JP5622173B2 - 振動片、振動子、発振器、および電子機器 - Google Patents

振動片、振動子、発振器、および電子機器 Download PDF

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Publication number
JP5622173B2
JP5622173B2 JP2010170556A JP2010170556A JP5622173B2 JP 5622173 B2 JP5622173 B2 JP 5622173B2 JP 2010170556 A JP2010170556 A JP 2010170556A JP 2010170556 A JP2010170556 A JP 2010170556A JP 5622173 B2 JP5622173 B2 JP 5622173B2
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JP
Japan
Prior art keywords
vibrating arm
metal layer
vibrating
resonator element
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2010170556A
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English (en)
Japanese (ja)
Other versions
JP2012034093A5 (enExample
JP2012034093A (ja
Inventor
照夫 瀧澤
照夫 瀧澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP2010170556A priority Critical patent/JP5622173B2/ja
Priority to US13/158,662 priority patent/US8416027B2/en
Priority to CN201110209309.8A priority patent/CN102347741B/zh
Priority to TW100126461A priority patent/TWI491173B/zh
Priority to KR20110074841A priority patent/KR101295215B1/ko
Publication of JP2012034093A publication Critical patent/JP2012034093A/ja
Priority to US13/789,893 priority patent/US9059393B2/en
Publication of JP2012034093A5 publication Critical patent/JP2012034093A5/ja
Application granted granted Critical
Publication of JP5622173B2 publication Critical patent/JP5622173B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/88—Mounts; Supports; Enclosures; Casings
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
    • H03H9/0552—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement the device and the other elements being mounted on opposite sides of a common substrate
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
    • H03B5/00—Generation of oscillations using amplifier with regenerative feedback from output to input
    • H03B5/30—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator
    • H03B5/32—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
    • H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/21—Crystal tuning forks
    • H03H9/215—Crystal tuning forks consisting of quartz
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making

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  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP2010170556A 2010-07-29 2010-07-29 振動片、振動子、発振器、および電子機器 Expired - Fee Related JP5622173B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2010170556A JP5622173B2 (ja) 2010-07-29 2010-07-29 振動片、振動子、発振器、および電子機器
US13/158,662 US8416027B2 (en) 2010-07-29 2011-06-13 Vibrator element, vibrator, oscillator, and electronic device
CN201110209309.8A CN102347741B (zh) 2010-07-29 2011-07-25 振动片、振子、振荡器以及电子设备
TW100126461A TWI491173B (zh) 2010-07-29 2011-07-26 振動片、振動器、振盪器、及電子機器
KR20110074841A KR101295215B1 (ko) 2010-07-29 2011-07-28 진동편, 진동자, 발진기 및, 전자 기기
US13/789,893 US9059393B2 (en) 2010-07-29 2013-03-08 Vibrator element, vibrator, oscillator, and electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010170556A JP5622173B2 (ja) 2010-07-29 2010-07-29 振動片、振動子、発振器、および電子機器

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2014198827A Division JP5822186B2 (ja) 2014-09-29 2014-09-29 振動子、発振器、および電子機器

Publications (3)

Publication Number Publication Date
JP2012034093A JP2012034093A (ja) 2012-02-16
JP2012034093A5 JP2012034093A5 (enExample) 2013-07-04
JP5622173B2 true JP5622173B2 (ja) 2014-11-12

Family

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JP2010170556A Expired - Fee Related JP5622173B2 (ja) 2010-07-29 2010-07-29 振動片、振動子、発振器、および電子機器

Country Status (5)

Country Link
US (2) US8416027B2 (enExample)
JP (1) JP5622173B2 (enExample)
KR (1) KR101295215B1 (enExample)
CN (1) CN102347741B (enExample)
TW (1) TWI491173B (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5622173B2 (ja) * 2010-07-29 2014-11-12 セイコーエプソン株式会社 振動片、振動子、発振器、および電子機器
JP2012060355A (ja) * 2010-09-08 2012-03-22 Seiko Epson Corp 振動片、振動子、振動デバイスおよび電子機器
FR2976370A1 (fr) 2011-06-07 2012-12-14 St Microelectronics Grenoble 2 Procede de controle d'un objet destine a etre tenu a la main a l'aide d'un retour haptique
US9201528B2 (en) * 2011-06-07 2015-12-01 Stmicroelectronics Sa Method of manufacturing a vibratory actuator for a touch panel with haptic feedback
JP2013055400A (ja) * 2011-09-01 2013-03-21 Seiko Instruments Inc 圧電振動デバイス及び発振器
JPWO2013168478A1 (ja) 2012-05-07 2016-01-07 京セラ株式会社 圧電振動素子ならびにそれを用いた圧電振動装置および携帯端末
JP2014165573A (ja) * 2013-02-22 2014-09-08 Seiko Epson Corp 振動片、振動子、電子デバイス、電子機器、および移動体
CN105429607B (zh) * 2014-09-16 2020-12-29 精工爱普生株式会社 振动装置、电子设备以及移动体
JP6723526B2 (ja) * 2016-05-25 2020-07-15 株式会社村田製作所 共振子及び共振装置
KR102066960B1 (ko) * 2016-08-03 2020-01-16 삼성전기주식회사 박막 벌크 음향 공진기 및 이를 포함하는 필터
US10410744B2 (en) * 2017-01-20 2019-09-10 Novartis Ag System and method of printing machine-readable information usable in a medical procedure
JP6439808B2 (ja) * 2017-01-31 2018-12-19 株式会社大真空 音叉型振動子
JP2019012873A (ja) * 2017-06-29 2019-01-24 セイコーエプソン株式会社 振動デバイス、電子機器及び移動体
FR3095542B1 (fr) * 2019-04-26 2023-12-01 Hap2U Dispositif à retour haptique pourvu de raidisseurs
WO2021117272A1 (ja) * 2019-12-09 2021-06-17 株式会社村田製作所 共振装置及びその製造方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2625511B2 (ja) 1988-07-21 1997-07-02 株式会社クボタ 穀粒選別装置用穀粒分布検出装置
JP2003092796A (ja) 2001-09-18 2003-03-28 Ueda Japan Radio Co Ltd 湾曲面を有する超音波振動子
JP2003177238A (ja) * 2001-12-10 2003-06-27 Fujikura Ltd 誘電体多層膜フィルタとその製造方法
US6900708B2 (en) * 2002-06-26 2005-05-31 Georgia Tech Research Corporation Integrated passive devices fabricated utilizing multi-layer, organic laminates
JP3587519B2 (ja) 2002-12-26 2004-11-10 太平洋セメント株式会社 圧電トランスデューサ
JP2004209733A (ja) 2002-12-27 2004-07-29 Canon Inc インクジェットヘッドの製造方法
EP1536559A1 (fr) * 2003-11-25 2005-06-01 ETA SA Manufacture Horlogère Suisse Composant électronique ayant un élément résonateur dans un boitier hermetiquement fermé
US7372346B2 (en) * 2003-12-24 2008-05-13 Interuniversitair Microelektronica Centrum (Imec) Acoustic resonator
JP2005331485A (ja) 2004-05-21 2005-12-02 Sony Corp 圧電素子および電気機械変換装置
JP5067034B2 (ja) 2007-06-20 2012-11-07 セイコーエプソン株式会社 音叉型振動子、発振器
JP5067035B2 (ja) 2007-06-20 2012-11-07 セイコーエプソン株式会社 音叉型振動子、発振器
JP5067033B2 (ja) * 2007-06-20 2012-11-07 セイコーエプソン株式会社 音叉型振動子、発振器
JP5391395B2 (ja) * 2007-10-15 2014-01-15 日立金属株式会社 圧電薄膜付き基板及び圧電素子
JP5071058B2 (ja) * 2007-11-07 2012-11-14 セイコーエプソン株式会社 圧電振動片
JP4533934B2 (ja) * 2008-01-15 2010-09-01 エプソントヨコム株式会社 振動片及び振動子の製造方法
JP2011049665A (ja) * 2009-08-25 2011-03-10 Seiko Instruments Inc 圧電振動子、圧電振動子の製造方法、発振器、電子機器および電波時計
JP5622173B2 (ja) * 2010-07-29 2014-11-12 セイコーエプソン株式会社 振動片、振動子、発振器、および電子機器

Also Published As

Publication number Publication date
CN102347741A (zh) 2012-02-08
KR101295215B1 (ko) 2013-08-08
TWI491173B (zh) 2015-07-01
TW201214963A (en) 2012-04-01
US8416027B2 (en) 2013-04-09
CN102347741B (zh) 2016-03-09
US9059393B2 (en) 2015-06-16
KR20120022581A (ko) 2012-03-12
US20120025923A1 (en) 2012-02-02
JP2012034093A (ja) 2012-02-16
US20130194049A1 (en) 2013-08-01

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