KR101295215B1 - 진동편, 진동자, 발진기 및, 전자 기기 - Google Patents

진동편, 진동자, 발진기 및, 전자 기기 Download PDF

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Publication number
KR101295215B1
KR101295215B1 KR20110074841A KR20110074841A KR101295215B1 KR 101295215 B1 KR101295215 B1 KR 101295215B1 KR 20110074841 A KR20110074841 A KR 20110074841A KR 20110074841 A KR20110074841 A KR 20110074841A KR 101295215 B1 KR101295215 B1 KR 101295215B1
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KR
South Korea
Prior art keywords
vibration
metal layer
arm
electrode
piezoelectric layer
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Expired - Fee Related
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KR20110074841A
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English (en)
Korean (ko)
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KR20120022581A (ko
Inventor
테루오 타키자와
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세이코 엡슨 가부시키가이샤
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Publication of KR20120022581A publication Critical patent/KR20120022581A/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/88—Mounts; Supports; Enclosures; Casings
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
    • H03H9/0552—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement the device and the other elements being mounted on opposite sides of a common substrate
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
    • H03B5/00—Generation of oscillations using amplifier with regenerative feedback from output to input
    • H03B5/30—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator
    • H03B5/32—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
    • H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/21—Crystal tuning forks
    • H03H9/215—Crystal tuning forks consisting of quartz
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making

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  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
KR20110074841A 2010-07-29 2011-07-28 진동편, 진동자, 발진기 및, 전자 기기 Expired - Fee Related KR101295215B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010170556A JP5622173B2 (ja) 2010-07-29 2010-07-29 振動片、振動子、発振器、および電子機器
JPJP-P-2010-170556 2010-07-29

Publications (2)

Publication Number Publication Date
KR20120022581A KR20120022581A (ko) 2012-03-12
KR101295215B1 true KR101295215B1 (ko) 2013-08-08

Family

ID=45526127

Family Applications (1)

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KR20110074841A Expired - Fee Related KR101295215B1 (ko) 2010-07-29 2011-07-28 진동편, 진동자, 발진기 및, 전자 기기

Country Status (5)

Country Link
US (2) US8416027B2 (enExample)
JP (1) JP5622173B2 (enExample)
KR (1) KR101295215B1 (enExample)
CN (1) CN102347741B (enExample)
TW (1) TWI491173B (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5622173B2 (ja) * 2010-07-29 2014-11-12 セイコーエプソン株式会社 振動片、振動子、発振器、および電子機器
JP2012060355A (ja) * 2010-09-08 2012-03-22 Seiko Epson Corp 振動片、振動子、振動デバイスおよび電子機器
FR2976370A1 (fr) 2011-06-07 2012-12-14 St Microelectronics Grenoble 2 Procede de controle d'un objet destine a etre tenu a la main a l'aide d'un retour haptique
US9201528B2 (en) * 2011-06-07 2015-12-01 Stmicroelectronics Sa Method of manufacturing a vibratory actuator for a touch panel with haptic feedback
JP2013055400A (ja) * 2011-09-01 2013-03-21 Seiko Instruments Inc 圧電振動デバイス及び発振器
JPWO2013168478A1 (ja) 2012-05-07 2016-01-07 京セラ株式会社 圧電振動素子ならびにそれを用いた圧電振動装置および携帯端末
JP2014165573A (ja) * 2013-02-22 2014-09-08 Seiko Epson Corp 振動片、振動子、電子デバイス、電子機器、および移動体
CN105429607B (zh) * 2014-09-16 2020-12-29 精工爱普生株式会社 振动装置、电子设备以及移动体
JP6723526B2 (ja) * 2016-05-25 2020-07-15 株式会社村田製作所 共振子及び共振装置
KR102066960B1 (ko) * 2016-08-03 2020-01-16 삼성전기주식회사 박막 벌크 음향 공진기 및 이를 포함하는 필터
US10410744B2 (en) * 2017-01-20 2019-09-10 Novartis Ag System and method of printing machine-readable information usable in a medical procedure
JP6439808B2 (ja) * 2017-01-31 2018-12-19 株式会社大真空 音叉型振動子
JP2019012873A (ja) * 2017-06-29 2019-01-24 セイコーエプソン株式会社 振動デバイス、電子機器及び移動体
FR3095542B1 (fr) * 2019-04-26 2023-12-01 Hap2U Dispositif à retour haptique pourvu de raidisseurs
WO2021117272A1 (ja) * 2019-12-09 2021-06-17 株式会社村田製作所 共振装置及びその製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003092796A (ja) 2001-09-18 2003-03-28 Ueda Japan Radio Co Ltd 湾曲面を有する超音波振動子
JP2004208130A (ja) 2002-12-26 2004-07-22 Taiheiyo Cement Corp 圧電トランスデューサ
JP2004209733A (ja) 2002-12-27 2004-07-29 Canon Inc インクジェットヘッドの製造方法
JP2009005022A (ja) 2007-06-20 2009-01-08 Seiko Epson Corp 音叉型振動子、発振器

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JP2625511B2 (ja) 1988-07-21 1997-07-02 株式会社クボタ 穀粒選別装置用穀粒分布検出装置
JP2003177238A (ja) * 2001-12-10 2003-06-27 Fujikura Ltd 誘電体多層膜フィルタとその製造方法
US6900708B2 (en) * 2002-06-26 2005-05-31 Georgia Tech Research Corporation Integrated passive devices fabricated utilizing multi-layer, organic laminates
EP1536559A1 (fr) * 2003-11-25 2005-06-01 ETA SA Manufacture Horlogère Suisse Composant électronique ayant un élément résonateur dans un boitier hermetiquement fermé
US7372346B2 (en) * 2003-12-24 2008-05-13 Interuniversitair Microelektronica Centrum (Imec) Acoustic resonator
JP2005331485A (ja) 2004-05-21 2005-12-02 Sony Corp 圧電素子および電気機械変換装置
JP5067034B2 (ja) 2007-06-20 2012-11-07 セイコーエプソン株式会社 音叉型振動子、発振器
JP5067035B2 (ja) 2007-06-20 2012-11-07 セイコーエプソン株式会社 音叉型振動子、発振器
JP5391395B2 (ja) * 2007-10-15 2014-01-15 日立金属株式会社 圧電薄膜付き基板及び圧電素子
JP5071058B2 (ja) * 2007-11-07 2012-11-14 セイコーエプソン株式会社 圧電振動片
JP4533934B2 (ja) * 2008-01-15 2010-09-01 エプソントヨコム株式会社 振動片及び振動子の製造方法
JP2011049665A (ja) * 2009-08-25 2011-03-10 Seiko Instruments Inc 圧電振動子、圧電振動子の製造方法、発振器、電子機器および電波時計
JP5622173B2 (ja) * 2010-07-29 2014-11-12 セイコーエプソン株式会社 振動片、振動子、発振器、および電子機器

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003092796A (ja) 2001-09-18 2003-03-28 Ueda Japan Radio Co Ltd 湾曲面を有する超音波振動子
JP2004208130A (ja) 2002-12-26 2004-07-22 Taiheiyo Cement Corp 圧電トランスデューサ
JP2004209733A (ja) 2002-12-27 2004-07-29 Canon Inc インクジェットヘッドの製造方法
JP2009005022A (ja) 2007-06-20 2009-01-08 Seiko Epson Corp 音叉型振動子、発振器

Also Published As

Publication number Publication date
JP5622173B2 (ja) 2014-11-12
CN102347741A (zh) 2012-02-08
TWI491173B (zh) 2015-07-01
TW201214963A (en) 2012-04-01
US8416027B2 (en) 2013-04-09
CN102347741B (zh) 2016-03-09
US9059393B2 (en) 2015-06-16
KR20120022581A (ko) 2012-03-12
US20120025923A1 (en) 2012-02-02
JP2012034093A (ja) 2012-02-16
US20130194049A1 (en) 2013-08-01

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