KR101212917B1 - 표면 실장형 led용 반사판에 사용하는 폴리아미드 수지 조성물 - Google Patents

표면 실장형 led용 반사판에 사용하는 폴리아미드 수지 조성물 Download PDF

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Publication number
KR101212917B1
KR101212917B1 KR1020127016769A KR20127016769A KR101212917B1 KR 101212917 B1 KR101212917 B1 KR 101212917B1 KR 1020127016769 A KR1020127016769 A KR 1020127016769A KR 20127016769 A KR20127016769 A KR 20127016769A KR 101212917 B1 KR101212917 B1 KR 101212917B1
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KR
South Korea
Prior art keywords
polyamide resin
resin composition
acid
carbon atoms
temperature
Prior art date
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KR1020127016769A
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English (en)
Korean (ko)
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KR20120083937A (ko
Inventor
쥰이치 나카오
다카시 시미즈
마코토 다마츠시마
Original Assignee
도요보 가부시키가이샤
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Publication of KR20120083937A publication Critical patent/KR20120083937A/ko
Application granted granted Critical
Publication of KR101212917B1 publication Critical patent/KR101212917B1/ko

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    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00Optical elements other than lenses
    • G02B5/08Mirrors
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/06Polyamides derived from polyamines and polycarboxylic acids
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/02Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
    • C08G69/36Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from amino acids, polyamines and polycarboxylic acids
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00Use of ingredients characterised by shape
    • C08K7/02Fibres or whiskers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00Use of ingredients characterised by shape
    • C08K7/02Fibres or whiskers
    • C08K7/04Fibres or whiskers inorganic
    • C08K7/14Glass
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/04Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58Optical field-shaping elements
    • H01L33/60Reflective elements

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  • Chemical & Material Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Proteomics, Peptides & Aminoacids (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polyamides (AREA)
KR1020127016769A 2010-08-27 2011-08-22 표면 실장형 led용 반사판에 사용하는 폴리아미드 수지 조성물 KR101212917B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2010-190293 2010-08-27
JP2010190293 2010-08-27
PCT/JP2011/068831 WO2012026413A1 (ja) 2010-08-27 2011-08-22 表面実装型led用反射板に使用するポリアミド樹脂組成物

Publications (2)

Publication Number Publication Date
KR20120083937A KR20120083937A (ko) 2012-07-26
KR101212917B1 true KR101212917B1 (ko) 2012-12-14

Family

ID=45723413

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020127016769A KR101212917B1 (ko) 2010-08-27 2011-08-22 표면 실장형 led용 반사판에 사용하는 폴리아미드 수지 조성물

Country Status (5)

Country Link
JP (1) JP4998841B2 (ja)
KR (1) KR101212917B1 (ja)
CN (1) CN102782048B (ja)
TW (1) TWI393745B (ja)
WO (1) WO2012026413A1 (ja)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012101997A1 (ja) 2011-01-28 2012-08-02 株式会社クラレ 反射板用ポリアミド組成物、反射板、該反射板を備えた発光装置、ならびに該発光装置を備えた照明装置および画像表示装置
FR2976946B1 (fr) * 2011-06-24 2014-01-24 Arkema France Composition comprenant un polyamide semi-aromatique et ses utilisations, notamment pour un reflecteur a diode electroluminescente
CN102604375A (zh) * 2012-03-09 2012-07-25 深圳市科聚新材料有限公司 一种低成本高阻燃增强聚酰胺及其制备方法
JP5953860B2 (ja) * 2012-03-22 2016-07-20 大日本印刷株式会社 半導体発光装置、半導体発光装置用部品、半導体発光装置用反射体、半導体発光装置用反射体組成物、半導体発光装置用反射体の製造方法
JP5733871B2 (ja) * 2013-01-11 2015-06-10 旭化成ケミカルズ株式会社 ポリアミド組成物及び成形品
WO2014129364A1 (ja) * 2013-02-19 2014-08-28 ユニチカ株式会社 半芳香族ポリアミド樹脂組成物
JPWO2014132883A1 (ja) * 2013-02-26 2017-02-02 東洋紡株式会社 表面実装型電気電子部品に使用する難燃性ポリアミド樹脂組成物
US10072137B2 (en) * 2013-07-04 2018-09-11 Toyobo Co., Ltd. Polyamide resin composition having high melt point and being excellent in anti-vibration property upon water absorption
WO2015004927A1 (ja) * 2013-07-12 2015-01-15 パナソニックIpマネジメント株式会社 光反射体用樹脂成形材料、光反射体及び照明器具
WO2015019882A1 (ja) * 2013-08-05 2015-02-12 東洋紡株式会社 難燃性ポリアミド樹脂組成物
WO2016105162A1 (ko) * 2014-12-24 2016-06-30 삼성에스디아이 주식회사 폴리아미드 수지 조성물 및 이로부터 제조된 성형품
CN104610739B (zh) * 2015-01-21 2017-09-15 金发科技股份有限公司 一种反射板用聚酰胺组合物
EP3409713B1 (en) * 2016-01-29 2022-06-15 Kuraray Co., Ltd. Molded article and method for production thereof
JP7039166B2 (ja) * 2016-09-30 2022-03-22 東京応化工業株式会社 樹脂組成物、硬化物の製造方法、及び硬化物
JP7014510B2 (ja) * 2016-10-07 2022-02-01 三菱エンジニアリングプラスチックス株式会社 成形品および成形品の製造方法
JP7310089B2 (ja) * 2016-10-07 2023-07-19 グローバルポリアセタール株式会社 成形品および成形品の製造方法
JP7310088B2 (ja) * 2016-10-07 2023-07-19 グローバルポリアセタール株式会社 成形品および成形品の製造方法
CN107092085A (zh) * 2017-06-30 2017-08-25 王纪盛 一种用于高倍聚光化合物太阳能模组的交错对位反射镜
JP7174431B2 (ja) * 2017-11-30 2022-11-17 ユニチカ株式会社 ポリアミド樹脂組成物およびそれを成形してなる成形体
WO2019156010A1 (ja) * 2018-02-06 2019-08-15 大塚化学株式会社 摺動部材
CN115838532B (zh) * 2021-09-18 2024-03-01 珠海万通特种工程塑料有限公司 一种pa10t模塑复合材料及其制备方法和应用
CN117467167B (zh) * 2023-12-28 2024-03-19 浙江祥邦永晟新能源有限公司 一种转光聚烯烃母粒的制备方法以及胶膜、光伏电池组件

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005194513A (ja) 2003-12-09 2005-07-21 Mitsui Chemicals Inc 反射板用樹脂組成物および反射板
WO2006112300A1 (ja) 2005-04-15 2006-10-26 Mitsui Chemicals, Inc. 反射板用樹脂組成物および反射板
JP2010100682A (ja) 2008-10-21 2010-05-06 Techno Polymer Co Ltd 放熱性樹脂組成物、led実装用基板及びリフレクター

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2685701B1 (fr) * 1991-12-31 1994-04-08 Atochem Nouveau procede de preparation de polyamides.
US20080167404A1 (en) * 2004-07-01 2008-07-10 Solvay Advanced Polymers, Llc Aromatic Polyamide Composition and Article Manufactured Therefrom
JP5634153B2 (ja) * 2009-07-27 2014-12-03 旭化成ケミカルズ株式会社 ポリアミド組成物

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005194513A (ja) 2003-12-09 2005-07-21 Mitsui Chemicals Inc 反射板用樹脂組成物および反射板
WO2006112300A1 (ja) 2005-04-15 2006-10-26 Mitsui Chemicals, Inc. 反射板用樹脂組成物および反射板
JP2010100682A (ja) 2008-10-21 2010-05-06 Techno Polymer Co Ltd 放熱性樹脂組成物、led実装用基板及びリフレクター

Also Published As

Publication number Publication date
CN102782048B (zh) 2013-10-09
TWI393745B (zh) 2013-04-21
KR20120083937A (ko) 2012-07-26
CN102782048A (zh) 2012-11-14
WO2012026413A1 (ja) 2012-03-01
TW201213439A (en) 2012-04-01
JP4998841B2 (ja) 2012-08-15
JPWO2012026413A1 (ja) 2013-10-28

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