KR101083825B1 - 열처리용 종형 보트 및 그 제조방법 - Google Patents

열처리용 종형 보트 및 그 제조방법 Download PDF

Info

Publication number
KR101083825B1
KR101083825B1 KR1020067000810A KR20067000810A KR101083825B1 KR 101083825 B1 KR101083825 B1 KR 101083825B1 KR 1020067000810 A KR1020067000810 A KR 1020067000810A KR 20067000810 A KR20067000810 A KR 20067000810A KR 101083825 B1 KR101083825 B1 KR 101083825B1
Authority
KR
South Korea
Prior art keywords
heat treatment
support
boat
vertical boat
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020067000810A
Other languages
English (en)
Korean (ko)
Other versions
KR20060039903A (ko
Inventor
타케시 코바야시
Original Assignee
신에쯔 한도타이 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 신에쯔 한도타이 가부시키가이샤 filed Critical 신에쯔 한도타이 가부시키가이샤
Publication of KR20060039903A publication Critical patent/KR20060039903A/ko
Application granted granted Critical
Publication of KR101083825B1 publication Critical patent/KR101083825B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H01L21/67309—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterized by the substrate support

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020067000810A 2003-07-16 2004-07-13 열처리용 종형 보트 및 그 제조방법 Expired - Fee Related KR101083825B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JPJP-P-2003-00275657 2003-07-16
JP2003275657 2003-07-16
JP2003300527A JP4506125B2 (ja) 2003-07-16 2003-08-25 熱処理用縦型ボート及びその製造方法
JPJP-P-2003-00300527 2003-08-25
PCT/JP2004/009960 WO2005008764A1 (ja) 2003-07-16 2004-07-13 熱処理用縦型ボート及びその製造方法

Publications (2)

Publication Number Publication Date
KR20060039903A KR20060039903A (ko) 2006-05-09
KR101083825B1 true KR101083825B1 (ko) 2011-11-18

Family

ID=34082358

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020067000810A Expired - Fee Related KR101083825B1 (ko) 2003-07-16 2004-07-13 열처리용 종형 보트 및 그 제조방법

Country Status (6)

Country Link
US (1) US7484958B2 (enExample)
JP (1) JP4506125B2 (enExample)
KR (1) KR101083825B1 (enExample)
CN (1) CN1823407B (enExample)
TW (1) TW200509191A (enExample)
WO (1) WO2005008764A1 (enExample)

Families Citing this family (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007099786A1 (ja) * 2006-02-23 2007-09-07 Hitachi Kokusai Electric Inc. 基板処理装置及び半導体装置の製造方法
WO2008084887A1 (en) * 2007-01-08 2008-07-17 Ik-Han Eom Semiconductor manufacturing apparatus
US20090071918A1 (en) * 2007-09-18 2009-03-19 Panchapakesan Ramanarayanan Vertical semiconductor wafer carrier
JP5071217B2 (ja) * 2008-04-17 2012-11-14 信越半導体株式会社 縦型熱処理用ボートおよびそれを用いたシリコンウエーハの熱処理方法
US8042697B2 (en) * 2008-06-30 2011-10-25 Memc Electronic Materials, Inc. Low thermal mass semiconductor wafer support
US20100098519A1 (en) * 2008-10-17 2010-04-22 Memc Electronic Materials, Inc. Support for a semiconductor wafer in a high temperature environment
WO2010070980A1 (ja) * 2008-12-17 2010-06-24 本田技研工業株式会社 搬送治具及びその製造方法と、それを用いた金属リングの熱処理方法
USD616391S1 (en) * 2009-03-06 2010-05-25 Tokyo Electron Limited Pedestal of heat insulating cylinder for manufacturing semiconductor wafers
USD616393S1 (en) * 2009-03-06 2010-05-25 Tokyo Electron Limited Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
USD616392S1 (en) * 2009-03-06 2010-05-25 Tokyo Electron Limited Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
USD616396S1 (en) * 2009-03-12 2010-05-25 Tokyo Electron Limited Pedestal of heat insulating cylinder for manufacturing semiconductor wafers
CN102308010B (zh) * 2009-03-26 2014-04-09 本田技研工业株式会社 金属环的自动热处理方法
USD655255S1 (en) * 2010-06-18 2012-03-06 Hitachi Kokusai Electric Inc. Boat of wafer processing apparatus
USD655682S1 (en) * 2010-06-18 2012-03-13 Hitachi Kokusai Electric Inc. Boat of wafer processing apparatus
CN102560683B (zh) * 2010-12-29 2015-09-30 有研半导体材料有限公司 一种防止硅片在热处理过程中崩边的方法及石英舟
USD763807S1 (en) * 2014-05-22 2016-08-16 Hzo, Inc. Boat for a deposition apparatus
USD734730S1 (en) * 2012-12-27 2015-07-21 Hitachi Kokusai Electric Inc. Boat of substrate processing apparatus
TWD166332S (zh) * 2013-03-22 2015-03-01 日立國際電氣股份有限公司 基板處理裝置用晶舟之部分
TWD163542S (zh) * 2013-03-22 2014-10-11 日立國際電氣股份有限公司 基板處理裝置用晶舟
TWD168827S (zh) * 2013-07-29 2015-07-01 日立國際電氣股份有限公司 半導體製造裝置用晶舟
TWD165429S (zh) * 2013-07-29 2015-01-11 日立國際電氣股份有限公司 半導體製造裝置用晶舟
TWD167988S (zh) * 2013-07-29 2015-05-21 日立國際電氣股份有限公司 半導體製造裝置用晶舟
KR20150110207A (ko) * 2014-03-24 2015-10-02 주식회사 테라세미콘 보트
JP1537312S (enExample) * 2014-11-20 2015-11-09
JP1537313S (enExample) * 2014-11-20 2015-11-09
JP1537630S (enExample) * 2014-11-20 2015-11-09
JP1537629S (enExample) * 2014-11-20 2015-11-09
KR101731488B1 (ko) * 2015-10-27 2017-05-02 주식회사 유진테크 기판처리장치 및 튜브 조립체 조립방법
JP1563649S (enExample) * 2016-02-12 2016-11-21
JP6770461B2 (ja) * 2017-02-21 2020-10-14 クアーズテック株式会社 縦型ウエハボート
US10861727B2 (en) * 2018-03-13 2020-12-08 Samsung Electronics Co., Ltd. Segmented vertical wafer boat
USD846514S1 (en) * 2018-05-03 2019-04-23 Kokusai Electric Corporation Boat of substrate processing apparatus
USD847105S1 (en) * 2018-05-03 2019-04-30 Kokusai Electric Corporation Boat of substrate processing apparatus
JP1640260S (enExample) 2018-11-19 2019-09-02
USD908102S1 (en) * 2019-02-20 2021-01-19 Veeco Instruments Inc. Transportable semiconductor wafer rack
USD908103S1 (en) * 2019-02-20 2021-01-19 Veeco Instruments Inc. Transportable semiconductor wafer rack
JP7245071B2 (ja) * 2019-02-21 2023-03-23 株式会社ジェイテクトサーモシステム 基板支持装置
CN110246784B (zh) * 2019-06-19 2021-05-07 西安奕斯伟硅片技术有限公司 一种支撑结构和具有其的热处理装置
JP1658652S (enExample) * 2019-08-07 2020-04-27
JP6770617B1 (ja) * 2019-08-09 2020-10-14 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 基板処理装置、半導体装置の製造方法及び基板保持具
CN110931339B (zh) * 2019-10-23 2022-04-22 深圳市拉普拉斯能源技术有限公司 半导体或光伏材料的加工装置
JP1665228S (enExample) * 2019-11-28 2020-08-03
CN111106049A (zh) * 2019-12-21 2020-05-05 张忠恕 一种多层级立式石英舟及其加工工艺
TWI735115B (zh) * 2019-12-24 2021-08-01 力成科技股份有限公司 晶圓儲存裝置及晶圓承載盤
CN113327884B (zh) * 2020-02-29 2023-10-17 长鑫存储技术有限公司 晶圆支撑件、晶圆加工装置及晶圆加工方法
JP1700778S (ja) * 2021-03-15 2021-11-29 基板処理装置用遮蔽具
JP1713190S (enExample) * 2021-10-01 2022-04-21
CN115307422A (zh) * 2022-08-19 2022-11-08 杭州盾源聚芯半导体科技有限公司 一种螺纹拼接式保温桶
JP1741512S (enExample) * 2022-09-14 2023-04-11
JP1741513S (enExample) * 2022-09-14 2023-04-11
CN116695241B (zh) * 2023-06-09 2024-06-07 北京大学 一种过渡金属硫族化合物晶圆及其制备方法和装置
EP4498411A3 (en) * 2023-06-28 2025-03-26 ASM IP Holding B.V. Wafer boat system, holder ring and use thereof
CN116516468B (zh) * 2023-07-04 2023-10-13 苏州优晶光电科技有限公司 多片碳化硅籽晶涂层同时处理的装置和方法
TW202537026A (zh) * 2024-03-13 2025-09-16 力晶積成電子製造股份有限公司 晶圓承載裝置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100290047B1 (ko) * 1993-03-09 2001-11-30 히가시 데쓰로 열처리용보트

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0265122A (ja) * 1988-08-30 1990-03-05 Nec Corp 半導体基板支持ボート
JP3190079B2 (ja) 1991-11-05 2001-07-16 株式会社日立製作所 半導体集積回路装置の製造方法
JP3280438B2 (ja) * 1992-11-30 2002-05-13 東芝セラミックス株式会社 縦型ボート
JP3125199B2 (ja) * 1993-03-18 2001-01-15 東京エレクトロン株式会社 縦型熱処理装置
JP3333577B2 (ja) 1993-03-09 2002-10-15 東京エレクトロン株式会社 熱処理用ボート及び縦型熱処理装置
JPH09106956A (ja) * 1995-10-09 1997-04-22 Kokusai Electric Co Ltd ボートおよびその設置構造
JPH09251961A (ja) * 1996-03-15 1997-09-22 Toshiba Corp 熱処理用ボート
JPH1022228A (ja) * 1996-07-04 1998-01-23 Sumitomo Metal Ind Ltd 半導体熱処理用治具
JP2001176811A (ja) * 1999-12-16 2001-06-29 Tecnisco Ltd ウエーハ支持装置
US6287112B1 (en) * 2000-03-30 2001-09-11 Asm International, N.V. Wafer boat
KR100410982B1 (ko) * 2001-01-18 2003-12-18 삼성전자주식회사 반도체 제조장치용 보트
JP4467028B2 (ja) * 2001-05-11 2010-05-26 信越石英株式会社 縦型ウェーハ支持治具
US6488497B1 (en) * 2001-07-12 2002-12-03 Saint-Gobain Ceramics & Plastics, Inc. Wafer boat with arcuate wafer support arms
KR100492977B1 (ko) * 2002-12-12 2005-06-07 삼성전자주식회사 다공성 실리카 박막의 소결을 위한 웨이퍼 보트
US20050145584A1 (en) * 2004-01-06 2005-07-07 Buckley Richard F. Wafer boat with interference fit wafer supports
US7033168B1 (en) * 2005-01-24 2006-04-25 Memc Electronic Materials, Inc. Semiconductor wafer boat for a vertical furnace

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100290047B1 (ko) * 1993-03-09 2001-11-30 히가시 데쓰로 열처리용보트

Also Published As

Publication number Publication date
US7484958B2 (en) 2009-02-03
JP2005051187A (ja) 2005-02-24
WO2005008764A1 (ja) 2005-01-27
CN1823407B (zh) 2011-03-16
JP4506125B2 (ja) 2010-07-21
US20060199133A1 (en) 2006-09-07
KR20060039903A (ko) 2006-05-09
TWI348725B (enExample) 2011-09-11
TW200509191A (en) 2005-03-01
CN1823407A (zh) 2006-08-23

Similar Documents

Publication Publication Date Title
KR101083825B1 (ko) 열처리용 종형 보트 및 그 제조방법
KR100530407B1 (ko) 반도체 제조 장치
KR101537960B1 (ko) 종형 열처리용 보트 및 이를 이용한 실리콘 웨이퍼의 열처리 방법
US5109264A (en) Semiconductor wafers having a shape suitable for thermal treatment
JPH06224146A (ja) 熱処理用ボート
KR101347696B1 (ko) 종형 열처리용 보트 및 이것을 이용한 반도체 웨이퍼의 열처리 방법
KR20100014966A (ko) 종형 열처리용 보트와, 반도체 웨이퍼의 열처리 방법
KR100424428B1 (ko) 종형로 및 종형로용 웨이퍼보트
KR20070083813A (ko) 열처리용 종형 보트 및 열처리 방법
WO2004112113A1 (ja) 半導体ウエーハの熱処理方法及び熱処理用縦型ボート
US7241141B2 (en) Low contact SiC boat for silicon nitride stress reduction
JP5010797B2 (ja) 熱処理用縦型ボート及びその製造方法
JP4396105B2 (ja) 縦型熱処理用ボート及び半導体ウエーハの熱処理方法
JP4826070B2 (ja) 半導体ウエーハの熱処理方法
JP2007036105A (ja) シリコンウェーハ用サセプタ
JP2001060559A (ja) 半導体ウェーハ熱処理用保持具および熱処理方法
KR102606191B1 (ko) SiC 기판 및 SiC 잉곳
KR102615691B1 (ko) SiC 기판 및 SiC 잉곳
JP7214034B1 (ja) ＳｉＣデバイスの製造方法
JP2005328008A (ja) 半導体ウェーハの熱処理用縦型ボート及び熱処理方法
KR20230016383A (ko) 종형 열처리용 보트 및 이를 이용한 실리콘 웨이퍼의 열처리 방법
KR20250157106A (ko) 리프트 핀과 이를 포함하는 웨이퍼의 가공 장치
JP2005019748A (ja) ウエーハの熱処理用治具及び熱処理方法
JPH07273056A (ja) 半導体ウエーハ保持装置及びその製造方法

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

FPAY Annual fee payment

Payment date: 20141021

Year of fee payment: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

FPAY Annual fee payment

Payment date: 20151016

Year of fee payment: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

FPAY Annual fee payment

Payment date: 20161019

Year of fee payment: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

FPAY Annual fee payment

Payment date: 20171018

Year of fee payment: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 11

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 12

PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20231110

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20231110