KR101167536B1 - 감광성 수지 조성물 및 그 적층체 - Google Patents

감광성 수지 조성물 및 그 적층체 Download PDF

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Publication number
KR101167536B1
KR101167536B1 KR1020107001284A KR20107001284A KR101167536B1 KR 101167536 B1 KR101167536 B1 KR 101167536B1 KR 1020107001284 A KR1020107001284 A KR 1020107001284A KR 20107001284 A KR20107001284 A KR 20107001284A KR 101167536 B1 KR101167536 B1 KR 101167536B1
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South Korea
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group
photosensitive resin
resin composition
mass
substrate
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KR20100027227A (ko
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야마토 츠츠이
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아사히 가세이 이-매터리얼즈 가부시키가이샤
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
    • C08F212/02—Monomers containing only one unsaturated aliphatic radical
    • C08F212/04—Monomers containing only one unsaturated aliphatic radical containing one ring
    • C08F212/06—Hydrocarbons
    • C08F212/08—Styrene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
    • C08F220/30—Esters containing oxygen in addition to the carboxy oxygen containing aromatic rings in the alcohol moiety
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10—Esters
    • C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
    • C08F222/102—Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10—Esters
    • C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
    • C08F222/106—Esters of polycondensation macromers
    • C08F222/1063—Esters of polycondensation macromers of alcohol terminated polyethers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
    • C09D4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09D159/00 - C09D187/00
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Polymerisation Methods In General (AREA)
  • Graft Or Block Polymers (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Laminated Bodies (AREA)
KR1020107001284A 2007-09-18 2008-09-17 감광성 수지 조성물 및 그 적층체 Active KR101167536B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007241007 2007-09-18
JPJP-P-2007-241007 2007-09-18
PCT/JP2008/066756 WO2009038082A1 (ja) 2007-09-18 2008-09-17 感光性樹脂組成物及びその積層体

Publications (2)

Publication Number Publication Date
KR20100027227A KR20100027227A (ko) 2010-03-10
KR101167536B1 true KR101167536B1 (ko) 2012-07-20

Family

ID=40467892

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KR1020107001284A Active KR101167536B1 (ko) 2007-09-18 2008-09-17 감광성 수지 조성물 및 그 적층체

Country Status (5)

Country Link
JP (1) JP5437072B2 (enExample)
KR (1) KR101167536B1 (enExample)
CN (1) CN101802710A (enExample)
TW (1) TW200919085A (enExample)
WO (1) WO2009038082A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5126354B2 (ja) * 2008-03-17 2013-01-23 日立化成工業株式会社 感光性樹脂組成物、並びにこれを用いた感光性エレメント、ソルダーレジスト及びプリント配線板
WO2010116868A1 (ja) * 2009-03-30 2010-10-14 旭化成イーマテリアルズ株式会社 感光性樹脂組成物及びその積層体
CN102428406B (zh) * 2009-05-20 2014-09-03 旭化成电子材料株式会社 感光性树脂组合物
JP5697965B2 (ja) * 2010-06-08 2015-04-08 住友化学株式会社 感光性樹脂組成物
KR101860155B1 (ko) * 2010-06-08 2018-05-21 스미또모 가가꾸 가부시끼가이샤 감광성 수지 조성물
KR20130125393A (ko) * 2011-03-29 2013-11-18 아사히 가세이 이-매터리얼즈 가부시키가이샤 감광성 수지 조성물 및 그 적층체
KR102162752B1 (ko) * 2013-07-23 2020-10-07 히타치가세이가부시끼가이샤 투영 노광용 감광성 수지 조성물, 감광성 엘리먼트, 레지스트 패턴의 형성 방법, 프린트 배선판의 제조 방법 및 리드 프레임의 제조 방법
WO2022181485A1 (ja) * 2021-02-26 2022-09-01 富士フイルム株式会社 積層体の製造方法、回路配線の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001125264A (ja) 1999-10-25 2001-05-11 Toagosei Co Ltd 硬化型組成物
JP2006234995A (ja) 2005-02-23 2006-09-07 Asahi Kasei Electronics Co Ltd 光重合性樹脂組成物
JP2006336006A (ja) 2005-04-01 2006-12-14 Three D Syst Inc イメージ・プロジェクション・システムに有用な放射線硬化性組成物

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2719799B2 (ja) * 1988-10-14 1998-02-25 日本合成化学工業株式会社 感光性樹脂組成物
JP3196269B2 (ja) * 1991-12-16 2001-08-06 ジェイエスアール株式会社 液状硬化性樹脂組成物
JP3957364B2 (ja) * 1997-02-06 2007-08-15 旭化成エレクトロニクス株式会社 光重合性組成物
JP2004085781A (ja) * 2002-08-26 2004-03-18 Toagosei Co Ltd 架橋硬化型樹脂組成物
JP4346315B2 (ja) * 2003-01-14 2009-10-21 旭化成イーマテリアルズ株式会社 感光性樹脂組成物およびその用途
JP4300847B2 (ja) * 2003-04-01 2009-07-22 Ｊｓｒ株式会社 感光性樹脂膜およびこれからなる硬化膜
JP4360242B2 (ja) * 2004-03-24 2009-11-11 Ｊｓｒ株式会社 ネガ型感放射線性樹脂組成物
JP2006259716A (ja) * 2005-02-21 2006-09-28 Toray Ind Inc 感光性着色組成物およびカラーフィルター
JP4749305B2 (ja) * 2005-10-05 2011-08-17 旭化成イーマテリアルズ株式会社 感光性樹脂組成物及び積層体

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001125264A (ja) 1999-10-25 2001-05-11 Toagosei Co Ltd 硬化型組成物
JP2006234995A (ja) 2005-02-23 2006-09-07 Asahi Kasei Electronics Co Ltd 光重合性樹脂組成物
JP2006336006A (ja) 2005-04-01 2006-12-14 Three D Syst Inc イメージ・プロジェクション・システムに有用な放射線硬化性組成物

Also Published As

Publication number Publication date
CN101802710A (zh) 2010-08-11
JPWO2009038082A1 (ja) 2011-01-06
TWI376573B (enExample) 2012-11-11
KR20100027227A (ko) 2010-03-10
WO2009038082A1 (ja) 2009-03-26
TW200919085A (en) 2009-05-01
JP5437072B2 (ja) 2014-03-12

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