KR101195693B1 - 반도체용 접착제 조성물 및 그것을 이용하여 제조한 반도체 장치 - Google Patents

반도체용 접착제 조성물 및 그것을 이용하여 제조한 반도체 장치 Download PDF

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KR101195693B1
KR101195693B1 KR1020097019988A KR20097019988A KR101195693B1 KR 101195693 B1 KR101195693 B1 KR 101195693B1 KR 1020097019988 A KR1020097019988 A KR 1020097019988A KR 20097019988 A KR20097019988 A KR 20097019988A KR 101195693 B1 KR101195693 B1 KR 101195693B1
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South Korea
Prior art keywords
compound
adhesive composition
meth
bis
acrylate
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KR1020097019988A
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English (en)
Korean (ko)
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KR20100009541A (ko
Inventor
노부키 다나카
히카루 오쿠보
Original Assignee
스미토모 베이클리트 컴퍼니 리미티드
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Priority claimed from JP2007280696A external-priority patent/JP5266719B2/ja
Priority claimed from JP2008020303A external-priority patent/JP5266774B2/ja
Priority claimed from JP2008052849A external-priority patent/JP5266797B2/ja
Application filed by 스미토모 베이클리트 컴퍼니 리미티드 filed Critical 스미토모 베이클리트 컴퍼니 리미티드
Publication of KR20100009541A publication Critical patent/KR20100009541A/ko
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Publication of KR101195693B1 publication Critical patent/KR101195693B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J181/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur, with or without nitrogen, oxygen, or carbon only; Adhesives based on polysulfones; Adhesives based on derivatives of such polymers
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    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
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KR1020097019988A 2007-10-29 2008-10-24 반도체용 접착제 조성물 및 그것을 이용하여 제조한 반도체 장치 KR101195693B1 (ko)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JPJP-P-2007-280696 2007-10-29
JP2007280696A JP5266719B2 (ja) 2007-10-29 2007-10-29 樹脂組成物及び樹脂組成物を使用して作製した半導体装置
JP2008020303A JP5266774B2 (ja) 2008-01-31 2008-01-31 樹脂組成物およびそれを用いて作製した半導体装置または回路基板
JPJP-P-2008-020303 2008-01-31
JPJP-P-2008-052849 2008-03-04
JP2008052849A JP5266797B2 (ja) 2008-03-04 2008-03-04 樹脂組成物、接着剤層、及びそれらを用いて作製した半導体装置
PCT/JP2008/069356 WO2009057530A1 (ja) 2007-10-29 2008-10-24 半導体用接着剤組成物およびそれを用いて製造した半導体装置

Publications (2)

Publication Number Publication Date
KR20100009541A KR20100009541A (ko) 2010-01-27
KR101195693B1 true KR101195693B1 (ko) 2012-10-30

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