JP5437072B2 - 感光性樹脂組成物及びその積層体 - Google Patents

感光性樹脂組成物及びその積層体 Download PDF

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JP5437072B2
JP5437072B2 JP2009533153A JP2009533153A JP5437072B2 JP 5437072 B2 JP5437072 B2 JP 5437072B2 JP 2009533153 A JP2009533153 A JP 2009533153A JP 2009533153 A JP2009533153 A JP 2009533153A JP 5437072 B2 JP5437072 B2 JP 5437072B2
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group
photosensitive resin
substrate
resist pattern
mass
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JPWO2009038082A1 (ja
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大和 筒井
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Asahi Kasei Corp
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Asahi Kasei E Materials Corp
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
    • C08F212/02—Monomers containing only one unsaturated aliphatic radical
    • C08F212/04—Monomers containing only one unsaturated aliphatic radical containing one ring
    • C08F212/06—Hydrocarbons
    • C08F212/08—Styrene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
    • C08F220/30—Esters containing oxygen in addition to the carboxy oxygen containing aromatic rings in the alcohol moiety
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10—Esters
    • C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
    • C08F222/102—Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10—Esters
    • C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
    • C08F222/106—Esters of polycondensation macromers
    • C08F222/1063—Esters of polycondensation macromers of alcohol terminated polyethers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
    • C09D4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09D159/00 - C09D187/00
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Polymerisation Methods In General (AREA)
  • Graft Or Block Polymers (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Laminated Bodies (AREA)
JP2009533153A 2007-09-18 2008-09-17 感光性樹脂組成物及びその積層体 Active JP5437072B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009533153A JP5437072B2 (ja) 2007-09-18 2008-09-17 感光性樹脂組成物及びその積層体

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007241007 2007-09-18
JP2007241007 2007-09-18
PCT/JP2008/066756 WO2009038082A1 (ja) 2007-09-18 2008-09-17 感光性樹脂組成物及びその積層体
JP2009533153A JP5437072B2 (ja) 2007-09-18 2008-09-17 感光性樹脂組成物及びその積層体

Publications (2)

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JPWO2009038082A1 JPWO2009038082A1 (ja) 2011-01-06
JP5437072B2 true JP5437072B2 (ja) 2014-03-12

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JP2009533153A Active JP5437072B2 (ja) 2007-09-18 2008-09-17 感光性樹脂組成物及びその積層体

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JP (1) JP5437072B2 (enExample)
KR (1) KR101167536B1 (enExample)
CN (1) CN101802710A (enExample)
TW (1) TW200919085A (enExample)
WO (1) WO2009038082A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5126354B2 (ja) * 2008-03-17 2013-01-23 日立化成工業株式会社 感光性樹脂組成物、並びにこれを用いた感光性エレメント、ソルダーレジスト及びプリント配線板
WO2010116868A1 (ja) * 2009-03-30 2010-10-14 旭化成イーマテリアルズ株式会社 感光性樹脂組成物及びその積層体
CN102428406B (zh) * 2009-05-20 2014-09-03 旭化成电子材料株式会社 感光性树脂组合物
JP5697965B2 (ja) * 2010-06-08 2015-04-08 住友化学株式会社 感光性樹脂組成物
KR101860155B1 (ko) * 2010-06-08 2018-05-21 스미또모 가가꾸 가부시끼가이샤 감광성 수지 조성물
KR20130125393A (ko) * 2011-03-29 2013-11-18 아사히 가세이 이-매터리얼즈 가부시키가이샤 감광성 수지 조성물 및 그 적층체
KR102162752B1 (ko) * 2013-07-23 2020-10-07 히타치가세이가부시끼가이샤 투영 노광용 감광성 수지 조성물, 감광성 엘리먼트, 레지스트 패턴의 형성 방법, 프린트 배선판의 제조 방법 및 리드 프레임의 제조 방법
WO2022181485A1 (ja) * 2021-02-26 2022-09-01 富士フイルム株式会社 積層体の製造方法、回路配線の製造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2719799B2 (ja) * 1988-10-14 1998-02-25 日本合成化学工業株式会社 感光性樹脂組成物
JP3196269B2 (ja) * 1991-12-16 2001-08-06 ジェイエスアール株式会社 液状硬化性樹脂組成物
JP3957364B2 (ja) * 1997-02-06 2007-08-15 旭化成エレクトロニクス株式会社 光重合性組成物
JP2001125264A (ja) 1999-10-25 2001-05-11 Toagosei Co Ltd 硬化型組成物
JP2004085781A (ja) * 2002-08-26 2004-03-18 Toagosei Co Ltd 架橋硬化型樹脂組成物
JP4346315B2 (ja) * 2003-01-14 2009-10-21 旭化成イーマテリアルズ株式会社 感光性樹脂組成物およびその用途
JP4300847B2 (ja) * 2003-04-01 2009-07-22 Ｊｓｒ株式会社 感光性樹脂膜およびこれからなる硬化膜
JP4360242B2 (ja) * 2004-03-24 2009-11-11 Ｊｓｒ株式会社 ネガ型感放射線性樹脂組成物
JP2006259716A (ja) * 2005-02-21 2006-09-28 Toray Ind Inc 感光性着色組成物およびカラーフィルター
JP4578269B2 (ja) 2005-02-23 2010-11-10 旭化成イーマテリアルズ株式会社 光重合性樹脂組成物
US7358283B2 (en) 2005-04-01 2008-04-15 3D Systems, Inc. Radiation curable compositions useful in image projection systems
JP4749305B2 (ja) * 2005-10-05 2011-08-17 旭化成イーマテリアルズ株式会社 感光性樹脂組成物及び積層体

Also Published As

Publication number Publication date
CN101802710A (zh) 2010-08-11
JPWO2009038082A1 (ja) 2011-01-06
TWI376573B (enExample) 2012-11-11
KR101167536B1 (ko) 2012-07-20
KR20100027227A (ko) 2010-03-10
WO2009038082A1 (ja) 2009-03-26
TW200919085A (en) 2009-05-01

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