KR101311652B1 - 전자 디바이스의 제조 방법 및 이것에 이용하는 박리 장치 - Google Patents

전자 디바이스의 제조 방법 및 이것에 이용하는 박리 장치 Download PDF

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KR101311652B1
KR101311652B1 KR1020117007425A KR20117007425A KR101311652B1 KR 101311652 B1 KR101311652 B1 KR 101311652B1 KR 1020117007425 A KR1020117007425 A KR 1020117007425A KR 20117007425 A KR20117007425 A KR 20117007425A KR 101311652 B1 KR101311652 B1 KR 101311652B1
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South Korea
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peeling
knife
support
substrate
resin layer
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KR1020117007425A
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Korean (ko)
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KR20110063800A (ko
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겐이찌 에바따
사또시 곤도
야스노리 이또
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아사히 가라스 가부시키가이샤
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2301/00—Handling processes for sheets or webs
    • B65H2301/50—Auxiliary process performed during handling process
    • B65H2301/51—Modifying a characteristic of handled material
    • B65H2301/511—Processing surface of handled material upon transport or guiding thereof, e.g. cleaning
    • B65H2301/5112—Processing surface of handled material upon transport or guiding thereof, e.g. cleaning removing material from outer surface
    • B65H2301/51122—Processing surface of handled material upon transport or guiding thereof, e.g. cleaning removing material from outer surface peeling layer of material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/70—Testing, e.g. accelerated lifetime tests
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mathematical Physics (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Liquid Crystal (AREA)
  • Electroluminescent Light Sources (AREA)
KR1020117007425A 2009-02-06 2010-01-29 전자 디바이스의 제조 방법 및 이것에 이용하는 박리 장치 KR101311652B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JPJP-P-2009-026196 2009-02-06
JP2009026196 2009-02-06
JPJP-P-2009-198992 2009-08-28
JP2009198992 2009-08-28
PCT/JP2010/051281 WO2010090147A1 (ja) 2009-02-06 2010-01-29 電子デバイスの製造方法およびこれに用いる剥離装置

Publications (2)

Publication Number Publication Date
KR20110063800A KR20110063800A (ko) 2011-06-14
KR101311652B1 true KR101311652B1 (ko) 2013-09-25

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KR1020117007425A KR101311652B1 (ko) 2009-02-06 2010-01-29 전자 디바이스의 제조 방법 및 이것에 이용하는 박리 장치

Country Status (5)

Country Link
JP (1) JP5360073B2 (zh)
KR (1) KR101311652B1 (zh)
CN (1) CN102171745B (zh)
TW (1) TWI417939B (zh)
WO (1) WO2010090147A1 (zh)

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JP2014157167A (ja) * 2011-05-18 2014-08-28 Asahi Glass Co Ltd 積層基板の剥離方法
JP2013055307A (ja) * 2011-09-06 2013-03-21 Asahi Glass Co Ltd 剥離装置、及び電子デバイスの製造方法
JP5807554B2 (ja) * 2012-01-19 2015-11-10 旭硝子株式会社 剥離装置、及び電子デバイスの製造方法
KR101941448B1 (ko) * 2012-02-29 2019-01-23 엘지디스플레이 주식회사 경량 박형의 액정표시장치 제조방법
KR101935780B1 (ko) * 2012-06-01 2019-01-07 엘지디스플레이 주식회사 액정표시장치 제조라인
KR101970553B1 (ko) * 2012-05-23 2019-08-13 엘지디스플레이 주식회사 경량 박형의 액정표시장치 제조방법
KR101992907B1 (ko) * 2012-12-26 2019-09-30 엘지전자 주식회사 갭 형성 유닛을 구비한 탈착기 및 이를 이용한 경량 박형의 액정표시장치 제조방법
TW201446497A (zh) * 2013-02-26 2014-12-16 Nippon Electric Glass Co 電子裝置的製造方法
KR102082271B1 (ko) * 2013-05-24 2020-04-16 엘지디스플레이 주식회사 캐리어기판 분리 시스템 및 분리 방법
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KR102028913B1 (ko) * 2013-05-31 2019-11-08 엘지디스플레이 주식회사 기판 탈착 장치 및 이를 이용한 평판표시장치의 제조방법
WO2015002030A1 (ja) * 2013-07-01 2015-01-08 旭硝子株式会社 剥離起点作成装置及び方法
CN107731716A (zh) * 2013-08-30 2018-02-23 株式会社半导体能源研究所 叠层体的加工装置及加工方法
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KR20150058610A (ko) 2013-11-18 2015-05-29 삼성디스플레이 주식회사 액정 표시 패널의 제조 방법 및 이를 위한 제조 장치
JP6223795B2 (ja) * 2013-11-28 2017-11-01 日東電工株式会社 板の剥離方法
JP6176591B2 (ja) 2013-12-25 2017-08-09 旭硝子株式会社 吸着層付き基板の梱包方法及び梱包体並びに吸着層付き基板の梱包装置
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KR102064405B1 (ko) 2014-02-04 2020-01-10 삼성디스플레이 주식회사 기판 박리 장치 및 그것을 이용한 기판 박리 방법
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KR102165162B1 (ko) * 2014-03-12 2020-10-14 삼성디스플레이 주식회사 기판 박리 장치 및 이를 이용한 소자 제조 방법
JP6548871B2 (ja) * 2014-05-03 2019-07-24 株式会社半導体エネルギー研究所 積層体の基板剥離装置
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JP6519951B2 (ja) * 2015-07-24 2019-05-29 日本電気硝子株式会社 ガラスフィルムの製造方法、及びガラスフィルムを含む電子デバイスの製造方法
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CN107686007B (zh) * 2017-08-16 2019-08-20 武汉华星光电半导体显示技术有限公司 玻璃基板分离方法及玻璃基板分离装置
US10374161B2 (en) 2017-08-16 2019-08-06 Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Glass substrate separation method and glass substrate separation device
WO2019053802A1 (ja) * 2017-09-13 2019-03-21 シャープ株式会社 表示デバイスの製造方法
CN110890306A (zh) * 2018-09-10 2020-03-17 山东浪潮华光光电子股份有限公司 一种简便的半导体器件用衬底减薄后的下片方法
CN109926914A (zh) * 2019-04-24 2019-06-25 蚌埠中光电科技有限公司 一种浮法tft-lcd玻璃面研磨剥片装置
CN112520418B (zh) * 2020-12-15 2022-06-24 深圳南玻应用技术有限公司 一种玻璃取片装置及方法
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CN117246621B (zh) * 2023-11-10 2024-01-23 四川英创力电子科技股份有限公司 一种高效剥离电路板镀金层表面保护胶带的装置及方法

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Publication number Priority date Publication date Assignee Title
JPH10244545A (ja) * 1997-03-04 1998-09-14 Canon Inc 離型方法及び離型装置
JP2004142878A (ja) * 2002-10-24 2004-05-20 Toray Ind Inc 可撓性フィルムの剥離方法および剥離装置並びに回路基板
KR20050092131A (ko) * 2003-01-23 2005-09-20 도레이 가부시끼가이샤 회로기판용 부재, 회로기판의 제조방법 및 회로기판의제조장치
JP2004260146A (ja) * 2003-02-04 2004-09-16 Toray Ind Inc 回路基板の製造方法および製造装置

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TWI417939B (zh) 2013-12-01
CN102171745A (zh) 2011-08-31
TW201039375A (en) 2010-11-01
JPWO2010090147A1 (ja) 2012-08-09
KR20110063800A (ko) 2011-06-14
WO2010090147A1 (ja) 2010-08-12
CN102171745B (zh) 2014-10-08
JP5360073B2 (ja) 2013-12-04

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