KR101396620B1 - 노광 방법, 노광 장치, 및 디바이스 제조 방법 - Google Patents

노광 방법, 노광 장치, 및 디바이스 제조 방법 Download PDF

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Publication number
KR101396620B1
KR101396620B1 KR1020077002004A KR20077002004A KR101396620B1 KR 101396620 B1 KR101396620 B1 KR 101396620B1 KR 1020077002004 A KR1020077002004 A KR 1020077002004A KR 20077002004 A KR20077002004 A KR 20077002004A KR 101396620 B1 KR101396620 B1 KR 101396620B1
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South Korea
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liquid
delete delete
measurement
exposure apparatus
wafer
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Expired - Fee Related
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Korean (ko)
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KR20070122442A (ko
Inventor
겐이치 시라이시
류이치 호시카
도모하루 후지와라
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가부시키가이샤 니콘
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605Workpiece metrology
    • G03F7/70608Monitoring the unpatterned workpiece, e.g. measuring thickness, reflectivity or effects of immersion liquid on resist
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • G03F7/2041Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216Mask projection systems
    • G03F7/70341Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858Environment aspects, e.g. pressure of beam-path gas, temperature
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7095Materials, e.g. materials for housing, stage or other support having particular properties, e.g. weight, strength, conductivity, thermal expansion coefficient

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020077002004A 2005-04-25 2006-04-21 노광 방법, 노광 장치, 및 디바이스 제조 방법 Expired - Fee Related KR101396620B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JPJP-P-2005-00127025 2005-04-25
JP2005127025 2005-04-25
JP2005238373 2005-08-19
JPJP-P-2005-00238373 2005-08-19
PCT/JP2006/308385 WO2006115186A1 (ja) 2005-04-25 2006-04-21 露光方法及び露光装置、並びにデバイス製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020137000873A Division KR101344142B1 (ko) 2005-04-25 2006-04-21 노광 방법, 노광 장치, 및 디바이스 제조 방법

Publications (2)

Publication Number Publication Date
KR20070122442A KR20070122442A (ko) 2007-12-31
KR101396620B1 true KR101396620B1 (ko) 2014-05-16

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KR1020077002004A Expired - Fee Related KR101396620B1 (ko) 2005-04-25 2006-04-21 노광 방법, 노광 장치, 및 디바이스 제조 방법
KR1020137000873A Expired - Fee Related KR101344142B1 (ko) 2005-04-25 2006-04-21 노광 방법, 노광 장치, 및 디바이스 제조 방법
KR1020137021972A Expired - Fee Related KR101466533B1 (ko) 2005-04-25 2006-04-21 노광 방법, 노광 장치 및 액체 공급 방법

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KR1020137000873A Expired - Fee Related KR101344142B1 (ko) 2005-04-25 2006-04-21 노광 방법, 노광 장치, 및 디바이스 제조 방법
KR1020137021972A Expired - Fee Related KR101466533B1 (ko) 2005-04-25 2006-04-21 노광 방법, 노광 장치 및 액체 공급 방법

Country Status (5)

Country Link
US (3) US8064039B2 (https=)
EP (1) EP1876635A4 (https=)
JP (5) JP5125505B2 (https=)
KR (3) KR101396620B1 (https=)
WO (1) WO2006115186A1 (https=)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3104396B1 (en) * 2003-06-13 2018-03-21 Nikon Corporation Exposure method, substrate stage, exposure apparatus, and device manufacturing method
US7528929B2 (en) * 2003-11-14 2009-05-05 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
KR101396620B1 (ko) * 2005-04-25 2014-05-16 가부시키가이샤 니콘 노광 방법, 노광 장치, 및 디바이스 제조 방법
US20070085989A1 (en) * 2005-06-21 2007-04-19 Nikon Corporation Exposure apparatus and exposure method, maintenance method, and device manufacturing method
JP2008042004A (ja) * 2006-08-08 2008-02-21 Tokyo Electron Ltd パターン形成方法およびパターン形成装置
NL1036009A1 (nl) * 2007-10-05 2009-04-07 Asml Netherlands Bv An Immersion Lithography Apparatus.
US8451425B2 (en) * 2007-12-28 2013-05-28 Nikon Corporation Exposure apparatus, exposure method, cleaning apparatus, and device manufacturing method
WO2010103822A1 (ja) 2009-03-10 2010-09-16 株式会社ニコン 露光装置、露光方法、及びデバイス製造方法
NL2004322A (en) * 2009-04-13 2010-10-14 Asml Netherlands Bv Cooling device, cooling arrangement and lithographic apparatus comprising a cooling arrangement.
NL2004242A (en) 2009-04-13 2010-10-14 Asml Netherlands Bv Detector module, cooling arrangement and lithographic apparatus comprising a detector module.
WO2011155529A1 (ja) * 2010-06-10 2011-12-15 株式会社ニコン 計測部材、ステージ装置、露光装置、露光方法、及びデバイス製造方法
NL2009899A (en) * 2011-12-20 2013-06-24 Asml Netherlands Bv A pump system, a carbon dioxide supply system, an extraction system, a lithographic apparatus and a device manufacturing method.
NL2010477A (en) * 2012-05-22 2013-11-25 Asml Netherlands Bv Sensor, lithographic apparatus and device manufacturing method.
JP6206945B2 (ja) * 2013-03-07 2017-10-04 株式会社ブイ・テクノロジー 走査露光装置及び走査露光方法
US10060475B2 (en) * 2014-12-24 2018-08-28 Teradyne, Inc. Braking system
JP6070784B2 (ja) * 2015-07-14 2017-02-01 株式会社ニコン 液体供給装置、露光装置、液体供給方法、及びデバイス製造方法
JP6811337B2 (ja) * 2017-10-13 2021-01-13 富士フイルム株式会社 透過フィルター及び液浸露光装置
US10652441B1 (en) * 2019-05-10 2020-05-12 The Boeing Company Systems and methods for protecting imaging devices against high-radiant-flux light
WO2021094057A1 (en) * 2019-11-14 2021-05-20 Asml Netherlands B.V. Substrate support, lithographic apparatus, method for manipulating charge distribution and method for preparing a substrate

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0143944B1 (ko) * 1993-04-09 1998-08-01 아끼라 아베 고 비저항액체의 정전기 제거방법 및 장치
WO1999049504A1 (fr) * 1998-03-26 1999-09-30 Nikon Corporation Procede et systeme d'exposition par projection
JP2004111473A (ja) * 2002-09-13 2004-04-08 Nikon Corp 位置検出方法及び装置、露光方法及び装置

Family Cites Families (78)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4346164A (en) 1980-10-06 1982-08-24 Werner Tabarelli Photolithographic method for the manufacture of integrated circuits
JPS57117238A (en) 1981-01-14 1982-07-21 Nippon Kogaku Kk <Nikon> Exposing and baking device for manufacturing integrated circuit with illuminometer
JPS57153433A (en) 1981-03-18 1982-09-22 Hitachi Ltd Manufacturing device for semiconductor
JPS58202448A (ja) 1982-05-21 1983-11-25 Hitachi Ltd 露光装置
JPS5919912A (ja) 1982-07-26 1984-02-01 Hitachi Ltd 液浸距離保持装置
DD221563A1 (de) 1983-09-14 1985-04-24 Mikroelektronik Zt Forsch Tech Immersionsobjektiv fuer die schrittweise projektionsabbildung einer maskenstruktur
DD224448A1 (de) 1984-03-01 1985-07-03 Zeiss Jena Veb Carl Einrichtung zur fotolithografischen strukturuebertragung
JPS6265326A (ja) 1985-09-18 1987-03-24 Hitachi Ltd 露光装置
JPS63157419A (ja) 1986-12-22 1988-06-30 Toshiba Corp 微細パタ−ン転写装置
JP2897355B2 (ja) 1990-07-05 1999-05-31 株式会社ニコン アライメント方法,露光装置,並びに位置検出方法及び装置
US5175124A (en) * 1991-03-25 1992-12-29 Motorola, Inc. Process for fabricating a semiconductor device using re-ionized rinse water
JPH04305915A (ja) 1991-04-02 1992-10-28 Nikon Corp 密着型露光装置
JPH04305917A (ja) 1991-04-02 1992-10-28 Nikon Corp 密着型露光装置
US5243195A (en) 1991-04-25 1993-09-07 Nikon Corporation Projection exposure apparatus having an off-axis alignment system and method of alignment therefor
JPH0562877A (ja) 1991-09-02 1993-03-12 Yasuko Shinohara 光によるlsi製造縮小投影露光装置の光学系
JPH06124873A (ja) 1992-10-09 1994-05-06 Canon Inc 液浸式投影露光装置
JP2753930B2 (ja) * 1992-11-27 1998-05-20 キヤノン株式会社 液浸式投影露光装置
KR100300618B1 (ko) 1992-12-25 2001-11-22 오노 시게오 노광방법,노광장치,및그장치를사용하는디바이스제조방법
JP3412704B2 (ja) 1993-02-26 2003-06-03 株式会社ニコン 投影露光方法及び装置、並びに露光装置
JP3301153B2 (ja) 1993-04-06 2002-07-15 株式会社ニコン 投影露光装置、露光方法、及び素子製造方法
JPH07220990A (ja) 1994-01-28 1995-08-18 Hitachi Ltd パターン形成方法及びその露光装置
JPH08316125A (ja) 1995-05-19 1996-11-29 Hitachi Ltd 投影露光方法及び露光装置
JPH08316124A (ja) 1995-05-19 1996-11-29 Hitachi Ltd 投影露光方法及び露光装置
US5825043A (en) 1996-10-07 1998-10-20 Nikon Precision Inc. Focusing and tilting adjustment system for lithography aligner, manufacturing apparatus or inspection apparatus
EP1944654A3 (en) 1996-11-28 2010-06-02 Nikon Corporation An exposure apparatus and an exposure method
WO1998028665A1 (en) 1996-12-24 1998-07-02 Koninklijke Philips Electronics N.V. Two-dimensionally balanced positioning device with two object holders, and lithographic device provided with such a positioning device
JPH10202242A (ja) * 1997-01-23 1998-08-04 Ngk Insulators Ltd 超純水の比抵抗調整方法
JP3747566B2 (ja) 1997-04-23 2006-02-22 株式会社ニコン 液浸型露光装置
JP3817836B2 (ja) 1997-06-10 2006-09-06 株式会社ニコン 露光装置及びその製造方法並びに露光方法及びデバイス製造方法
JPH11176727A (ja) 1997-12-11 1999-07-02 Nikon Corp 投影露光装置
US6897963B1 (en) 1997-12-18 2005-05-24 Nikon Corporation Stage device and exposure apparatus
EP1079223A4 (en) 1998-05-19 2002-11-27 Nikon Corp INSTRUMENT AND METHOD FOR MEASURING ABERATIONS, PROJECTION DEVICE INCLUDING THIS INSTRUMENT AND ITS MANUFACTURING METHOD
JP2000058436A (ja) 1998-08-11 2000-02-25 Nikon Corp 投影露光装置及び露光方法
JP2001188356A (ja) * 1999-12-28 2001-07-10 Asahi Kasei Corp 感光性エラストマー組成物の現像剤及びそれを用いた製版方法
US20020041377A1 (en) 2000-04-25 2002-04-11 Nikon Corporation Aerial image measurement method and unit, optical properties measurement method and unit, adjustment method of projection optical system, exposure method and apparatus, making method of exposure apparatus, and device manufacturing method
WO2002091078A1 (en) * 2001-05-07 2002-11-14 Massachusetts Institute Of Technology Methods and apparatus employing an index matching medium
TW529172B (en) 2001-07-24 2003-04-21 Asml Netherlands Bv Imaging apparatus
US6828542B2 (en) * 2002-06-07 2004-12-07 Brion Technologies, Inc. System and method for lithography process monitoring and control
US7033602B1 (en) * 2002-06-21 2006-04-25 Advanced Cardiovascular Systems, Inc. Polycationic peptide coatings and methods of coating implantable medical devices
KR20050035890A (ko) 2002-08-23 2005-04-19 가부시키가이샤 니콘 투영 광학계, 포토리소그래피 방법, 노광 장치 및 그 이용방법
SG121819A1 (en) 2002-11-12 2006-05-26 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
SG135052A1 (en) 2002-11-12 2007-09-28 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
CN101470360B (zh) 2002-11-12 2013-07-24 Asml荷兰有限公司 光刻装置和器件制造方法
KR101643112B1 (ko) 2003-02-26 2016-07-26 가부시키가이샤 니콘 노광 장치, 노광 방법 및 디바이스 제조 방법
SG141426A1 (en) 2003-04-10 2008-04-28 Nikon Corp Environmental system including vacuum scavange for an immersion lithography apparatus
TWI295414B (en) 2003-05-13 2008-04-01 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
TW201515064A (zh) * 2003-05-23 2015-04-16 尼康股份有限公司 曝光方法及曝光裝置以及元件製造方法
US7317504B2 (en) 2004-04-08 2008-01-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
EP1486827B1 (en) 2003-06-11 2011-11-02 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
EP3104396B1 (en) 2003-06-13 2018-03-21 Nikon Corporation Exposure method, substrate stage, exposure apparatus, and device manufacturing method
EP2843472B1 (en) 2003-07-08 2016-12-07 Nikon Corporation Wafer table for immersion lithography
EP1646074A4 (en) * 2003-07-09 2007-10-03 Nikon Corp EXPOSURE DEVICE AND METHOD FOR MANUFACTURING COMPONENTS
US7779781B2 (en) 2003-07-31 2010-08-24 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7070915B2 (en) 2003-08-29 2006-07-04 Tokyo Electron Limited Method and system for drying a substrate
JP3870182B2 (ja) * 2003-09-09 2007-01-17 キヤノン株式会社 露光装置及びデバイス製造方法
JP4438748B2 (ja) 2003-09-29 2010-03-24 株式会社ニコン 投影露光装置、投影露光方法およびデバイス製造方法
JP2005136374A (ja) * 2003-10-06 2005-05-26 Matsushita Electric Ind Co Ltd 半導体製造装置及びそれを用いたパターン形成方法
EP3370115A1 (en) 2003-12-03 2018-09-05 Nikon Corporation Exposure apparatus, exposure method and method for producing a device
JP4323946B2 (ja) 2003-12-19 2009-09-02 キヤノン株式会社 露光装置
JP4018647B2 (ja) * 2004-02-09 2007-12-05 キヤノン株式会社 投影露光装置およびデバイス製造方法
JP4385821B2 (ja) 2004-03-30 2009-12-16 トヨタ自動車株式会社 車両搭載作動装置の制御装置および波動強度特性取得装置
JP3981368B2 (ja) 2004-05-17 2007-09-26 松下電器産業株式会社 パターン形成方法
CN100594430C (zh) * 2004-06-04 2010-03-17 卡尔蔡司Smt股份公司 用于测量光学成像系统的图像质量的系统
KR101421915B1 (ko) * 2004-06-09 2014-07-22 가부시키가이샤 니콘 노광 장치 및 디바이스 제조 방법
JP2006019585A (ja) * 2004-07-02 2006-01-19 Advanced Lcd Technologies Development Center Co Ltd 露光装置およびその方法ならびに基板処理装置
JP4551704B2 (ja) * 2004-07-08 2010-09-29 富士フイルム株式会社 液浸露光用保護膜形成組成物及びそれを用いたパターン形成方法
JP2006024819A (ja) * 2004-07-09 2006-01-26 Renesas Technology Corp 液浸露光装置、及び電子デバイスの製造方法
US7026441B2 (en) * 2004-08-12 2006-04-11 Intel Corporation Thermoresponsive sensor comprising a polymer solution
US7041989B1 (en) * 2004-10-22 2006-05-09 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7623218B2 (en) * 2004-11-24 2009-11-24 Carl Zeiss Smt Ag Method of manufacturing a miniaturized device
JP2006173340A (ja) * 2004-12-15 2006-06-29 Jsr Corp 露光装置、及び露光方法
US7528931B2 (en) * 2004-12-20 2009-05-05 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP4488890B2 (ja) * 2004-12-27 2010-06-23 株式会社東芝 レジストパターン形成方法及び半導体装置の製造方法
US7450217B2 (en) * 2005-01-12 2008-11-11 Asml Netherlands B.V. Exposure apparatus, coatings for exposure apparatus, lithographic apparatus, device manufacturing method, and device manufactured thereby
JP5162254B2 (ja) * 2005-02-10 2013-03-13 エーエスエムエル ネザーランズ ビー.ブイ. 液浸リソグラフィシステム及びデバイス製造方法
CN100425330C (zh) * 2005-03-31 2008-10-15 鸿富锦精密工业(深圳)有限公司 光催化增强装置
KR101396620B1 (ko) * 2005-04-25 2014-05-16 가부시키가이샤 니콘 노광 방법, 노광 장치, 및 디바이스 제조 방법
US7420188B2 (en) * 2005-10-14 2008-09-02 Taiwan Semiconductor Manufacturing Company, Ltd. Exposure method and apparatus for immersion lithography

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0143944B1 (ko) * 1993-04-09 1998-08-01 아끼라 아베 고 비저항액체의 정전기 제거방법 및 장치
WO1999049504A1 (fr) * 1998-03-26 1999-09-30 Nikon Corporation Procede et systeme d'exposition par projection
JP2004111473A (ja) * 2002-09-13 2004-04-08 Nikon Corp 位置検出方法及び装置、露光方法及び装置

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US20120044469A1 (en) 2012-02-23
KR20070122442A (ko) 2007-12-31
JP2010245572A (ja) 2010-10-28
JP2014057103A (ja) 2014-03-27
JP5594653B2 (ja) 2014-09-24
KR101344142B1 (ko) 2013-12-23
US9335639B2 (en) 2016-05-10
JP2012129557A (ja) 2012-07-05
JP6249179B2 (ja) 2017-12-20
WO2006115186A1 (ja) 2006-11-02
US20070139632A1 (en) 2007-06-21
KR20130105922A (ko) 2013-09-26
EP1876635A4 (en) 2010-06-30
US20160246184A1 (en) 2016-08-25
KR20130012035A (ko) 2013-01-30
KR101466533B1 (ko) 2014-11-27
JP5594646B2 (ja) 2014-09-24
JPWO2006115186A1 (ja) 2008-12-18
JP5125505B2 (ja) 2013-01-23
JP2015146043A (ja) 2015-08-13
JP5831825B2 (ja) 2015-12-09
US9618854B2 (en) 2017-04-11
EP1876635A1 (en) 2008-01-09

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