TW200722911A - Photosensitive resin composition - Google Patents

Photosensitive resin composition

Info

Publication number
TW200722911A
TW200722911A TW095126253A TW95126253A TW200722911A TW 200722911 A TW200722911 A TW 200722911A TW 095126253 A TW095126253 A TW 095126253A TW 95126253 A TW95126253 A TW 95126253A TW 200722911 A TW200722911 A TW 200722911A
Authority
TW
Taiwan
Prior art keywords
structural unit
derived
resin composition
photosensitive resin
group
Prior art date
Application number
TW095126253A
Other languages
Chinese (zh)
Inventor
Kazuo Takebe
Michitaka Morikawa
Original Assignee
Sumitomo Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Chemical Co filed Critical Sumitomo Chemical Co
Publication of TW200722911A publication Critical patent/TW200722911A/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0048—Photosensitive materials characterised by the solvents or agents facilitating spreading, e.g. tensio-active agents
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators

Abstract

The photosensitive resin composition contains a binder resin (A), a photopolymerizable compound (B), a photopolymerization initiator (C) and a solvent (D), wherein the binder resin (A) comprises a polymer (AA) containing a structural unit (A1) derived from at least one kind of compound selected from a group consisting of unsaturated carboxylic acids and unsaturated carboxylic acid anhydrides, a structural unit (A2) derived from an unsaturated compound having at least one kind of group selected from a group consisting of active methylene groups and active methine groups, and a structural unit (A3) derived from a monomer copolymerizable with the structural unit (A1) and the structural unit (A2), however, (A3) excluding the structural unit (A1) and the structural unit (A2).
TW095126253A 2005-07-29 2006-07-18 Photosensitive resin composition TW200722911A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005220344A JP4645346B2 (en) 2005-07-29 2005-07-29 Photosensitive resin composition

Publications (1)

Publication Number Publication Date
TW200722911A true TW200722911A (en) 2007-06-16

Family

ID=37793442

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095126253A TW200722911A (en) 2005-07-29 2006-07-18 Photosensitive resin composition

Country Status (4)

Country Link
JP (1) JP4645346B2 (en)
KR (1) KR20070014998A (en)
CN (1) CN1940720B (en)
TW (1) TW200722911A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI670570B (en) * 2014-07-18 2019-09-01 日商日本觸媒股份有限公司 Curable resin composition and its use
TWI805554B (en) * 2016-07-28 2023-06-21 日商住友化學股份有限公司 Resin, curable resin composition and cured film

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100849360B1 (en) * 2007-02-13 2008-07-29 동우 화인켐 주식회사 A colored photosensitive resin composition, patterning method thereof, color filter, liquid crystal display device and imaging device having the same
JP4952467B2 (en) * 2007-09-14 2012-06-13 東洋インキＳｃホールディングス株式会社 Coloring composition for color filter and color filter using the same
KR20110126046A (en) * 2010-05-14 2011-11-22 제이에스알 가부시끼가이샤 Liquid crystal display device, positive radiation-sensitive composition, interlayer insulating film for liquid crystal display device and method for forming the same
JP6094050B2 (en) * 2011-04-15 2017-03-15 住友化学株式会社 Colored photosensitive resin composition
JP5810659B2 (en) 2011-06-17 2015-11-11 リコーイメージング株式会社 Camera body, lens barrel, and interchangeable lens camera
JP6060539B2 (en) * 2011-07-08 2017-01-18 住友化学株式会社 Photosensitive resin composition
JP5692655B2 (en) 2011-11-17 2015-04-01 株式会社リコー Image projection device
KR102235156B1 (en) * 2013-12-09 2021-04-05 롬엔드하스전자재료코리아유한회사 Negative-type photosensitive resin composition
JP6751611B2 (en) * 2016-07-11 2020-09-09 株式会社日本触媒 Curable resin composition and its use
CN108693708A (en) * 2017-04-12 2018-10-23 住友化学株式会社 Hardening resin composition and cured film
WO2023119900A1 (en) * 2021-12-21 2023-06-29 株式会社レゾナック Photosensitive resin composition and color filter

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2662673B2 (en) * 1988-03-09 1997-10-15 日本合成化学工業株式会社 Photosensitive resin composition
JPH03122647A (en) * 1989-10-05 1991-05-24 Hitachi Chem Co Ltd Photosensitive resin composition and photosensitive film using this composition
JP2003066592A (en) * 2001-08-27 2003-03-05 Konica Corp Photosensitive planographic printing plate
JP4317682B2 (en) * 2002-07-10 2009-08-19 富士フイルム株式会社 Image recording material
TWI281095B (en) * 2002-11-01 2007-05-11 Sumitomo Chemical Co Radiation sensitive resin composition

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI670570B (en) * 2014-07-18 2019-09-01 日商日本觸媒股份有限公司 Curable resin composition and its use
TWI805554B (en) * 2016-07-28 2023-06-21 日商住友化學股份有限公司 Resin, curable resin composition and cured film

Also Published As

Publication number Publication date
CN1940720B (en) 2011-02-16
CN1940720A (en) 2007-04-04
JP4645346B2 (en) 2011-03-09
KR20070014998A (en) 2007-02-01
JP2007034134A (en) 2007-02-08

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