KR101168861B1 - 반도체 장치 및 이의 제조방법 - Google Patents

반도체 장치 및 이의 제조방법 Download PDF

Info

Publication number
KR101168861B1
KR101168861B1 KR1020067019279A KR20067019279A KR101168861B1 KR 101168861 B1 KR101168861 B1 KR 101168861B1 KR 1020067019279 A KR1020067019279 A KR 1020067019279A KR 20067019279 A KR20067019279 A KR 20067019279A KR 101168861 B1 KR101168861 B1 KR 101168861B1
Authority
KR
South Korea
Prior art keywords
semiconductor device
mold
curable liquid
sealed
liquid silicone
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
KR1020067019279A
Other languages
English (en)
Korean (ko)
Other versions
KR20060123643A (ko
Inventor
요시쓰구 모리타
쥰지 나카니시
가쓰토시 미네
Original Assignee
다우 코닝 도레이 캄파니 리미티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 다우 코닝 도레이 캄파니 리미티드 filed Critical 다우 코닝 도레이 캄파니 리미티드
Publication of KR20060123643A publication Critical patent/KR20060123643A/ko
Application granted granted Critical
Publication of KR101168861B1 publication Critical patent/KR101168861B1/ko
Assigned to 다우 도레이 캄파니 리미티드 reassignment 다우 도레이 캄파니 리미티드 권리의 전부이전등록 Assignors: 다우 코닝 도레이 캄파니 리미티드
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H10W74/017—Auxiliary layers for moulds, e.g. release layers or layers preventing residue
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/476—Organic materials comprising silicon
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
KR1020067019279A 2004-03-19 2005-03-08 반도체 장치 및 이의 제조방법 Expired - Lifetime KR101168861B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2004079597A JP4903987B2 (ja) 2004-03-19 2004-03-19 半導体装置の製造方法
JPJP-P-2004-00079597 2004-03-19
PCT/JP2005/004410 WO2005091361A1 (en) 2004-03-19 2005-03-08 Semiconductor device and method of manufacturing thereof

Publications (2)

Publication Number Publication Date
KR20060123643A KR20060123643A (ko) 2006-12-01
KR101168861B1 true KR101168861B1 (ko) 2012-07-30

Family

ID=34961509

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020067019279A Expired - Lifetime KR101168861B1 (ko) 2004-03-19 2005-03-08 반도체 장치 및 이의 제조방법

Country Status (8)

Country Link
US (1) US8262970B2 (https=)
EP (1) EP1730775B1 (https=)
JP (1) JP4903987B2 (https=)
KR (1) KR101168861B1 (https=)
CN (1) CN100539092C (https=)
MY (1) MY146873A (https=)
TW (1) TWI383429B (https=)
WO (1) WO2005091361A1 (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4931366B2 (ja) 2005-04-27 2012-05-16 東レ・ダウコーニング株式会社 硬化性シリコーン組成物および電子部品
JP5207591B2 (ja) 2006-02-23 2013-06-12 東レ・ダウコーニング株式会社 半導体装置の製造方法および半導体装置
JP5285846B2 (ja) 2006-09-11 2013-09-11 東レ・ダウコーニング株式会社 硬化性シリコーン組成物および電子部品
CN102290170A (zh) * 2010-06-17 2011-12-21 台湾双羽电机股份有限公司 薄型电阻及其制造方法
KR101944200B1 (ko) * 2012-06-08 2019-01-30 히타치가세이가부시끼가이샤 반도체 장치의 제조 방법
US8997342B2 (en) * 2012-10-15 2015-04-07 Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd. Method of fabrication, a multilayer electronic structure and structures in accordance with the method
JP2014082284A (ja) * 2012-10-15 2014-05-08 Dow Corning Toray Co Ltd 凸状硬化物及び基材を備える一体化物の製造方法
US9470395B2 (en) 2013-03-15 2016-10-18 Abl Ip Holding Llc Optic for a light source
US10807329B2 (en) 2013-05-10 2020-10-20 Abl Ip Holding Llc Silicone optics
US10629916B2 (en) 2014-09-01 2020-04-21 Korea Institute Of Industrial Technology Preparation method for bipolar plate for redox flow battery
US10079188B2 (en) * 2015-03-05 2018-09-18 Sumitomo Bakelite Co., Ltd. Resin composition for encapsulating, manufacturing method of on-vehicle electronic control unit, and on-vehicle electronic control unit
KR102695706B1 (ko) 2022-05-24 2024-08-16 레이저쎌 주식회사 진공챔버를 구비한 가압 방식의 레이저 리플로우 장치

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000129132A (ja) * 1998-10-28 2000-05-09 Dow Corning Corp シリコ―ン組成物、それらの製造法及びシリコ―ンエラストマ―
JP2000277551A (ja) * 1999-03-26 2000-10-06 Apic Yamada Corp 樹脂封止装置及び樹脂封止方法
WO2003102071A1 (en) * 2002-05-31 2003-12-11 Dow Corning Toray Silicone Co.,Ltd. Thermoconductive curable liquid polymer composition and semiconductor device produced with the use of this composition

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0214244A (ja) 1988-06-30 1990-01-18 Toray Dow Corning Silicone Co Ltd 加熱硬化性オルガノポリシロキサン組成物
JP3516764B2 (ja) 1995-03-08 2004-04-05 アピックヤマダ株式会社 リリースフィルムを用いる樹脂モールド装置及び樹脂モールド方法
JPH1177733A (ja) 1997-09-01 1999-03-23 Apic Yamada Kk 樹脂モールド方法及び樹脂モールド装置
US6080605A (en) 1998-10-06 2000-06-27 Tessera, Inc. Methods of encapsulating a semiconductor chip using a settable encapsulant
US6040366A (en) 1998-02-27 2000-03-21 General Electric Company Liquid injection molding silicone elastomers having primerless adhesion
JP4646363B2 (ja) * 2000-06-29 2011-03-09 東レ・ダウコーニング株式会社 シリコーンゴム組成物
JP4947858B2 (ja) * 2001-08-21 2012-06-06 東レ・ダウコーニング株式会社 導電性液状シリコーンゴム組成物、導電性シリコーンゴム成形物およびその製造方法
JP4061361B2 (ja) * 2001-12-28 2008-03-19 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 付加反応型ポリオルガノシロキサン組成物

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000129132A (ja) * 1998-10-28 2000-05-09 Dow Corning Corp シリコ―ン組成物、それらの製造法及びシリコ―ンエラストマ―
JP2000277551A (ja) * 1999-03-26 2000-10-06 Apic Yamada Corp 樹脂封止装置及び樹脂封止方法
WO2003102071A1 (en) * 2002-05-31 2003-12-11 Dow Corning Toray Silicone Co.,Ltd. Thermoconductive curable liquid polymer composition and semiconductor device produced with the use of this composition

Also Published As

Publication number Publication date
JP4903987B2 (ja) 2012-03-28
KR20060123643A (ko) 2006-12-01
MY146873A (en) 2012-10-15
EP1730775B1 (en) 2013-02-13
WO2005091361A1 (en) 2005-09-29
TW200535957A (en) 2005-11-01
CN1934699A (zh) 2007-03-21
JP2005268565A (ja) 2005-09-29
US8262970B2 (en) 2012-09-11
US20070273050A1 (en) 2007-11-29
EP1730775A1 (en) 2006-12-13
TWI383429B (zh) 2013-01-21
CN100539092C (zh) 2009-09-09

Similar Documents

Publication Publication Date Title
CN100378935C (zh) 半导体器件及其制造方法
KR101349619B1 (ko) 반도체 장치의 제조방법 및 이로부터 제조한 반도체 장치
JP5101788B2 (ja) 半導体装置の製造方法および半導体装置
KR101168861B1 (ko) 반도체 장치 및 이의 제조방법
JP6654994B2 (ja) 回路部品の製造方法
US8048358B2 (en) Pop semiconductor device manufacturing method
JP6723185B2 (ja) 成形型、樹脂成形装置、樹脂成形方法、及び樹脂成形品の製造方法
JP2001079878A (ja) 樹脂封止方法及び樹脂封止装置
CN101218083A (zh) 具有改进的尺寸控制的塑料半导体封装
JP4336502B2 (ja) 電子部品の樹脂封止成形方法及び装置
JP6438794B2 (ja) モールド金型、樹脂モールド装置及び樹脂モールド方法
JP7530772B2 (ja) 樹脂漏れ防止用部材、樹脂漏れ防止用部材供給機構、樹脂成形装置及び樹脂成形品の製造方法
JP2003197680A (ja) 半導体装置の製造方法
JP3798995B2 (ja) アンダーフィル樹脂モールド方法及び金型

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

G170 Re-publication after modification of scope of protection [patent]
PG1701 Publication of correction

St.27 status event code: A-3-3-P10-P19-oth-PG1701

Patent document republication publication date: 20090610

Republication note text: Request for Correction Notice (Document Request)

Gazette number: 1020060123643

Gazette reference publication date: 20061201

A201 Request for examination
AMND Amendment
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

AMND Amendment
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E601 Decision to refuse application
PE0601 Decision on rejection of patent

St.27 status event code: N-2-6-B10-B15-exm-PE0601

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

AMND Amendment
E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

J201 Request for trial against refusal decision
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PJ0201 Trial against decision of rejection

St.27 status event code: A-3-3-V10-V11-apl-PJ0201

PB0901 Examination by re-examination before a trial

St.27 status event code: A-6-3-E10-E12-rex-PB0901

B701 Decision to grant
PB0701 Decision of registration after re-examination before a trial

St.27 status event code: A-3-4-F10-F13-rex-PB0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

FPAY Annual fee payment

Payment date: 20150619

Year of fee payment: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

FPAY Annual fee payment

Payment date: 20160616

Year of fee payment: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

FPAY Annual fee payment

Payment date: 20170616

Year of fee payment: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

FPAY Annual fee payment

Payment date: 20190617

Year of fee payment: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R14-asn-PN2301

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 11

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 12

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 13

PC1801 Expiration of term

St.27 status event code: N-4-6-H10-H14-oth-PC1801

Not in force date: 20250309

Ip right cessation event data comment text: Termination Category : EXPIRATION_OF_DURATION

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000