KR101135772B1 - 무용제형 폴리이미드 실리콘 수지 조성물 및 그의 경화수지 피막 - Google Patents

무용제형 폴리이미드 실리콘 수지 조성물 및 그의 경화수지 피막 Download PDF

Info

Publication number
KR101135772B1
KR101135772B1 KR1020050083622A KR20050083622A KR101135772B1 KR 101135772 B1 KR101135772 B1 KR 101135772B1 KR 1020050083622 A KR1020050083622 A KR 1020050083622A KR 20050083622 A KR20050083622 A KR 20050083622A KR 101135772 B1 KR101135772 B1 KR 101135772B1
Authority
KR
South Korea
Prior art keywords
silicone resin
polyimide silicone
group
solvent
formula
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020050083622A
Other languages
English (en)
Korean (ko)
Other versions
KR20060051106A (ko
Inventor
요시노리 요네다
미찌히로 스고
Original Assignee
신에쓰 가가꾸 고교 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 신에쓰 가가꾸 고교 가부시끼가이샤 filed Critical 신에쓰 가가꾸 고교 가부시끼가이샤
Publication of KR20060051106A publication Critical patent/KR20060051106A/ko
Application granted granted Critical
Publication of KR101135772B1 publication Critical patent/KR101135772B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/42—Block-or graft-polymers containing polysiloxane sequences
    • C08G77/452—Block-or graft-polymers containing polysiloxane sequences containing nitrogen-containing sequences
    • C08G77/455—Block-or graft-polymers containing polysiloxane sequences containing nitrogen-containing sequences containing polyamide, polyesteramide or polyimide sequences
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Polymerisation Methods In General (AREA)
  • Paints Or Removers (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Organic Insulating Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
KR1020050083622A 2004-09-09 2005-09-08 무용제형 폴리이미드 실리콘 수지 조성물 및 그의 경화수지 피막 Expired - Fee Related KR101135772B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2004262005 2004-09-09
JPJP-P-2004-00262005 2004-09-09
JPJP-P-2005-00234548 2005-08-12
JP2005234548A JP4372065B2 (ja) 2004-09-09 2005-08-12 無溶剤型ポリイミドシリコーン樹脂組成物及びその硬化樹脂皮膜

Publications (2)

Publication Number Publication Date
KR20060051106A KR20060051106A (ko) 2006-05-19
KR101135772B1 true KR101135772B1 (ko) 2012-04-16

Family

ID=35427957

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020050083622A Expired - Fee Related KR101135772B1 (ko) 2004-09-09 2005-09-08 무용제형 폴리이미드 실리콘 수지 조성물 및 그의 경화수지 피막

Country Status (6)

Country Link
US (1) US7432313B2 (enExample)
EP (1) EP1634907B1 (enExample)
JP (1) JP4372065B2 (enExample)
KR (1) KR101135772B1 (enExample)
DE (1) DE602005005588T2 (enExample)
TW (1) TW200615281A (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4602151B2 (ja) * 2004-04-22 2010-12-22 信越化学工業株式会社 無溶剤型ポリイミドシリコーン系樹脂組成物及びこれを用いた樹脂皮膜
WO2007052540A1 (ja) * 2005-11-01 2007-05-10 Jsr Corporation 感光性樹脂組成物
JP4771100B2 (ja) 2008-08-27 2011-09-14 信越化学工業株式会社 無溶剤型ポリイミドシリコーン系樹脂組成物及びその硬化物
JP5457051B2 (ja) * 2009-03-05 2014-04-02 新日鉄住金化学株式会社 位相差フィルム及びその製造方法
CN102666658B (zh) * 2009-12-22 2013-09-25 新日铁住金化学株式会社 聚酰亚胺树脂、其制造方法、粘接剂树脂组合物、覆盖膜以及电路基板
TWI362398B (en) * 2009-12-31 2012-04-21 Ind Tech Res Inst Polyimide polymers for flexible electrical device substrate material and flexible electrical devices comprising the same
RU2414762C1 (ru) * 2010-03-26 2011-03-20 Федеральное государственное унитарное предприятие "Особое конструкторское бюро кабельной промышленности" Радиационно-сшиваемая композиция на основе фторуглеродного полимера
KR102154158B1 (ko) * 2013-04-03 2020-09-09 닛산 가가쿠 가부시키가이샤 무용제형 광경화성 수지 조성물
US11997768B2 (en) 2014-09-28 2024-05-28 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and LED light bulb
US11543083B2 (en) 2014-09-28 2023-01-03 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and LED light bulb
CN106133025B (zh) 2015-03-05 2019-03-12 株式会社Lg化学 用于生产光电器件的柔性板的聚酰亚胺膜的组合物
JP6763139B2 (ja) 2015-12-25 2020-09-30 信越化学工業株式会社 無溶剤型シリコーン変性ポリイミド樹脂組成物
JP2017222745A (ja) 2016-06-14 2017-12-21 信越化学工業株式会社 無溶剤型シリコーン変性ポリイミド樹脂組成物
US10982048B2 (en) * 2018-04-17 2021-04-20 Jiaxing Super Lighting Electric Appliance Co., Ltd Organosilicon-modified polyimide resin composition and use thereof
CN115066474B (zh) * 2020-05-08 2025-01-03 积水化学工业株式会社 粘合剂组合物、粘合带、及电子部件的处理方法
CN117662093A (zh) * 2022-08-30 2024-03-08 中国石油化工股份有限公司 耐酸可溶球及其制备方法与应用

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07268098A (ja) * 1994-03-31 1995-10-17 Nippon Steel Chem Co Ltd ポリイミド樹脂及び耐熱接着剤
JP2002012667A (ja) 2000-06-29 2002-01-15 Shin Etsu Chem Co Ltd ポリイミドシリコーン樹脂、その溶液組成物、およびポリイミドシリコーン樹脂皮膜

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4499149A (en) * 1980-12-15 1985-02-12 M&T Chemicals Inc. Siloxane-containing polymers
JP3211108B2 (ja) * 1992-06-25 2001-09-25 チッソ株式会社 感光性樹脂組成物
JP3865046B2 (ja) 2001-05-08 2007-01-10 信越化学工業株式会社 無溶剤型ポリイミドシリコーン系樹脂組成物
WO2003038526A1 (fr) * 2001-10-30 2003-05-08 Kaneka Corporation Composition de resine photosensible et films et stratifies photosensibles ainsi obtenus
US7041766B2 (en) 2002-10-10 2006-05-09 Shin-Etsu Chemical Co., Ltd Colorless and transparent polyimidesilicone resin having thermosetting functional groups
JP4204435B2 (ja) 2002-10-10 2009-01-07 信越化学工業株式会社 熱硬化性基を含有する透明ポリイミドシリコーン樹脂

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07268098A (ja) * 1994-03-31 1995-10-17 Nippon Steel Chem Co Ltd ポリイミド樹脂及び耐熱接着剤
JP2002012667A (ja) 2000-06-29 2002-01-15 Shin Etsu Chem Co Ltd ポリイミドシリコーン樹脂、その溶液組成物、およびポリイミドシリコーン樹脂皮膜

Also Published As

Publication number Publication date
KR20060051106A (ko) 2006-05-19
JP2006104447A (ja) 2006-04-20
TW200615281A (en) 2006-05-16
EP1634907B1 (en) 2008-03-26
TWI370138B (enExample) 2012-08-11
DE602005005588T2 (de) 2009-05-07
EP1634907A1 (en) 2006-03-15
DE602005005588D1 (de) 2008-05-08
US7432313B2 (en) 2008-10-07
JP4372065B2 (ja) 2009-11-25
US20060052476A1 (en) 2006-03-09

Similar Documents

Publication Publication Date Title
KR100821069B1 (ko) 무용제형 폴리이미드 실리콘계 수지 조성물 및 이를사용한 수지 피막
KR101392539B1 (ko) 폴리이미드 전구체 및 이 폴리이미드 전구체를 포함하는 감광성 수지 조성물
KR20060051106A (ko) 무용제형 폴리이미드 실리콘 수지 조성물 및 그의 경화수지 피막
EP2492331B1 (en) Photosensitive adhesive composition, photosensitive adhesive sheet, and semiconductor devices using same
KR20090025155A (ko) 열경화성 폴리이미드 실리콘 수지 조성물
US10550287B2 (en) Solvent-free silicone-modified polyimide resin composition
JP5485802B2 (ja) ポリイミド前駆体、感光性樹脂組成物及びテトラカルボン酸二無水物
JP2008308551A (ja) 新規ポリアミド酸、ポリイミド並びにその用途
JP2606402B2 (ja) 硬化性樹脂及びその製造方法
KR20070093056A (ko) 불포화기 함유 폴리이미드 수지, 이를 함유하는 감광성수지 조성물 및 그의 경화물
JP4602151B2 (ja) 無溶剤型ポリイミドシリコーン系樹脂組成物及びこれを用いた樹脂皮膜
KR20040032779A (ko) 열경화성기를 함유하는 투명 폴리이미드 실리콘 수지
JP5270865B2 (ja) 接着剤並びにその用途
WO2010131566A1 (ja) テトラカルボン酸二無水物、及び重合体
JPH0748452A (ja) 低熱伝導率ポリイミドシロキサンフィルム
JP2023086715A (ja) 感光性樹脂組成物、硬化レリーフパターンの製造方法、および半導体装置
JP4204435B2 (ja) 熱硬化性基を含有する透明ポリイミドシリコーン樹脂
KR101165465B1 (ko) 무용제형 폴리이미드 실리콘계 수지 조성물과 이를 이용한수지 피막
JP4776485B2 (ja) 感光性ポリアミド酸エステル組成物
JP5352527B2 (ja) 新規ポリイミド及びその製造方法
JP6738353B2 (ja) 感光性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
TW202028400A (zh) 接著劑組成物
WO2006118353A1 (ja) 耐熱性と接着性とに優れた樹脂組成物及びその製造方法
JPH0359031A (ja) ポリイミドイソインドロキナゾリンジオン及びその前駆体の製造法
JPH0220523A (ja) シリコンイミド共重合体及びその製造方法

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

FPAY Annual fee payment

Payment date: 20160318

Year of fee payment: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

FPAY Annual fee payment

Payment date: 20170302

Year of fee payment: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

FPAY Annual fee payment

Payment date: 20180316

Year of fee payment: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

FPAY Annual fee payment

Payment date: 20190318

Year of fee payment: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 11

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 12

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 13

PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20250405

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

H13 Ip right lapsed

Free format text: ST27 STATUS EVENT CODE: N-4-6-H10-H13-OTH-PC1903 (AS PROVIDED BY THE NATIONAL OFFICE); TERMINATION CATEGORY : DEFAULT_OF_REGISTRATION_FEE

Effective date: 20250405

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20250405