * | 2006-04-04 | 2008-11-26 | キヤノン株式会社 | ナノインプリント方法及びナノインプリント装置 |
| US7547398B2 (en) * | 2006-04-18 | 2009-06-16 | Molecular Imprints, Inc. | Self-aligned process for fabricating imprint templates containing variously etched features |
| JP4795300B2 (ja) * | 2006-04-18 | 2011-10-19 | キヤノン株式会社 | 位置合わせ方法、インプリント方法、位置合わせ装置、インプリント装置、及び位置計測方法 |
| JP4848832B2 (ja) * | 2006-05-09 | 2011-12-28 | 凸版印刷株式会社 | ナノインプリント装置及びナノインプリント方法 |
| JP2008276920A (ja) * | 2007-03-30 | 2008-11-13 | Pioneer Electronic Corp | インプリント装置およびインプリント方法 |
-
2008
- 2008-07-17 US US12/175,258 patent/US7837907B2/en active Active
- 2008-07-18 CN CN200880025065.4A patent/CN101772733B/zh active Active
- 2008-07-18 WO PCT/US2008/008817 patent/WO2009014655A1/en not_active Ceased
- 2008-07-18 JP JP2010517027A patent/JP4791597B2/ja active Active
- 2008-07-18 AT AT08794586T patent/ATE556357T1/de active
- 2008-07-18 KR KR1020107001240A patent/KR101487301B1/ko active Active
- 2008-07-18 MY MYPI2010000239A patent/MY150368A/en unknown
- 2008-07-18 EP EP08794586A patent/EP2171537B1/en active Active
-
2010
- 2010-10-18 US US12/906,742 patent/US8147731B2/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6417922B1 (en) * | 1997-12-29 | 2002-07-09 | Asml Netherlands B.V. | Alignment device and lithographic apparatus comprising such a device |
| US6919152B2 (en) * | 2000-07-16 | 2005-07-19 | Board Of Regents, The University Of Texas System | High resolution overlay alignment systems for imprint lithography |
| US7027156B2 (en) * | 2002-08-01 | 2006-04-11 | Molecular Imprints, Inc. | Scatterometry alignment for imprint lithography |
| US20070002298A1 (en) | 2005-06-30 | 2007-01-04 | Asml Netherlands B.V. | Lithographic apparatus substrate alignment |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102165655B1 (ko) | 2019-07-25 | 2020-10-14 | 서원대학교산학협력단 | 패턴필름의 제조방법 및 상기 제조방법으로 제조된 패턴필름 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20110026039A1 (en) | 2011-02-03 |
| EP2171537B1 (en) | 2012-05-02 |
| JP2010534406A (ja) | 2010-11-04 |
| ATE556357T1 (de) | 2012-05-15 |
| US7837907B2 (en) | 2010-11-23 |
| CN101772733B (zh) | 2013-09-18 |
| US20090026657A1 (en) | 2009-01-29 |
| WO2009014655A1 (en) | 2009-01-29 |
| MY150368A (en) | 2013-12-31 |
| EP2171537A4 (en) | 2010-08-04 |
| CN101772733A (zh) | 2010-07-07 |
| EP2171537A1 (en) | 2010-04-07 |
| KR20100050462A (ko) | 2010-05-13 |
| US8147731B2 (en) | 2012-04-03 |
| JP4791597B2 (ja) | 2011-10-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101487301B1 (ko) | 나노 임프린트 공정에서의 기판 정렬 시스템 및 방법 | |
| US7854867B2 (en) | Method for detecting a particle in a nanoimprint lithography system | |
| US8432548B2 (en) | Alignment for edge field nano-imprinting | |
| US7946029B2 (en) | Apparatus for aligning a first article relative to a second article | |
| US8241550B2 (en) | Imprint lithography | |
| US20110084417A1 (en) | Large area linear array nanoimprinting | |
| US11604409B2 (en) | Template replication | |
| KR20150036424A (ko) | 마크 및 그 형성 방법, 그리고 노광 장치 | |
| EP1526411A1 (en) | Apparatus and method for aligning surface | |
| CN100503265C (zh) | 模子、图案形成方法以及图案形成设备 | |
| EP1832933B1 (en) | Device manufacturing method and substrate processing apparatus, and substrate support structure | |
| US8231821B2 (en) | Substrate alignment | |
| TWI400479B (zh) | 供奈米壓印方法中之基材所用之配向系統及方法 | |
| US20240178042A1 (en) | Systems, devices, and methods for registering a superstrate of an imprint tool | |
| US12459255B2 (en) | Systems, devices, and methods for dispensing drops of fluid according to drop patterns | |
| CN119384642A (zh) | 校准方法和设备 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
Patent event date: 20100119 Patent event code: PA01051R01D Comment text: International Patent Application |
|
| PG1501 | Laying open of application | ||
| A201 | Request for examination | ||
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20130701 Comment text: Request for Examination of Application |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20140421 Patent event code: PE09021S01D |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 20141124 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 20150122 Patent event code: PR07011E01D |
|
| PR1002 | Payment of registration fee |
Payment date: 20150123 End annual number: 3 Start annual number: 1 |
|
| PG1601 | Publication of registration | ||
| FPAY | Annual fee payment |
Payment date: 20180118 Year of fee payment: 4 |
|
| PR1001 | Payment of annual fee |
Payment date: 20180118 Start annual number: 4 End annual number: 4 |
|
| FPAY | Annual fee payment |
Payment date: 20190103 Year of fee payment: 5 |
|
| PR1001 | Payment of annual fee |
Payment date: 20190103 Start annual number: 5 End annual number: 5 |
|
| FPAY | Annual fee payment |
Payment date: 20200103 Year of fee payment: 6 |
|
| PR1001 | Payment of annual fee |
Payment date: 20200103 Start annual number: 6 End annual number: 6 |
|
| PR1001 | Payment of annual fee |
Payment date: 20210108 Start annual number: 7 End annual number: 7 |
|
| PR1001 | Payment of annual fee |
Payment date: 20211215 Start annual number: 8 End annual number: 8 |
|
| PR1001 | Payment of annual fee |
Payment date: 20231227 Start annual number: 10 End annual number: 10 |
|
| PR1001 | Payment of annual fee |
Payment date: 20241224 Start annual number: 11 End annual number: 11 |