WO2009038082A1 - 感光性樹脂組成物及びその積層体 - Google Patents

感光性樹脂組成物及びその積層体 Download PDF

Info

Publication number
WO2009038082A1
WO2009038082A1 PCT/JP2008/066756 JP2008066756W WO2009038082A1 WO 2009038082 A1 WO2009038082 A1 WO 2009038082A1 JP 2008066756 W JP2008066756 W JP 2008066756W WO 2009038082 A1 WO2009038082 A1 WO 2009038082A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin composition
photosensitive resin
mass
polymerizable monomer
addition polymerizable
Prior art date
Application number
PCT/JP2008/066756
Other languages
English (en)
French (fr)
Inventor
Yamato Tsutsui
Original Assignee
Asahi Kasei E-Materials Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Kasei E-Materials Corporation filed Critical Asahi Kasei E-Materials Corporation
Priority to KR1020107001284A priority Critical patent/KR101167536B1/ko
Priority to JP2009533153A priority patent/JP5437072B2/ja
Priority to CN200880107510A priority patent/CN101802710A/zh
Publication of WO2009038082A1 publication Critical patent/WO2009038082A1/ja

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
    • C08F212/02—Monomers containing only one unsaturated aliphatic radical
    • C08F212/04—Monomers containing only one unsaturated aliphatic radical containing one ring
    • C08F212/06—Hydrocarbons
    • C08F212/08—Styrene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
    • C08F220/30—Esters containing oxygen in addition to the carboxy oxygen containing aromatic rings in the alcohol moiety
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10—Esters
    • C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
    • C08F222/102—Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10—Esters
    • C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
    • C08F222/106—Esters of polycondensation macromers
    • C08F222/1063—Esters of polycondensation macromers of alcohol terminated polyethers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
    • C09D4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09D159/00 - C09D187/00
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes

Abstract

　（ａ）カルボキシル基含有量が酸当量で１００～６００であり、共重合成分として特定の化合物を含有し、かつ、重量平均分子量が５，０００～５００，０００であるバインダー用樹脂　２０～９０質量％、（ｂ）少なくとも一つの末端エチレン性不飽和基を有する付加重合性モノマー　５～７５質量％、及び（ｃ）光重合開始剤　０．０１～３０質量％、を含有する感光性樹脂組成物であって、該付加重合性モノマー（ｂ）が、特定の付加重合性モノマーを含有する、上記感光性樹脂組成物。
PCT/JP2008/066756 2007-09-18 2008-09-17 感光性樹脂組成物及びその積層体 WO2009038082A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020107001284A KR101167536B1 (ko) 2007-09-18 2008-09-17 감광성 수지 조성물 및 그 적층체
JP2009533153A JP5437072B2 (ja) 2007-09-18 2008-09-17 感光性樹脂組成物及びその積層体
CN200880107510A CN101802710A (zh) 2007-09-18 2008-09-17 感光性树脂组合物以及其层压体

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007241007 2007-09-18
JP2007-241007 2007-09-18

Publications (1)

Publication Number Publication Date
WO2009038082A1 true WO2009038082A1 (ja) 2009-03-26

Family

ID=40467892

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/066756 WO2009038082A1 (ja) 2007-09-18 2008-09-17 感光性樹脂組成物及びその積層体

Country Status (5)

Country Link
JP (1) JP5437072B2 (ja)
KR (1) KR101167536B1 (ja)
CN (1) CN101802710A (ja)
TW (1) TW200919085A (ja)
WO (1) WO2009038082A1 (ja)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010116868A1 (ja) * 2009-03-30 2010-10-14 旭化成イーマテリアルズ株式会社 感光性樹脂組成物及びその積層体
JPWO2009116401A1 (ja) * 2008-03-17 2011-07-21 日立化成工業株式会社 感光性樹脂組成物、並びにこれを用いた感光性エレメント、ソルダーレジスト及びプリント配線板
CN102279527A (zh) * 2010-06-08 2011-12-14 住友化学株式会社 感光性树脂组合物
CN102428406A (zh) * 2009-05-20 2012-04-25 旭化成电子材料株式会社 感光性树脂组合物
CN103477283A (zh) * 2011-03-29 2013-12-25 旭化成电子材料株式会社 感光性树脂组合物及其层压体
WO2015012272A1 (ja) * 2013-07-23 2015-01-29 日立化成株式会社 投影露光用感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法、プリント配線板の製造方法及びリードフレームの製造方法
TWI506365B (zh) * 2010-06-08 2015-11-01 Sumitomo Chemical Co Photosensitive resin composition
WO2022181485A1 (ja) * 2021-02-26 2022-09-01 富士フイルム株式会社 積層体の製造方法、回路配線の製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05163318A (ja) * 1991-12-16 1993-06-29 Japan Synthetic Rubber Co Ltd 液状硬化性樹脂組成物
JP2001125264A (ja) * 1999-10-25 2001-05-11 Toagosei Co Ltd 硬化型組成物
JP2006234995A (ja) * 2005-02-23 2006-09-07 Asahi Kasei Electronics Co Ltd 光重合性樹脂組成物
JP2006336006A (ja) * 2005-04-01 2006-12-14 Three D Syst Inc イメージ・プロジェクション・システムに有用な放射線硬化性組成物
JP2007128057A (ja) * 2005-10-05 2007-05-24 Asahi Kasei Electronics Co Ltd 感光性樹脂組成物及び積層体

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2719799B2 (ja) * 1988-10-14 1998-02-25 日本合成化学工業株式会社 感光性樹脂組成物
JP3957364B2 (ja) * 1997-02-06 2007-08-15 旭化成エレクトロニクス株式会社 光重合性組成物
JP2004085781A (ja) * 2002-08-26 2004-03-18 Toagosei Co Ltd 架橋硬化型樹脂組成物
JP4346315B2 (ja) * 2003-01-14 2009-10-21 旭化成イーマテリアルズ株式会社 感光性樹脂組成物およびその用途
JP4300847B2 (ja) * 2003-04-01 2009-07-22 Ｊｓｒ株式会社 感光性樹脂膜およびこれからなる硬化膜
JP4360242B2 (ja) * 2004-03-24 2009-11-11 Ｊｓｒ株式会社 ネガ型感放射線性樹脂組成物
JP2006259716A (ja) * 2005-02-21 2006-09-28 Toray Ind Inc 感光性着色組成物およびカラーフィルター

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05163318A (ja) * 1991-12-16 1993-06-29 Japan Synthetic Rubber Co Ltd 液状硬化性樹脂組成物
JP2001125264A (ja) * 1999-10-25 2001-05-11 Toagosei Co Ltd 硬化型組成物
JP2006234995A (ja) * 2005-02-23 2006-09-07 Asahi Kasei Electronics Co Ltd 光重合性樹脂組成物
JP2006336006A (ja) * 2005-04-01 2006-12-14 Three D Syst Inc イメージ・プロジェクション・システムに有用な放射線硬化性組成物
JP2007128057A (ja) * 2005-10-05 2007-05-24 Asahi Kasei Electronics Co Ltd 感光性樹脂組成物及び積層体

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2009116401A1 (ja) * 2008-03-17 2011-07-21 日立化成工業株式会社 感光性樹脂組成物、並びにこれを用いた感光性エレメント、ソルダーレジスト及びプリント配線板
JP5126354B2 (ja) * 2008-03-17 2013-01-23 日立化成工業株式会社 感光性樹脂組成物、並びにこれを用いた感光性エレメント、ソルダーレジスト及びプリント配線板
CN102378940A (zh) * 2009-03-30 2012-03-14 旭化成电子材料株式会社 感光性树脂组合物及其层压体
JP5193361B2 (ja) * 2009-03-30 2013-05-08 旭化成イーマテリアルズ株式会社 感光性樹脂組成物及びその積層体
KR101328840B1 (ko) * 2009-03-30 2013-11-13 아사히 가세이 이-매터리얼즈 가부시키가이샤 감광성 수지 조성물 및 그 적층체
WO2010116868A1 (ja) * 2009-03-30 2010-10-14 旭化成イーマテリアルズ株式会社 感光性樹脂組成物及びその積層体
TWI460537B (zh) * 2009-03-30 2014-11-11 Asahi Kasei E Materials Corp A photosensitive resin composition and a laminate thereof
CN102428406A (zh) * 2009-05-20 2012-04-25 旭化成电子材料株式会社 感光性树脂组合物
JP5486594B2 (ja) * 2009-05-20 2014-05-07 旭化成イーマテリアルズ株式会社 感光性樹脂組成物
CN104111584A (zh) * 2009-05-20 2014-10-22 旭化成电子材料株式会社 感光性树脂组合物
TWI506365B (zh) * 2010-06-08 2015-11-01 Sumitomo Chemical Co Photosensitive resin composition
CN102279527A (zh) * 2010-06-08 2011-12-14 住友化学株式会社 感光性树脂组合物
CN103477283A (zh) * 2011-03-29 2013-12-25 旭化成电子材料株式会社 感光性树脂组合物及其层压体
CN103477283B (zh) * 2011-03-29 2017-03-01 旭化成株式会社 感光性树脂组合物及其层压体
WO2015012272A1 (ja) * 2013-07-23 2015-01-29 日立化成株式会社 投影露光用感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法、プリント配線板の製造方法及びリードフレームの製造方法
JPWO2015012272A1 (ja) * 2013-07-23 2017-03-02 日立化成株式会社 投影露光用感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法、プリント配線板の製造方法及びリードフレームの製造方法
US9989854B2 (en) 2013-07-23 2018-06-05 Hitachi Chemical Company, Ltd. Photosensitive resin composition for projection exposure, photosensitive element, method for forming resist pattern, process for producing printed wiring board and process for producing lead frame
WO2022181485A1 (ja) * 2021-02-26 2022-09-01 富士フイルム株式会社 積層体の製造方法、回路配線の製造方法

Also Published As

Publication number Publication date
KR20100027227A (ko) 2010-03-10
JPWO2009038082A1 (ja) 2011-01-06
JP5437072B2 (ja) 2014-03-12
KR101167536B1 (ko) 2012-07-20
CN101802710A (zh) 2010-08-11
TW200919085A (en) 2009-05-01
TWI376573B (ja) 2012-11-11

Similar Documents

Publication Publication Date Title
WO2009038082A1 (ja) 感光性樹脂組成物及びその積層体
EP2047837A3 (en) Dental adhesive and method of use
WO2007007065A3 (en) Bone cement composition
JP2006526563A5 (ja)
WO2008126526A1 (ja) 感光性樹脂組成物および積層体
WO2009022724A1 (ja) 感光性樹脂組成物及びその積層体
EP2363443A3 (en) Multiphase acrylic adhesives
WO2007028600A3 (en) Polymer and composition
HK1150619A1 (en) Fluoropolymer emulsions
WO2004014926A8 (fr) Alcoxyamines issues de nitroxydes βετα-phosphores, leur utilisation en polymerisation radicalaire
EP1696013A3 (en) Pressure sensitive adhesive and patch
TW200715050A (en) Photosensitive resin composition and photosensitive element using the same
EP1783548A3 (en) Photosensitive composition
ATE418590T1 (de) Strahlungshärtbare glanzarme pulverlacke
TW200722911A (en) Photosensitive resin composition
EP1939687A3 (en) Polymerizable composition, lithographic printing plate precursor and lithographic printing method
WO2009041017A1 (ja) 樹脂組成物
JP2007536554A5 (ja)
TW200702387A (en) Polycarbonate resin composition having good chemical resistance and flowability
GB0314671D0 (en) Intumescent coating compositions
TWI266143B (en) Photosensitive resin compositions and photosensitive dry film using the same
WO2008099655A1 (ja) 感光性樹脂組成物及び積層体
DK1294816T3 (da) Vandig bindemiddelsammensætning
WO2009051045A1 (ja) １液型歯面被覆材
WO2004048425A3 (en) Polyamphoteric superabsorbent copolymers

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200880107510.1

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08832114

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2009533153

Country of ref document: JP

Kind code of ref document: A

ENP Entry into the national phase

Ref document number: 20107001284

Country of ref document: KR

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08832114

Country of ref document: EP

Kind code of ref document: A1