TWI491173B - 振動片、振動器、振盪器、及電子機器 - Google Patents
振動片、振動器、振盪器、及電子機器 Download PDFInfo
- Publication number
- TWI491173B TWI491173B TW100126461A TW100126461A TWI491173B TW I491173 B TWI491173 B TW I491173B TW 100126461 A TW100126461 A TW 100126461A TW 100126461 A TW100126461 A TW 100126461A TW I491173 B TWI491173 B TW I491173B
- Authority
- TW
- Taiwan
- Prior art keywords
- vibrating
- vibrating piece
- metal layer
- vibrating arm
- layer
- Prior art date
Links
- 239000002184 metal Substances 0.000 claims description 46
- 229910052751 metal Inorganic materials 0.000 claims description 46
- 238000004519 manufacturing process Methods 0.000 claims description 18
- 238000005452 bending Methods 0.000 claims description 10
- 239000002585 base Substances 0.000 description 45
- 239000000758 substrate Substances 0.000 description 24
- 230000005284 excitation Effects 0.000 description 20
- 238000000605 extraction Methods 0.000 description 17
- 230000015572 biosynthetic process Effects 0.000 description 14
- 239000013078 crystal Substances 0.000 description 14
- 238000004544 sputter deposition Methods 0.000 description 10
- 238000000034 method Methods 0.000 description 8
- 239000010931 gold Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 238000005530 etching Methods 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 239000000470 constituent Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000012212 insulator Substances 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000001755 magnetron sputter deposition Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- 229910013641 LiNbO 3 Inorganic materials 0.000 description 1
- 235000014676 Phragmites communis Nutrition 0.000 description 1
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- CRUVUWATNULHFA-UHFFFAOYSA-M tetramethylphosphanium;hydroxide Chemical compound [OH-].C[P+](C)(C)C CRUVUWATNULHFA-UHFFFAOYSA-M 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/88—Mounts; Supports; Enclosures; Casings
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
- H03H9/0552—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement the device and the other elements being mounted on opposite sides of a common substrate
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
- H03B5/00—Generation of oscillations using amplifier with regenerative feedback from output to input
- H03B5/30—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator
- H03B5/32—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
- H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/21—Crystal tuning forks
- H03H9/215—Crystal tuning forks consisting of quartz
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010170556A JP5622173B2 (ja) | 2010-07-29 | 2010-07-29 | 振動片、振動子、発振器、および電子機器 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201214963A TW201214963A (en) | 2012-04-01 |
| TWI491173B true TWI491173B (zh) | 2015-07-01 |
Family
ID=45526127
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100126461A TWI491173B (zh) | 2010-07-29 | 2011-07-26 | 振動片、振動器、振盪器、及電子機器 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US8416027B2 (enExample) |
| JP (1) | JP5622173B2 (enExample) |
| KR (1) | KR101295215B1 (enExample) |
| CN (1) | CN102347741B (enExample) |
| TW (1) | TWI491173B (enExample) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5622173B2 (ja) * | 2010-07-29 | 2014-11-12 | セイコーエプソン株式会社 | 振動片、振動子、発振器、および電子機器 |
| JP2012060355A (ja) * | 2010-09-08 | 2012-03-22 | Seiko Epson Corp | 振動片、振動子、振動デバイスおよび電子機器 |
| FR2976370A1 (fr) | 2011-06-07 | 2012-12-14 | St Microelectronics Grenoble 2 | Procede de controle d'un objet destine a etre tenu a la main a l'aide d'un retour haptique |
| US9201528B2 (en) * | 2011-06-07 | 2015-12-01 | Stmicroelectronics Sa | Method of manufacturing a vibratory actuator for a touch panel with haptic feedback |
| JP2013055400A (ja) * | 2011-09-01 | 2013-03-21 | Seiko Instruments Inc | 圧電振動デバイス及び発振器 |
| JPWO2013168478A1 (ja) | 2012-05-07 | 2016-01-07 | 京セラ株式会社 | 圧電振動素子ならびにそれを用いた圧電振動装置および携帯端末 |
| JP2014165573A (ja) * | 2013-02-22 | 2014-09-08 | Seiko Epson Corp | 振動片、振動子、電子デバイス、電子機器、および移動体 |
| CN105429607B (zh) * | 2014-09-16 | 2020-12-29 | 精工爱普生株式会社 | 振动装置、电子设备以及移动体 |
| JP6723526B2 (ja) * | 2016-05-25 | 2020-07-15 | 株式会社村田製作所 | 共振子及び共振装置 |
| KR102066960B1 (ko) * | 2016-08-03 | 2020-01-16 | 삼성전기주식회사 | 박막 벌크 음향 공진기 및 이를 포함하는 필터 |
| US10410744B2 (en) * | 2017-01-20 | 2019-09-10 | Novartis Ag | System and method of printing machine-readable information usable in a medical procedure |
| JP6439808B2 (ja) * | 2017-01-31 | 2018-12-19 | 株式会社大真空 | 音叉型振動子 |
| JP2019012873A (ja) * | 2017-06-29 | 2019-01-24 | セイコーエプソン株式会社 | 振動デバイス、電子機器及び移動体 |
| FR3095542B1 (fr) * | 2019-04-26 | 2023-12-01 | Hap2U | Dispositif à retour haptique pourvu de raidisseurs |
| WO2021117272A1 (ja) * | 2019-12-09 | 2021-06-17 | 株式会社村田製作所 | 共振装置及びその製造方法 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040000968A1 (en) * | 2002-06-26 | 2004-01-01 | White George E. | Integrated passive devices fabricated utilizing multi-layer, organic laminates |
| US20050146401A1 (en) * | 2003-12-24 | 2005-07-07 | Interuniversitair Microelektronica Centrum (Imec Vzw) | Acoustic resonator |
| TW200529554A (en) * | 2003-11-25 | 2005-09-01 | Eta Sa Mft Horlogere Suisse | Electronic component having a resonator element arranged in a hermetically closed housing and method for manufacturing such an electronic component |
| JP2009005024A (ja) * | 2007-06-20 | 2009-01-08 | Seiko Epson Corp | 音叉型振動子、発振器 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2625511B2 (ja) | 1988-07-21 | 1997-07-02 | 株式会社クボタ | 穀粒選別装置用穀粒分布検出装置 |
| JP2003092796A (ja) | 2001-09-18 | 2003-03-28 | Ueda Japan Radio Co Ltd | 湾曲面を有する超音波振動子 |
| JP2003177238A (ja) * | 2001-12-10 | 2003-06-27 | Fujikura Ltd | 誘電体多層膜フィルタとその製造方法 |
| JP3587519B2 (ja) | 2002-12-26 | 2004-11-10 | 太平洋セメント株式会社 | 圧電トランスデューサ |
| JP2004209733A (ja) | 2002-12-27 | 2004-07-29 | Canon Inc | インクジェットヘッドの製造方法 |
| JP2005331485A (ja) | 2004-05-21 | 2005-12-02 | Sony Corp | 圧電素子および電気機械変換装置 |
| JP5067034B2 (ja) | 2007-06-20 | 2012-11-07 | セイコーエプソン株式会社 | 音叉型振動子、発振器 |
| JP5067033B2 (ja) * | 2007-06-20 | 2012-11-07 | セイコーエプソン株式会社 | 音叉型振動子、発振器 |
| JP5391395B2 (ja) * | 2007-10-15 | 2014-01-15 | 日立金属株式会社 | 圧電薄膜付き基板及び圧電素子 |
| JP5071058B2 (ja) * | 2007-11-07 | 2012-11-14 | セイコーエプソン株式会社 | 圧電振動片 |
| JP4533934B2 (ja) * | 2008-01-15 | 2010-09-01 | エプソントヨコム株式会社 | 振動片及び振動子の製造方法 |
| JP2011049665A (ja) * | 2009-08-25 | 2011-03-10 | Seiko Instruments Inc | 圧電振動子、圧電振動子の製造方法、発振器、電子機器および電波時計 |
| JP5622173B2 (ja) * | 2010-07-29 | 2014-11-12 | セイコーエプソン株式会社 | 振動片、振動子、発振器、および電子機器 |
-
2010
- 2010-07-29 JP JP2010170556A patent/JP5622173B2/ja not_active Expired - Fee Related
-
2011
- 2011-06-13 US US13/158,662 patent/US8416027B2/en not_active Expired - Fee Related
- 2011-07-25 CN CN201110209309.8A patent/CN102347741B/zh not_active Expired - Fee Related
- 2011-07-26 TW TW100126461A patent/TWI491173B/zh not_active IP Right Cessation
- 2011-07-28 KR KR20110074841A patent/KR101295215B1/ko not_active Expired - Fee Related
-
2013
- 2013-03-08 US US13/789,893 patent/US9059393B2/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040000968A1 (en) * | 2002-06-26 | 2004-01-01 | White George E. | Integrated passive devices fabricated utilizing multi-layer, organic laminates |
| TW200529554A (en) * | 2003-11-25 | 2005-09-01 | Eta Sa Mft Horlogere Suisse | Electronic component having a resonator element arranged in a hermetically closed housing and method for manufacturing such an electronic component |
| US20050146401A1 (en) * | 2003-12-24 | 2005-07-07 | Interuniversitair Microelektronica Centrum (Imec Vzw) | Acoustic resonator |
| JP2009005024A (ja) * | 2007-06-20 | 2009-01-08 | Seiko Epson Corp | 音叉型振動子、発振器 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5622173B2 (ja) | 2014-11-12 |
| CN102347741A (zh) | 2012-02-08 |
| KR101295215B1 (ko) | 2013-08-08 |
| TW201214963A (en) | 2012-04-01 |
| US8416027B2 (en) | 2013-04-09 |
| CN102347741B (zh) | 2016-03-09 |
| US9059393B2 (en) | 2015-06-16 |
| KR20120022581A (ko) | 2012-03-12 |
| US20120025923A1 (en) | 2012-02-02 |
| JP2012034093A (ja) | 2012-02-16 |
| US20130194049A1 (en) | 2013-08-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |