KR101417208B1 - 유로 전환 장치, 처리 장치, 유로 전환 방법, 처리 방법 및 기억 매체 - Google Patents

유로 전환 장치, 처리 장치, 유로 전환 방법, 처리 방법 및 기억 매체 Download PDF

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KR101417208B1
KR101417208B1 KR1020110040840A KR20110040840A KR101417208B1 KR 101417208 B1 KR101417208 B1 KR 101417208B1 KR 1020110040840 A KR1020110040840 A KR 1020110040840A KR 20110040840 A KR20110040840 A KR 20110040840A KR 101417208 B1 KR101417208 B1 KR 101417208B1
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flow path
processing
openings
outer cylinder
connection
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KR20110139096A (ko
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노부히로 오가타
슈이치 나가미네
겐지 기요타
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도쿄엘렉트론가부시키가이샤
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/0318—Processes
    • Y10T137/0324—With control of flow by a condition or characteristic of a fluid
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/8593—Systems
    • Y10T137/87571—Multiple inlet with single outlet
    • Y10T137/87676—With flow control
    • Y10T137/87684—Valve in each inlet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/8593—Systems
    • Y10T137/877—With flow control means for branched passages
    • Y10T137/87877—Single inlet with multiple distinctly valved outlets

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Multiple-Way Valves (AREA)
KR1020110040840A 2010-06-22 2011-04-29 유로 전환 장치, 처리 장치, 유로 전환 방법, 처리 방법 및 기억 매체 Active KR101417208B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010141921A JP5240245B2 (ja) 2010-06-22 2010-06-22 流路切替え装置、処理装置、流路切替え方法及び処理方法並びに記憶媒体
JPJP-P-2010-141921 2010-06-22

Publications (2)

Publication Number Publication Date
KR20110139096A KR20110139096A (ko) 2011-12-28
KR101417208B1 true KR101417208B1 (ko) 2014-07-08

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KR1020110040840A Active KR101417208B1 (ko) 2010-06-22 2011-04-29 유로 전환 장치, 처리 장치, 유로 전환 방법, 처리 방법 및 기억 매체

Country Status (5)

Country Link
US (1) US8840752B2 (enExample)
JP (1) JP5240245B2 (enExample)
KR (1) KR101417208B1 (enExample)
CN (1) CN102315142B (enExample)
TW (1) TWI487049B (enExample)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5240245B2 (ja) * 2010-06-22 2013-07-17 東京エレクトロン株式会社 流路切替え装置、処理装置、流路切替え方法及び処理方法並びに記憶媒体
JP2013011289A (ja) * 2011-06-28 2013-01-17 Tokyo Electron Ltd ゲートバルブ及びそれを用いた基板処理システム
JP6003716B2 (ja) * 2012-04-17 2016-10-05 株式会社デンソー 流路切替装置
CN103453215B (zh) * 2012-05-31 2016-04-27 英属开曼群岛商精曜有限公司 阀门总成以及阀门
JP6219848B2 (ja) * 2012-12-28 2017-10-25 株式会社Ｓｃｒｅｅｎホールディングス 処理装置とその排気切換装置並びに排気切換ユニットと切換弁ボックス
US9698029B2 (en) * 2014-02-19 2017-07-04 Lam Research Ag Method and apparatus for processing wafer-shaped articles
JP6482979B2 (ja) * 2015-07-29 2019-03-13 東京エレクトロン株式会社 液処理装置
TWI629116B (zh) * 2016-06-28 2018-07-11 荏原製作所股份有限公司 清洗裝置、具備該清洗裝置之鍍覆裝置、以及清洗方法
US10875061B2 (en) 2016-08-10 2020-12-29 Pat Technology Systems Inc. Fume extraction apparatus with movable extraction aperture
JP6990602B2 (ja) * 2018-02-27 2022-01-12 東京エレクトロン株式会社 基板処理装置、基板処理方法及びコンピュータ読み取り可能な記録媒体
JP7019184B2 (ja) * 2018-07-17 2022-02-15 スピードファム株式会社 処理液切換装置
JP7203545B2 (ja) * 2018-09-21 2023-01-13 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6611893B2 (ja) * 2018-11-01 2019-11-27 東京エレクトロン株式会社 基板液処理装置
CN209540113U (zh) * 2019-01-05 2019-10-25 宁波大叶园林工业股份有限公司 一种新型四通通水结构
JP7370277B2 (ja) * 2020-02-26 2023-10-27 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
TWI824716B (zh) * 2020-02-26 2023-12-01 日商斯庫林集團股份有限公司 基板處理裝置
CN113494680B (zh) * 2020-04-07 2023-05-12 添可智能科技有限公司 通路切换装置、液体供给系统和通路切换方法
CN116538437A (zh) * 2020-04-07 2023-08-04 添可智能科技有限公司 液体供给系统和残留液体清理方法
KR102855381B1 (ko) * 2022-12-12 2025-09-04 세메스 주식회사 기판 처리 장치 및 기판 처리 방법

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1012523A (ja) * 1996-06-21 1998-01-16 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2008034490A (ja) * 2006-07-26 2008-02-14 Tokyo Electron Ltd 液処理装置
JP2009252884A (ja) * 2008-04-03 2009-10-29 Tokyo Electron Ltd 圧力制御機構、基板処理装置、基板処理方法及び記憶媒体
US20100058841A1 (en) * 2007-05-15 2010-03-11 Ge Healthcare Bio-Sciences Ab Flow distributing valve

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DD206687A3 (de) * 1981-07-28 1984-02-01 Mikroelektronik Zt Forsch Tech Verfahren und vorrichtung zur gasfuehrung fuer lp cvd prozesse in einem rohrreaktor
JP3669897B2 (ja) * 1999-06-09 2005-07-13 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP3584185B2 (ja) * 1999-09-21 2004-11-04 エア・ウォーター株式会社 冷凍機およびこれに用いるロータリー弁
CN2541112Y (zh) 2002-05-29 2003-03-26 苏州精机机械工业有限公司 旋转式油位闸门
US8298338B2 (en) * 2007-12-26 2012-10-30 Samsung Electronics Co., Ltd. Chemical vapor deposition apparatus
JP5012651B2 (ja) * 2008-05-14 2012-08-29 東京エレクトロン株式会社 塗布装置、塗布方法、塗布、現像装置及び記憶媒体
JP5240245B2 (ja) * 2010-06-22 2013-07-17 東京エレクトロン株式会社 流路切替え装置、処理装置、流路切替え方法及び処理方法並びに記憶媒体

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1012523A (ja) * 1996-06-21 1998-01-16 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2008034490A (ja) * 2006-07-26 2008-02-14 Tokyo Electron Ltd 液処理装置
US20100058841A1 (en) * 2007-05-15 2010-03-11 Ge Healthcare Bio-Sciences Ab Flow distributing valve
JP2009252884A (ja) * 2008-04-03 2009-10-29 Tokyo Electron Ltd 圧力制御機構、基板処理装置、基板処理方法及び記憶媒体

Also Published As

Publication number Publication date
US8840752B2 (en) 2014-09-23
TW201214601A (en) 2012-04-01
CN102315142B (zh) 2015-03-18
TWI487049B (zh) 2015-06-01
JP2012009511A (ja) 2012-01-12
KR20110139096A (ko) 2011-12-28
CN102315142A (zh) 2012-01-11
JP5240245B2 (ja) 2013-07-17
US20110308626A1 (en) 2011-12-22

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