KR100821069B1 - 무용제형 폴리이미드 실리콘계 수지 조성물 및 이를사용한 수지 피막 - Google Patents
무용제형 폴리이미드 실리콘계 수지 조성물 및 이를사용한 수지 피막 Download PDFInfo
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- KR100821069B1 KR100821069B1 KR1020020024912A KR20020024912A KR100821069B1 KR 100821069 B1 KR100821069 B1 KR 100821069B1 KR 1020020024912 A KR1020020024912 A KR 1020020024912A KR 20020024912 A KR20020024912 A KR 20020024912A KR 100821069 B1 KR100821069 B1 KR 100821069B1
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- silicone resin
- polyimide silicone
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- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Oc1ccccc1 Chemical compound Oc1ccccc1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- UHOVQNZJYSORNB-UHFFFAOYSA-N c1ccccc1 Chemical compound c1ccccc1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 2
- LNWYAWRXSBUTQA-UHFFFAOYSA-N Cc(cc1)c(C)cc1S(=O)=O Chemical compound Cc(cc1)c(C)cc1S(=O)=O LNWYAWRXSBUTQA-UHFFFAOYSA-N 0.000 description 1
- HEFPMJWWANJQIO-UHFFFAOYSA-N Cc1ccc(C(C(F)(F)F)(C(F)(F)F)c2ccc(C)c(C)c2)cc1 Chemical compound Cc1ccc(C(C(F)(F)F)(C(F)(F)F)c2ccc(C)c(C)c2)cc1 HEFPMJWWANJQIO-UHFFFAOYSA-N 0.000 description 1
- GLFKFHJEFMLTOB-UHFFFAOYSA-N Cc1ccc(C(C(F)(F)F)(C(F)(F)F)c2ccc(C)c(C)c2)cc1C Chemical compound Cc1ccc(C(C(F)(F)F)(C(F)(F)F)c2ccc(C)c(C)c2)cc1C GLFKFHJEFMLTOB-UHFFFAOYSA-N 0.000 description 1
- KZTUYBZUSOTWTR-UHFFFAOYSA-N Cc1cccc(Oc(cc2)ccc2S(c(cc2)ccc2Oc2cc(C)ccc2)(=O)=O)c1 Chemical compound Cc1cccc(Oc(cc2)ccc2S(c(cc2)ccc2Oc2cc(C)ccc2)(=O)=O)c1 KZTUYBZUSOTWTR-UHFFFAOYSA-N 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
- C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- C08L83/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/42—Block-or graft-polymers containing polysiloxane sequences
- C08G77/452—Block-or graft-polymers containing polysiloxane sequences containing nitrogen-containing sequences
- C08G77/455—Block-or graft-polymers containing polysiloxane sequences containing nitrogen-containing sequences containing polyamide, polyesteramide or polyimide sequences
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
- H01B3/306—Polyimides or polyesterimides
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Polymerisation Methods In General (AREA)
- Graft Or Block Polymers (AREA)
- Paints Or Removers (AREA)
Abstract
Description
노출 전 (박리수/시험편수) | 노출 후 (박리수/시험편수) | |
실시예 1 | 0/100 | 0/100 |
실시예 2 | 0/100 | 0/100 |
실시예 3 | 0/100 | 0/100 |
Claims (8)
- 하기 화학식 1로 표시되는 반복 단위를 갖는 중량 평균 분자량이 5000 내지 100000인 폴리이미드 실리콘 수지, (메트)아크릴 화합물 및 중합 개시제를 포함하고, 25 ℃에 있어서의 점도가 10000 Paㆍs 이하이며, 용제를 포함하지 않고, 상기 폴리이미드 실리콘 수지의 비율이 조성물 중 10 내지 80 중량%인 것을 특징으로 하는 무용제형 폴리이미드 실리콘계 수지 조성물.<화학식 1>식 중, X는 4가의 유기기이고, Y는 2가의 유기기이고, Z는 오르가노실록산 구조를 갖는 2가의 유기기이며, p 및 q는 각각 양수이다.
- 제1항에 있어서, 상기 화학식 1에 있어서, X는 하기 화학식 2, 화학식 3 또는 화학식 4로 표시되는 4가의 유기기이고, Y는 하기 화학식 5로 표시되는 기 또는 하기 화학식 9로 표시되는 기이며, Z는 하기 화학식 10으로 표시되는 2가의 실록산 잔기인 것을 특징으로 하는 무용제형 폴리이미드 실리콘계 수지 조성물.<화학식 2><화학식 3><화학식 4><화학식 5>식 중, B는 하기 화학식 6, 화학식 7 또는 화학식 8로 표시되는 기를 나타낸다.<화학식 6><화학식 7><화학식 8><화학식 9>식 중, D는 -CH2-, -(CH3)2C- 또는 -(CF3)2C-이고, a는 0 또는 1이다.<화학식 10>식 중, R1은 탄소수 1 내지 3의 알킬기 또는 페닐기를 나타내고, 이들은 동일 또는 상이할 수도 있으며, b는 O 내지 40의 정수를 나타낸다.
- 제1항 또는 제2항에 있어서, (메트)아크릴 화합물이 하기 화학식 11 및(또는) 화학식 12로 표시되는 무용제형 폴리이미드 실리콘계 수지 조성물.<화학식 11>CH2=CR3COOR2<화학식 12>CH2=CR3CONR2 2식 중, R2는 알킬기이고, R3은 수소 원자 또는 메틸기를 나타낸다.
- 제1항 또는 제2항에 있어서, 중합 개시제가 아세토페논 유도체, 벤조 페논 유도체, 벤조인에테르 유도체, 크산톤 유도체로부터 선택되는 광중합 개시제인 것을 특징으로 하는 무용제형 폴리이미드 실리콘계 수지 조성물.
- 제1항 또는 제2항에 있어서, 폴리이미드 실리콘 수지 중의 오르가노실록산 성분의 비율이 30 중량% 이상인 것을 특징으로 하는 무용제형 폴리이미드 실리콘계 수지 조성물.
- 삭제
- 삭제
- 제1항 또는 제2항에 기재된 무용제형 폴리이미드 실리콘계 수지 조성물을 광 또는 전자선에 의해 경화시켜 이루어지는 수지 피막.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2001-00137046 | 2001-05-08 | ||
JP2001137046A JP3865046B2 (ja) | 2001-05-08 | 2001-05-08 | 無溶剤型ポリイミドシリコーン系樹脂組成物 |
Publications (2)
Publication Number | Publication Date |
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KR20020085821A KR20020085821A (ko) | 2002-11-16 |
KR100821069B1 true KR100821069B1 (ko) | 2008-04-08 |
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Application Number | Title | Priority Date | Filing Date |
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KR1020020024912A KR100821069B1 (ko) | 2001-05-08 | 2002-05-07 | 무용제형 폴리이미드 실리콘계 수지 조성물 및 이를사용한 수지 피막 |
Country Status (5)
Country | Link |
---|---|
US (1) | US6706841B2 (ko) |
EP (1) | EP1258509B1 (ko) |
JP (1) | JP3865046B2 (ko) |
KR (1) | KR100821069B1 (ko) |
DE (1) | DE60205161T2 (ko) |
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2001
- 2001-05-08 JP JP2001137046A patent/JP3865046B2/ja not_active Expired - Fee Related
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2002
- 2002-05-07 KR KR1020020024912A patent/KR100821069B1/ko active IP Right Grant
- 2002-05-08 EP EP02253213A patent/EP1258509B1/en not_active Expired - Lifetime
- 2002-05-08 US US10/140,251 patent/US6706841B2/en not_active Expired - Lifetime
- 2002-05-08 DE DE60205161T patent/DE60205161T2/de not_active Expired - Lifetime
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---|---|---|---|---|
EP0349010A1 (en) * | 1988-06-30 | 1990-01-03 | Nippon Steel Chemical Co., Ltd. | Polyimide copolymers |
JPH05140525A (ja) * | 1991-11-19 | 1993-06-08 | Ube Ind Ltd | 耐熱性樹脂接着剤 |
JPH06287523A (ja) * | 1993-04-05 | 1994-10-11 | Nippon Steel Chem Co Ltd | 耐熱性接着フィルム |
Also Published As
Publication number | Publication date |
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US20020188069A1 (en) | 2002-12-12 |
JP3865046B2 (ja) | 2007-01-10 |
JP2002332305A (ja) | 2002-11-22 |
DE60205161D1 (de) | 2005-09-01 |
EP1258509B1 (en) | 2005-07-27 |
KR20020085821A (ko) | 2002-11-16 |
US6706841B2 (en) | 2004-03-16 |
DE60205161T2 (de) | 2006-05-24 |
EP1258509A1 (en) | 2002-11-20 |
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