WO2009038082A1 - 感光性樹脂組成物及びその積層体 - Google Patents

感光性樹脂組成物及びその積層体 Download PDF

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Publication number
WO2009038082A1
WO2009038082A1 PCT/JP2008/066756 JP2008066756W WO2009038082A1 WO 2009038082 A1 WO2009038082 A1 WO 2009038082A1 JP 2008066756 W JP2008066756 W JP 2008066756W WO 2009038082 A1 WO2009038082 A1 WO 2009038082A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin composition
photosensitive resin
mass
polymerizable monomer
addition polymerizable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/066756
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
Yamato Tsutsui
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Kasei Corp
Asahi Kasei Microdevices Corp
Original Assignee
Asahi Kasei E Materials Corp
Asahi Kasei EMD Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Kasei E Materials Corp, Asahi Kasei EMD Corp filed Critical Asahi Kasei E Materials Corp
Priority to KR1020107001284A priority Critical patent/KR101167536B1/ko
Priority to CN200880107510A priority patent/CN101802710A/zh
Priority to JP2009533153A priority patent/JP5437072B2/ja
Publication of WO2009038082A1 publication Critical patent/WO2009038082A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
    • C08F212/02—Monomers containing only one unsaturated aliphatic radical
    • C08F212/04—Monomers containing only one unsaturated aliphatic radical containing one ring
    • C08F212/06—Hydrocarbons
    • C08F212/08—Styrene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
    • C08F220/30—Esters containing oxygen in addition to the carboxy oxygen containing aromatic rings in the alcohol moiety
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10—Esters
    • C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
    • C08F222/102—Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10—Esters
    • C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
    • C08F222/106—Esters of polycondensation macromers
    • C08F222/1063—Esters of polycondensation macromers of alcohol terminated polyethers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
    • C09D4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09D159/00 - C09D187/00
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials For Photolithography (AREA)
  • Polymerisation Methods In General (AREA)
  • Graft Or Block Polymers (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Laminated Bodies (AREA)
PCT/JP2008/066756 2007-09-18 2008-09-17 感光性樹脂組成物及びその積層体 Ceased WO2009038082A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020107001284A KR101167536B1 (ko) 2007-09-18 2008-09-17 감광성 수지 조성물 및 그 적층체
CN200880107510A CN101802710A (zh) 2007-09-18 2008-09-17 感光性树脂组合物以及其层压体
JP2009533153A JP5437072B2 (ja) 2007-09-18 2008-09-17 感光性樹脂組成物及びその積層体

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-241007 2007-09-18
JP2007241007 2007-09-18

Publications (1)

Publication Number Publication Date
WO2009038082A1 true WO2009038082A1 (ja) 2009-03-26

Family

ID=40467892

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/066756 Ceased WO2009038082A1 (ja) 2007-09-18 2008-09-17 感光性樹脂組成物及びその積層体

Country Status (5)

Country Link
JP (1) JP5437072B2 (enExample)
KR (1) KR101167536B1 (enExample)
CN (1) CN101802710A (enExample)
TW (1) TW200919085A (enExample)
WO (1) WO2009038082A1 (enExample)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010116868A1 (ja) * 2009-03-30 2010-10-14 旭化成イーマテリアルズ株式会社 感光性樹脂組成物及びその積層体
JPWO2009116401A1 (ja) * 2008-03-17 2011-07-21 日立化成工業株式会社 感光性樹脂組成物、並びにこれを用いた感光性エレメント、ソルダーレジスト及びプリント配線板
CN102279527A (zh) * 2010-06-08 2011-12-14 住友化学株式会社 感光性树脂组合物
CN102428406A (zh) * 2009-05-20 2012-04-25 旭化成电子材料株式会社 感光性树脂组合物
CN103477283A (zh) * 2011-03-29 2013-12-25 旭化成电子材料株式会社 感光性树脂组合物及其层压体
WO2015012272A1 (ja) * 2013-07-23 2015-01-29 日立化成株式会社 投影露光用感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法、プリント配線板の製造方法及びリードフレームの製造方法
TWI506365B (zh) * 2010-06-08 2015-11-01 Sumitomo Chemical Co Photosensitive resin composition
WO2022181485A1 (ja) * 2021-02-26 2022-09-01 富士フイルム株式会社 積層体の製造方法、回路配線の製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05163318A (ja) * 1991-12-16 1993-06-29 Japan Synthetic Rubber Co Ltd 液状硬化性樹脂組成物
JP2001125264A (ja) * 1999-10-25 2001-05-11 Toagosei Co Ltd 硬化型組成物
JP2006234995A (ja) * 2005-02-23 2006-09-07 Asahi Kasei Electronics Co Ltd 光重合性樹脂組成物
JP2006336006A (ja) * 2005-04-01 2006-12-14 Three D Syst Inc イメージ・プロジェクション・システムに有用な放射線硬化性組成物
JP2007128057A (ja) * 2005-10-05 2007-05-24 Asahi Kasei Electronics Co Ltd 感光性樹脂組成物及び積層体

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2719799B2 (ja) * 1988-10-14 1998-02-25 日本合成化学工業株式会社 感光性樹脂組成物
JP3957364B2 (ja) * 1997-02-06 2007-08-15 旭化成エレクトロニクス株式会社 光重合性組成物
JP2004085781A (ja) * 2002-08-26 2004-03-18 Toagosei Co Ltd 架橋硬化型樹脂組成物
JP4346315B2 (ja) * 2003-01-14 2009-10-21 旭化成イーマテリアルズ株式会社 感光性樹脂組成物およびその用途
JP4300847B2 (ja) * 2003-04-01 2009-07-22 Ｊｓｒ株式会社 感光性樹脂膜およびこれからなる硬化膜
JP4360242B2 (ja) * 2004-03-24 2009-11-11 Ｊｓｒ株式会社 ネガ型感放射線性樹脂組成物
JP2006259716A (ja) * 2005-02-21 2006-09-28 Toray Ind Inc 感光性着色組成物およびカラーフィルター

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05163318A (ja) * 1991-12-16 1993-06-29 Japan Synthetic Rubber Co Ltd 液状硬化性樹脂組成物
JP2001125264A (ja) * 1999-10-25 2001-05-11 Toagosei Co Ltd 硬化型組成物
JP2006234995A (ja) * 2005-02-23 2006-09-07 Asahi Kasei Electronics Co Ltd 光重合性樹脂組成物
JP2006336006A (ja) * 2005-04-01 2006-12-14 Three D Syst Inc イメージ・プロジェクション・システムに有用な放射線硬化性組成物
JP2007128057A (ja) * 2005-10-05 2007-05-24 Asahi Kasei Electronics Co Ltd 感光性樹脂組成物及び積層体

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2009116401A1 (ja) * 2008-03-17 2011-07-21 日立化成工業株式会社 感光性樹脂組成物、並びにこれを用いた感光性エレメント、ソルダーレジスト及びプリント配線板
KR101328840B1 (ko) * 2009-03-30 2013-11-13 아사히 가세이 이-매터리얼즈 가부시키가이샤 감광성 수지 조성물 및 그 적층체
TWI460537B (zh) * 2009-03-30 2014-11-11 Asahi Kasei E Materials Corp A photosensitive resin composition and a laminate thereof
CN102378940A (zh) * 2009-03-30 2012-03-14 旭化成电子材料株式会社 感光性树脂组合物及其层压体
WO2010116868A1 (ja) * 2009-03-30 2010-10-14 旭化成イーマテリアルズ株式会社 感光性樹脂組成物及びその積層体
JP5193361B2 (ja) * 2009-03-30 2013-05-08 旭化成イーマテリアルズ株式会社 感光性樹脂組成物及びその積層体
JP5486594B2 (ja) * 2009-05-20 2014-05-07 旭化成イーマテリアルズ株式会社 感光性樹脂組成物
CN102428406A (zh) * 2009-05-20 2012-04-25 旭化成电子材料株式会社 感光性树脂组合物
CN104111584A (zh) * 2009-05-20 2014-10-22 旭化成电子材料株式会社 感光性树脂组合物
CN102279527A (zh) * 2010-06-08 2011-12-14 住友化学株式会社 感光性树脂组合物
TWI506365B (zh) * 2010-06-08 2015-11-01 Sumitomo Chemical Co Photosensitive resin composition
CN103477283A (zh) * 2011-03-29 2013-12-25 旭化成电子材料株式会社 感光性树脂组合物及其层压体
CN103477283B (zh) * 2011-03-29 2017-03-01 旭化成株式会社 感光性树脂组合物及其层压体
WO2015012272A1 (ja) * 2013-07-23 2015-01-29 日立化成株式会社 投影露光用感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法、プリント配線板の製造方法及びリードフレームの製造方法
JPWO2015012272A1 (ja) * 2013-07-23 2017-03-02 日立化成株式会社 投影露光用感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法、プリント配線板の製造方法及びリードフレームの製造方法
US9989854B2 (en) 2013-07-23 2018-06-05 Hitachi Chemical Company, Ltd. Photosensitive resin composition for projection exposure, photosensitive element, method for forming resist pattern, process for producing printed wiring board and process for producing lead frame
WO2022181485A1 (ja) * 2021-02-26 2022-09-01 富士フイルム株式会社 積層体の製造方法、回路配線の製造方法

Also Published As

Publication number Publication date
CN101802710A (zh) 2010-08-11
JP5437072B2 (ja) 2014-03-12
JPWO2009038082A1 (ja) 2011-01-06
KR20100027227A (ko) 2010-03-10
KR101167536B1 (ko) 2012-07-20
TW200919085A (en) 2009-05-01
TWI376573B (enExample) 2012-11-11

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