TW200615281A - Solvent-free polyimide silicone resin composition and cured resin film thereof - Google Patents
Solvent-free polyimide silicone resin composition and cured resin film thereofInfo
- Publication number
- TW200615281A TW200615281A TW094130944A TW94130944A TW200615281A TW 200615281 A TW200615281 A TW 200615281A TW 094130944 A TW094130944 A TW 094130944A TW 94130944 A TW94130944 A TW 94130944A TW 200615281 A TW200615281 A TW 200615281A
- Authority
- TW
- Taiwan
- Prior art keywords
- solvent
- silicone resin
- polyimide silicone
- resin composition
- group
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
- C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/42—Block-or graft-polymers containing polysiloxane sequences
- C08G77/452—Block-or graft-polymers containing polysiloxane sequences containing nitrogen-containing sequences
- C08G77/455—Block-or graft-polymers containing polysiloxane sequences containing nitrogen-containing sequences containing polyamide, polyesteramide or polyimide sequences
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004262005 | 2004-09-09 | ||
JP2005234548A JP4372065B2 (ja) | 2004-09-09 | 2005-08-12 | 無溶剤型ポリイミドシリコーン樹脂組成物及びその硬化樹脂皮膜 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200615281A true TW200615281A (en) | 2006-05-16 |
TWI370138B TWI370138B (zh) | 2012-08-11 |
Family
ID=35427957
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094130944A TW200615281A (en) | 2004-09-09 | 2005-09-08 | Solvent-free polyimide silicone resin composition and cured resin film thereof |
Country Status (6)
Country | Link |
---|---|
US (1) | US7432313B2 (zh) |
EP (1) | EP1634907B1 (zh) |
JP (1) | JP4372065B2 (zh) |
KR (1) | KR101135772B1 (zh) |
DE (1) | DE602005005588T2 (zh) |
TW (1) | TW200615281A (zh) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4602151B2 (ja) * | 2004-04-22 | 2010-12-22 | 信越化学工業株式会社 | 無溶剤型ポリイミドシリコーン系樹脂組成物及びこれを用いた樹脂皮膜 |
WO2007052540A1 (ja) * | 2005-11-01 | 2007-05-10 | Jsr Corporation | 感光性樹脂組成物 |
JP4771100B2 (ja) | 2008-08-27 | 2011-09-14 | 信越化学工業株式会社 | 無溶剤型ポリイミドシリコーン系樹脂組成物及びその硬化物 |
JP5457051B2 (ja) * | 2009-03-05 | 2014-04-02 | 新日鉄住金化学株式会社 | 位相差フィルム及びその製造方法 |
JP5100894B2 (ja) * | 2009-12-22 | 2012-12-19 | 新日鉄住金化学株式会社 | ポリイミド樹脂、その製造方法、接着剤樹脂組成物、カバーレイフィルム及び回路基板 |
TWI362398B (en) * | 2009-12-31 | 2012-04-21 | Ind Tech Res Inst | Polyimide polymers for flexible electrical device substrate material and flexible electrical devices comprising the same |
KR102154158B1 (ko) * | 2013-04-03 | 2020-09-09 | 닛산 가가쿠 가부시키가이샤 | 무용제형 광경화성 수지 조성물 |
US11543083B2 (en) | 2014-09-28 | 2023-01-03 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED filament and LED light bulb |
JP6501312B2 (ja) * | 2015-03-05 | 2019-04-17 | エルジー・ケム・リミテッド | 光電素子のフレキシブル基板用ポリイミドフィルム用組成物 |
JP6763139B2 (ja) * | 2015-12-25 | 2020-09-30 | 信越化学工業株式会社 | 無溶剤型シリコーン変性ポリイミド樹脂組成物 |
JP2017222745A (ja) | 2016-06-14 | 2017-12-21 | 信越化学工業株式会社 | 無溶剤型シリコーン変性ポリイミド樹脂組成物 |
US10982048B2 (en) * | 2018-04-17 | 2021-04-20 | Jiaxing Super Lighting Electric Appliance Co., Ltd | Organosilicon-modified polyimide resin composition and use thereof |
JPWO2021225163A1 (zh) * | 2020-05-08 | 2021-11-11 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4499149A (en) * | 1980-12-15 | 1985-02-12 | M&T Chemicals Inc. | Siloxane-containing polymers |
JP3211108B2 (ja) * | 1992-06-25 | 2001-09-25 | チッソ株式会社 | 感光性樹脂組成物 |
JP3451128B2 (ja) | 1994-03-31 | 2003-09-29 | 新日鐵化学株式会社 | ポリイミド樹脂及び耐熱接着剤 |
JP2002012667A (ja) | 2000-06-29 | 2002-01-15 | Shin Etsu Chem Co Ltd | ポリイミドシリコーン樹脂、その溶液組成物、およびポリイミドシリコーン樹脂皮膜 |
JP3865046B2 (ja) | 2001-05-08 | 2007-01-10 | 信越化学工業株式会社 | 無溶剤型ポリイミドシリコーン系樹脂組成物 |
KR100589067B1 (ko) * | 2001-10-30 | 2006-06-14 | 가부시키가이샤 가네카 | 감광성 수지 조성물, 이것을 이용한 감광성 필름 및 적층체 |
DE60302853T2 (de) * | 2002-10-10 | 2006-08-24 | Shin-Etsu Chemical Co., Ltd. | Farbloses und transparentes Polyimidsilikonharz mit wärmehärtenden funktionellen Gruppen |
JP4204435B2 (ja) | 2002-10-10 | 2009-01-07 | 信越化学工業株式会社 | 熱硬化性基を含有する透明ポリイミドシリコーン樹脂 |
-
2005
- 2005-08-12 JP JP2005234548A patent/JP4372065B2/ja active Active
- 2005-09-06 EP EP05077027A patent/EP1634907B1/en active Active
- 2005-09-06 DE DE602005005588T patent/DE602005005588T2/de active Active
- 2005-09-08 TW TW094130944A patent/TW200615281A/zh unknown
- 2005-09-08 KR KR1020050083622A patent/KR101135772B1/ko active IP Right Grant
- 2005-09-09 US US11/221,897 patent/US7432313B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
DE602005005588T2 (de) | 2009-05-07 |
JP4372065B2 (ja) | 2009-11-25 |
JP2006104447A (ja) | 2006-04-20 |
KR20060051106A (ko) | 2006-05-19 |
TWI370138B (zh) | 2012-08-11 |
US7432313B2 (en) | 2008-10-07 |
EP1634907A1 (en) | 2006-03-15 |
EP1634907B1 (en) | 2008-03-26 |
DE602005005588D1 (de) | 2008-05-08 |
US20060052476A1 (en) | 2006-03-09 |
KR101135772B1 (ko) | 2012-04-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW200615281A (en) | Solvent-free polyimide silicone resin composition and cured resin film thereof | |
JP7105051B2 (ja) | 積層透明フィルム、表示装置用ウィンドウおよび表示装置 | |
DE602005020827D1 (de) | Härtbare flüssigharzlichtwellenleiter-upjacket-zusammensetzung | |
JP5628489B2 (ja) | 光硬化性組成物およびそれを用いた絶縁性薄膜および薄膜トランジスタ | |
KR101828139B1 (ko) | 코팅제 | |
ATE451426T1 (de) | Härtbare organopolysiloxan-zusammensetzung und halbleiterbauelement | |
TW200706540A (en) | Composition for forming prism layer and prism film manufactured using the same | |
MY145123A (en) | Adhesion-promoting agent, curable organopolysiloxane composition, and semiconductor device | |
ATE463537T1 (de) | Härtbare organopolysiloxanzusammensetzung und halbleitervorrichtung | |
TW200623266A (en) | Low temperature curable materials for optical applications | |
TW200734403A (en) | Resin composition for sealing optical device, cured product thereof, and method of sealing semiconductor element | |
WO2009011211A1 (ja) | 硬化性組成物およびその硬化物 | |
TW200624539A (en) | Optical film | |
TW200633975A (en) | High refractive polymerizable composition and use thereof | |
DE602007004235D1 (de) | Härtbare organopolysiloxanzusammensetzung und halbleitervorrichtung | |
KR20170072238A (ko) | 액정 표시 소자 | |
BRPI0510455A (pt) | composições fotocrÈmicas e artigos compreendendo oligÈmero poliéter | |
ATE547481T1 (de) | Härtbare silikonzusammensetzung und härteprodukt daraus | |
ATE526366T1 (de) | Farbige härtbare zusammensetzung, farbfilter, herstellungsverfahren dafür und festzustand- bildaufnahmevorrichtung | |
KR20200023847A (ko) | 적층체, 윈도우 필름 및 전자 기기 | |
JP7207845B2 (ja) | シルセスキオキサン複合高分子およびその製造方法 | |
TWI623587B (zh) | 用於密封光學元件的樹脂組成物 | |
JP5779039B2 (ja) | ハードコート性樹脂組成物及びその硬化物 | |
WO2008105503A1 (ja) | 撥水性領域のパターンを有する処理基材、その製造方法、および機能性材料の膜からなるパターンが形成された部材の製造方法 | |
KR20070051704A (ko) | 방사선 경화성 실리콘 고무 조성물 |