WO2009057530A1 - 半導体用接着剤組成物およびそれを用いて製造した半導体装置 - Google Patents

半導体用接着剤組成物およびそれを用いて製造した半導体装置 Download PDF

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Publication number
WO2009057530A1
WO2009057530A1 PCT/JP2008/069356 JP2008069356W WO2009057530A1 WO 2009057530 A1 WO2009057530 A1 WO 2009057530A1 JP 2008069356 W JP2008069356 W JP 2008069356W WO 2009057530 A1 WO2009057530 A1 WO 2009057530A1
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Prior art keywords
compound
adhesive composition
sulfide bond
bond
semiconductor
Prior art date
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PCT/JP2008/069356
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English (en)
French (fr)
Inventor
Nobuki Tanaka
Hikaru Ohkubo
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Sumitomo Bakelite Co., Ltd.
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Publication date
Priority claimed from JP2007280696A external-priority patent/JP5266719B2/ja
Priority claimed from JP2008020303A external-priority patent/JP5266774B2/ja
Priority claimed from JP2008052849A external-priority patent/JP5266797B2/ja
Application filed by Sumitomo Bakelite Co., Ltd. filed Critical Sumitomo Bakelite Co., Ltd.
Priority to CN200880008769.0A priority Critical patent/CN101636463B/zh
Priority to KR1020097019988A priority patent/KR101195693B1/ko
Publication of WO2009057530A1 publication Critical patent/WO2009057530A1/ja

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Abstract

　充填材粒子（Ａ）、熱硬化性樹脂（Ｂ）および下記式（１）： 　　　－（Ｓ）ｎ－　　　　　（１） （式（１）中、ｎは１以上の整数である。） で表されるスルフィド結合を有する化合物（Ｃ）を含有し、前記化合物（Ｃ）が、前記スルフィド結合とアルコキシシリル基とを有する化合物（Ｃ１）であって、前記スルフィド結合とアルコキシシリル基とを有する化合物（Ｃ１）中のジスルフィド結合を有する化合物の含有率が、高速液体クロマトグラフにより測定した前記スルフィド結合とアルコキシシリル基とを有する化合物（Ｃ１）の全ピーク面積に対する前記ジスルフィド結合を有する化合物に起因するピーク面積の割合で１５％以上である化合物（Ｃ１－１）、前記スルフィド結合と水酸基とを有する化合物（Ｃ２）、ならびに前記スルフィド結合とアルコキシシリル基とを有する化合物（Ｃ１）および前記スルフィド結合と水酸基とを有する化合物（Ｃ２）のうちのいずれか１つである、半導体用接着剤組成物。
PCT/JP2008/069356 2007-10-29 2008-10-24 半導体用接着剤組成物およびそれを用いて製造した半導体装置 WO2009057530A1 (ja)

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Application Number Priority Date Filing Date Title
CN200880008769.0A CN101636463B (zh) 2007-10-29 2008-10-24 半导体用粘着剂组合物和使用该组合物制造的半导体装置
KR1020097019988A KR101195693B1 (ko) 2007-10-29 2008-10-24 반도체용 접착제 조성물 및 그것을 이용하여 제조한 반도체 장치

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JP2011073405A (ja) * 2009-10-01 2011-04-14 Sumitomo Bakelite Co Ltd 積層構造体の製造方法
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JP2011037981A (ja) * 2009-08-10 2011-02-24 Sumitomo Bakelite Co Ltd 樹脂組成物及び樹脂組成物を使用して作製した半導体装置
JP2011052043A (ja) * 2009-08-31 2011-03-17 Sumitomo Bakelite Co Ltd 樹脂組成物及び樹脂組成物を使用して作製した半導体装置
JP2011073405A (ja) * 2009-10-01 2011-04-14 Sumitomo Bakelite Co Ltd 積層構造体の製造方法
JP2011082368A (ja) * 2009-10-08 2011-04-21 Sumitomo Bakelite Co Ltd 樹脂組成物及び樹脂組成物を使用して作製した半導体装置
JP2011080024A (ja) * 2009-10-09 2011-04-21 Sumitomo Bakelite Co Ltd 樹脂組成物及び樹脂組成物を使用して作製した半導体装置
JP5987984B2 (ja) * 2013-06-12 2016-09-07 Jsr株式会社 樹脂組成物、感光性樹脂組成物、絶縁膜およびその製法ならびに電子部品
WO2014199800A1 (ja) * 2013-06-12 2014-12-18 Jsr株式会社 樹脂組成物、感光性樹脂組成物、絶縁膜およびその製法ならびに電子部品
JP2015221870A (ja) * 2014-05-23 2015-12-10 三菱瓦斯化学株式会社 プリント配線板材料用樹脂組成物、それを用いたプリプレグ、樹脂シート、金属箔張積層板及びプリント配線板
JP2016219600A (ja) * 2015-05-20 2016-12-22 京セラ株式会社 半導体用ダイアタッチペースト及び半導体装置
WO2017022523A1 (ja) * 2015-08-03 2017-02-09 古河電気工業株式会社 導電性組成物
KR20170084287A (ko) * 2015-08-03 2017-07-19 후루카와 덴키 고교 가부시키가이샤 도전성 조성물
JPWO2017022523A1 (ja) * 2015-08-03 2018-05-24 古河電気工業株式会社 導電性組成物
KR102019761B1 (ko) 2015-08-03 2019-09-09 후루카와 덴키 고교 가부시키가이샤 도전성 조성물
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