KR101182010B1 - 고밀도 상호연결에 대한 실리콘 패치들을 포함하는 마이크로전자 패키지와 그 제조 방법 - Google Patents

고밀도 상호연결에 대한 실리콘 패치들을 포함하는 마이크로전자 패키지와 그 제조 방법 Download PDF

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KR101182010B1
KR101182010B1 KR1020107021305A KR20107021305A KR101182010B1 KR 101182010 B1 KR101182010 B1 KR 101182010B1 KR 1020107021305 A KR1020107021305 A KR 1020107021305A KR 20107021305 A KR20107021305 A KR 20107021305A KR 101182010 B1 KR101182010 B1 KR 101182010B1
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die
interconnect structure
electrically conductive
microelectronic package
interconnect
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KR1020107021305A
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Korean (ko)
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KR20100116689A (ko
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라비 마하잔
샌딥 새인
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인텔 코오퍼레이션
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/492—Bases or plates or solder therefor
    • H01L23/4924—Bases or plates or solder therefor characterised by the materials
    • H01L23/4926—Bases or plates or solder therefor characterised by the materials the materials containing semiconductor material
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    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
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    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
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    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
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    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
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    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
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    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16238—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bonding area protruding from the surface of the item
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
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    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Wire Bonding (AREA)
  • Semiconductor Integrated Circuits (AREA)
KR1020107021305A 2008-03-31 2009-03-29 고밀도 상호연결에 대한 실리콘 패치들을 포함하는 마이크로전자 패키지와 그 제조 방법 KR101182010B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/059,133 US8064224B2 (en) 2008-03-31 2008-03-31 Microelectronic package containing silicon patches for high density interconnects, and method of manufacturing same
US12/059,133 2008-03-31
PCT/US2009/038708 WO2009146007A2 (en) 2008-03-31 2009-03-29 Microelectronic package containing silicon patches for high density interconnects, and method of manufacturing same

Publications (2)

Publication Number Publication Date
KR20100116689A KR20100116689A (ko) 2010-11-01
KR101182010B1 true KR101182010B1 (ko) 2012-09-11

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Application Number Title Priority Date Filing Date
KR1020107021305A KR101182010B1 (ko) 2008-03-31 2009-03-29 고밀도 상호연결에 대한 실리콘 패치들을 포함하는 마이크로전자 패키지와 그 제조 방법

Country Status (8)

Country Link
US (2) US8064224B2 (zh)
JP (1) JP2011515842A (zh)
KR (1) KR101182010B1 (zh)
CN (1) CN101960589B (zh)
DE (3) DE112009005519B4 (zh)
GB (1) GB2470866B (zh)
TW (1) TWI425602B (zh)
WO (1) WO2009146007A2 (zh)

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