KR101151077B1 - 표면검사장치 - Google Patents

표면검사장치 Download PDF

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Publication number
KR101151077B1
KR101151077B1 KR1020067010222A KR20067010222A KR101151077B1 KR 101151077 B1 KR101151077 B1 KR 101151077B1 KR 1020067010222 A KR1020067010222 A KR 1020067010222A KR 20067010222 A KR20067010222 A KR 20067010222A KR 101151077 B1 KR101151077 B1 KR 101151077B1
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KR
South Korea
Prior art keywords
repeating pattern
polarized light
light
linearly polarized
repeating
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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KR1020067010222A
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English (en)
Korean (ko)
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KR20060120145A (ko
Inventor
가즈히코 후카자와
고이치로 고마쓰
다케오 오오모리
Original Assignee
가부시키가이샤 니콘
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Application filed by 가부시키가이샤 니콘 filed Critical 가부시키가이샤 니콘
Publication of KR20060120145A publication Critical patent/KR20060120145A/ko
Application granted granted Critical
Publication of KR101151077B1 publication Critical patent/KR101151077B1/ko
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Expired - Lifetime legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/21—Polarisation-affecting properties
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices By Optical Means (AREA)
KR1020067010222A 2003-10-27 2004-10-27 표면검사장치 Expired - Lifetime KR101151077B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2003366255 2003-10-27
JPJP-P-2003-00366255 2003-10-27
PCT/JP2004/015925 WO2005040776A1 (ja) 2003-10-27 2004-10-27 表面検査装置および表面検査方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020127003718A Division KR101346492B1 (ko) 2003-10-27 2004-10-27 패턴 검사장치 및 패턴 검사방법

Publications (2)

Publication Number Publication Date
KR20060120145A KR20060120145A (ko) 2006-11-24
KR101151077B1 true KR101151077B1 (ko) 2012-06-01

Family

ID=34510228

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020067010222A Expired - Lifetime KR101151077B1 (ko) 2003-10-27 2004-10-27 표면검사장치
KR1020127003718A Expired - Lifetime KR101346492B1 (ko) 2003-10-27 2004-10-27 패턴 검사장치 및 패턴 검사방법

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020127003718A Expired - Lifetime KR101346492B1 (ko) 2003-10-27 2004-10-27 패턴 검사장치 및 패턴 검사방법

Country Status (5)

Country Link
US (4) US7298471B2 (enExample)
JP (2) JP4552859B2 (enExample)
KR (2) KR101151077B1 (enExample)
TW (1) TW200519373A (enExample)
WO (1) WO2005040776A1 (enExample)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005064322A1 (ja) * 2003-12-26 2005-07-14 Nikon Corporation 欠陥検査装置および欠陥検査方法
JP4802481B2 (ja) * 2004-11-09 2011-10-26 株式会社ニコン 表面検査装置および表面検査方法および露光システム
US20060099344A1 (en) 2004-11-09 2006-05-11 Eastman Kodak Company Controlling the vaporization of organic material
KR20080079173A (ko) * 2005-12-14 2008-08-29 가부시키가이샤 니콘 표면검사장치 및 표면검사방법
JP2007192780A (ja) * 2006-01-23 2007-08-02 Ono Sokki Co Ltd 空間フィルタ方式の速度検出装置及び空間フィルタ方式の速度検出装置の速度検出方法
JP4635939B2 (ja) * 2006-03-30 2011-02-23 株式会社ニコン 表面検査装置
JP4548385B2 (ja) * 2006-05-10 2010-09-22 株式会社ニコン 表面検査装置
JP4605089B2 (ja) * 2006-05-10 2011-01-05 株式会社ニコン 表面検査装置
JP4595881B2 (ja) * 2006-05-15 2010-12-08 株式会社ニコン 表面検査装置
JP4622933B2 (ja) * 2006-05-15 2011-02-02 株式会社ニコン 表面検査方法及び表面検査装置
JP4506723B2 (ja) * 2006-05-22 2010-07-21 株式会社ニコン 表面検査装置
JP4692892B2 (ja) * 2006-06-01 2011-06-01 株式会社ニコン 表面検査装置
JP4552202B2 (ja) * 2006-06-06 2010-09-29 株式会社ニコン 表面検査装置
KR101382020B1 (ko) * 2006-07-14 2014-04-04 가부시키가이샤 니콘 표면 검사 장치
JP5022648B2 (ja) * 2006-08-11 2012-09-12 東京エレクトロン株式会社 欠陥検査方法および欠陥検査装置
JP4910637B2 (ja) * 2006-10-31 2012-04-04 凸版印刷株式会社 基板検査装置及び基板検査方法
JP5024935B2 (ja) * 2007-01-16 2012-09-12 富士フイルム株式会社 光透過性部材の欠陥検出装置及び方法
CN101622525A (zh) * 2007-02-28 2010-01-06 株式会社尼康 观察方法、检查装置及检查方法
JP2008249386A (ja) * 2007-03-29 2008-10-16 Dainippon Screen Mfg Co Ltd 欠陥検査装置および欠陥検査方法
US7990546B2 (en) * 2007-07-16 2011-08-02 Applied Materials Israel, Ltd. High throughput across-wafer-variation mapping
JP5370155B2 (ja) * 2007-10-12 2013-12-18 株式会社ニコン 表面検査装置及び表面検査方法
KR101477569B1 (ko) * 2008-07-29 2014-12-30 어플라이드 머티리얼즈 이스라엘 리미티드 기판의 편차 맵핑
US8040510B2 (en) * 2008-08-22 2011-10-18 Novasolar Holdings Limited Spatially precise optical treatment or measurement of targets through intervening birefringent layers
US20100300259A1 (en) * 2009-05-29 2010-12-02 Applied Materials, Inc. Substrate side marking and identification
TW201115624A (en) * 2009-07-01 2011-05-01 Nikon Corp Exposure condition setting method and surface inspection apparatus
KR20120045774A (ko) * 2010-11-01 2012-05-09 삼성전자주식회사 웨이퍼 검사 방법
US10460998B2 (en) * 2010-11-09 2019-10-29 Nikon Corporation Method for inspecting substrate, substrate inspection apparatus, exposure system, and method for producing semiconductor device
FR2994734B1 (fr) * 2012-08-21 2017-08-25 Fogale Nanotech Dispositif et procede pour faire des mesures dimensionnelles sur des objets multi-couches tels que des wafers.
US9485491B2 (en) * 2014-12-15 2016-11-01 Test Research, Inc. Optical system
US10594835B2 (en) 2015-06-05 2020-03-17 Apple Inc. Efficient context monitoring
US12227271B1 (en) 2023-09-11 2025-02-18 Wavetamer Llc Deceleration of gyroscopic boat roll stabilizer

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002116011A (ja) * 2000-10-05 2002-04-19 Toshiba Corp パターン評価装置及びパターン評価方法

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53106082A (en) * 1977-02-28 1978-09-14 Nippon Bunko Kogyo Kk Fluorescent polarization measuring device
JPH0743322B2 (ja) * 1985-07-19 1995-05-15 株式会社日立製作所 検査方法および装置
JPS6270738A (ja) * 1985-09-25 1987-04-01 Hitachi Electronics Eng Co Ltd 異物検出方法
JPH01107139A (ja) * 1987-10-20 1989-04-25 Fujitsu Ltd パターン検知装置
US5046847A (en) * 1987-10-30 1991-09-10 Hitachi Ltd. Method for detecting foreign matter and device for realizing same
JPH0786465B2 (ja) * 1987-10-30 1995-09-20 株式会社日立製作所 異物検出方法及び装置
JPH0212002A (ja) * 1988-06-30 1990-01-17 Fujitsu Ltd パターン検査方法およびパターン検査装置
JP3255709B2 (ja) * 1992-06-17 2002-02-12 オリンパス光学工業株式会社 基板外観検査装置
JP3150203B2 (ja) * 1992-07-13 2001-03-26 株式会社日立製作所 パターン検出方法とその装置
US5432607A (en) * 1993-02-22 1995-07-11 International Business Machines Corporation Method and apparatus for inspecting patterned thin films using diffracted beam ellipsometry
JPH07120234A (ja) 1993-10-27 1995-05-12 Fujitsu Ltd 外観検査方法及び装置
JP3613402B2 (ja) * 1993-10-28 2005-01-26 テンカー・インストルメンツ 光学顕微鏡を用いて緻密なライン幅構造を映像化する方法及び装置
JP3388285B2 (ja) * 1993-12-27 2003-03-17 株式会社ニュークリエイション 検査装置
US5777744A (en) * 1995-05-16 1998-07-07 Canon Kabushiki Kaisha Exposure state detecting system and exposure apparatus using the same
US5835220A (en) * 1995-10-27 1998-11-10 Nkk Corporation Method and apparatus for detecting surface flaws
US6594012B2 (en) * 1996-07-05 2003-07-15 Canon Kabushiki Kaisha Exposure apparatus
JP3692685B2 (ja) 1997-02-19 2005-09-07 株式会社ニコン 欠陥検査装置
US6034776A (en) * 1997-04-16 2000-03-07 The United States Of America As Represented By The Secretary Of Commerce Microroughness-blind optical scattering instrument
DE19914994A1 (de) * 1998-04-03 1999-10-14 Advantest Corp Verfahren und Vorrichtung zur Oberflächenprüfung
JPH11295231A (ja) * 1998-04-07 1999-10-29 Advantest Corp 表面検査装置および方法
US6690469B1 (en) * 1998-09-18 2004-02-10 Hitachi, Ltd. Method and apparatus for observing and inspecting defects
JP3610837B2 (ja) * 1998-09-18 2005-01-19 株式会社日立製作所 試料表面の観察方法及びその装置並びに欠陥検査方法及びその装置
JP4469047B2 (ja) * 2000-01-27 2010-05-26 株式会社日立ハイテクノロジーズ 表面検査装置
JP3425923B2 (ja) * 2000-03-27 2003-07-14 Ｎｅｃエレクトロニクス株式会社 異方性多層薄膜構造体の評価法及び評価装置
JP3858571B2 (ja) * 2000-07-27 2006-12-13 株式会社日立製作所 パターン欠陥検査方法及びその装置
US6646735B2 (en) * 2000-09-13 2003-11-11 Nikon Corporation Surface inspection apparatus and surface inspection method
JP4591802B2 (ja) * 2000-09-13 2010-12-01 株式会社ニコン 表面検査装置および方法
JP4662194B2 (ja) * 2001-06-22 2011-03-30 株式会社ニコン 検査装置
US6768543B1 (en) * 2001-11-01 2004-07-27 Arun Ananth Aiyer Wafer inspection apparatus with unique illumination methodology and method of operation
US7006224B2 (en) * 2002-12-30 2006-02-28 Applied Materials, Israel, Ltd. Method and system for optical inspection of an object

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002116011A (ja) * 2000-10-05 2002-04-19 Toshiba Corp パターン評価装置及びパターン評価方法

Also Published As

Publication number Publication date
US20060192953A1 (en) 2006-08-31
WO2005040776A1 (ja) 2005-05-06
US20100225906A1 (en) 2010-09-09
US7834993B2 (en) 2010-11-16
TW200519373A (en) 2005-06-16
US8441627B2 (en) 2013-05-14
JPWO2005040776A1 (ja) 2007-11-22
US7298471B2 (en) 2007-11-20
JP4552859B2 (ja) 2010-09-29
KR20120031239A (ko) 2012-03-30
JP2010256359A (ja) 2010-11-11
US20130100448A1 (en) 2013-04-25
US8687182B2 (en) 2014-04-01
US20080094628A1 (en) 2008-04-24
KR101346492B1 (ko) 2013-12-31
KR20060120145A (ko) 2006-11-24
TWI355488B (enExample) 2012-01-01

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