TW200919085A - Photosensitive resin composition and laminate thereof - Google Patents

Photosensitive resin composition and laminate thereof Download PDF

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Publication number
TW200919085A
TW200919085A TW097135508A TW97135508A TW200919085A TW 200919085 A TW200919085 A TW 200919085A TW 097135508 A TW097135508 A TW 097135508A TW 97135508 A TW97135508 A TW 97135508A TW 200919085 A TW200919085 A TW 200919085A
Authority
TW
Taiwan
Prior art keywords
group
photosensitive resin
substrate
resin composition
mass
Prior art date
Application number
TW097135508A
Other languages
English (en)
Chinese (zh)
Other versions
TWI376573B (ja
Inventor
Yamato Tsutsui
Original Assignee
Asahi Kasei Emd Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Kasei Emd Corp filed Critical Asahi Kasei Emd Corp
Publication of TW200919085A publication Critical patent/TW200919085A/zh
Application granted granted Critical
Publication of TWI376573B publication Critical patent/TWI376573B/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
    • C08F212/02—Monomers containing only one unsaturated aliphatic radical
    • C08F212/04—Monomers containing only one unsaturated aliphatic radical containing one ring
    • C08F212/06—Hydrocarbons
    • C08F212/08—Styrene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
    • C08F220/30—Esters containing oxygen in addition to the carboxy oxygen containing aromatic rings in the alcohol moiety
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10—Esters
    • C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
    • C08F222/102—Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10—Esters
    • C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
    • C08F222/106—Esters of polycondensation macromers
    • C08F222/1063—Esters of polycondensation macromers of alcohol terminated polyethers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
    • C09D4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09D159/00 - C09D187/00
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Polymerisation Methods In General (AREA)
  • Laminated Bodies (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Graft Or Block Polymers (AREA)
TW097135508A 2007-09-18 2008-09-16 Photosensitive resin composition and laminate thereof TW200919085A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007241007 2007-09-18

Publications (2)

Publication Number Publication Date
TW200919085A true TW200919085A (en) 2009-05-01
TWI376573B TWI376573B (ja) 2012-11-11

Family

ID=40467892

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097135508A TW200919085A (en) 2007-09-18 2008-09-16 Photosensitive resin composition and laminate thereof

Country Status (5)

Country Link
JP (1) JP5437072B2 (ja)
KR (1) KR101167536B1 (ja)
CN (1) CN101802710A (ja)
TW (1) TW200919085A (ja)
WO (1) WO2009038082A1 (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009116401A1 (ja) * 2008-03-17 2009-09-24 日立化成工業株式会社 感光性樹脂組成物、並びにこれを用いた感光性エレメント、ソルダーレジスト及びプリント配線板
CN102378940A (zh) * 2009-03-30 2012-03-14 旭化成电子材料株式会社 感光性树脂组合物及其层压体
CN102428406B (zh) * 2009-05-20 2014-09-03 旭化成电子材料株式会社 感光性树脂组合物
KR101860155B1 (ko) * 2010-06-08 2018-05-21 스미또모 가가꾸 가부시끼가이샤 감광성 수지 조성물
JP5697965B2 (ja) * 2010-06-08 2015-04-08 住友化学株式会社 感光性樹脂組成物
WO2012131912A1 (ja) * 2011-03-29 2012-10-04 旭化成イーマテリアルズ株式会社 感光性樹脂組成物及びその積層体
JP6432511B2 (ja) * 2013-07-23 2018-12-05 日立化成株式会社 投影露光用感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法、プリント配線板の製造方法及びリードフレームの製造方法
JPWO2022181485A1 (ja) * 2021-02-26 2022-09-01

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2719799B2 (ja) * 1988-10-14 1998-02-25 日本合成化学工業株式会社 感光性樹脂組成物
JP3196269B2 (ja) * 1991-12-16 2001-08-06 ジェイエスアール株式会社 液状硬化性樹脂組成物
JP3957364B2 (ja) * 1997-02-06 2007-08-15 旭化成エレクトロニクス株式会社 光重合性組成物
JP2001125264A (ja) 1999-10-25 2001-05-11 Toagosei Co Ltd 硬化型組成物
JP2004085781A (ja) * 2002-08-26 2004-03-18 Toagosei Co Ltd 架橋硬化型樹脂組成物
JP4346315B2 (ja) * 2003-01-14 2009-10-21 旭化成イーマテリアルズ株式会社 感光性樹脂組成物およびその用途
JP4300847B2 (ja) * 2003-04-01 2009-07-22 Ｊｓｒ株式会社 感光性樹脂膜およびこれからなる硬化膜
JP4360242B2 (ja) * 2004-03-24 2009-11-11 Ｊｓｒ株式会社 ネガ型感放射線性樹脂組成物
JP2006259716A (ja) * 2005-02-21 2006-09-28 Toray Ind Inc 感光性着色組成物およびカラーフィルター
JP4578269B2 (ja) * 2005-02-23 2010-11-10 旭化成イーマテリアルズ株式会社 光重合性樹脂組成物
US7358283B2 (en) 2005-04-01 2008-04-15 3D Systems, Inc. Radiation curable compositions useful in image projection systems
JP4749305B2 (ja) * 2005-10-05 2011-08-17 旭化成イーマテリアルズ株式会社 感光性樹脂組成物及び積層体

Also Published As

Publication number Publication date
WO2009038082A1 (ja) 2009-03-26
JPWO2009038082A1 (ja) 2011-01-06
KR20100027227A (ko) 2010-03-10
CN101802710A (zh) 2010-08-11
KR101167536B1 (ko) 2012-07-20
TWI376573B (ja) 2012-11-11
JP5437072B2 (ja) 2014-03-12

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