WO2008084887A1

WO2008084887A1 - Semiconductor manufacturing apparatus

Info

Publication number: WO2008084887A1
Application number: PCT/KR2007/000102
Authority: WO
Inventors: Ik-Han Eom; Seung-Dong Kang; Gee-Pyo Kang
Original assignee: Ik-Han Eom; Seung-Dong Kang; Gee-Pyo Kang
Priority date: 2007-01-08
Filing date: 2007-01-08
Publication date: 2008-07-17

Abstract

The present invention can apply to a semiconductor manufacturing apparatus that a dummy wafer, a boat, a circular plate and a process tube are made of a sintered of material of ceramic. Therefore, a durability and a manufacturing efficiency of semiconductor can be enhanced and cost can be down and cleaning is easy.

Description

SEMICONDUCTOR MANUFACTURING APPARATUS

Technical Field

[1] The present invention relates to a semiconductor manufacturing apparatus that a durability and a manufacturing efficiency of semiconductor can be enhanced and cost can be down by using a sintered material of ceramic.

[2]

Background Art

[3] In recent a semiconductor manufacturing apparatus is made to comply with a high speed and great capacity.

[4] To comply with these conditions the semiconductor manufacturing apparatus is made to improve integration, reliability and response speed. To improve the integration of the semiconductor manufacturing apparatus it is necessary to improve the durability of the apparatus and cleaning technic after the process.

[5] A boat, a dummy wafer for loading on the boat, a circular plate for disposing under the boat and an internal tube for accommodating the boat of the conventional semiconductor manufacturing apparatus are all made of materials of SiC, Si or quarz so that wearing is occurred after process many times thereby to be deteriorated durability.

[6] That is, a diffusion process of the semiconductor is executed under a state that the wafer is loaded on the boat and the boat loaded the wafer is accommodated into the process tube having the internal tube and the outer tube. However, the conventional internal tube and the outer tube of the process tube are made of quarz or SiC, and accordingly are weared during a diffusion process and are contaminated. Furthermore, the conventional internal tube must be separated from the body while cleaning. If the internal tube is not separated from the body during cleaning the lifetime is shorten by damage by the cleaning gas.

[7] Furthermore, in case of the thickness the deposition film of the wafer loaded on the lower portion of the boat is thicker than that of the wafer loaded on the upper and medium portions of the boat. This is because heat loss of the lower portion of the boat is greater than that of the upper and medium portions of the boat.

[8] To overcome the problems like these the boat disposes at its lower portion with the circular plate. However, the conventional circular plate is also made of materials of quarz, SiC or Si thereby cause the above same problems.

[9]

Disclosure of Invention Technical Problem [10] The present invention has been invented to overcome the above conventional problems it is an object of the present invention to provide a semiconductor manufacturing apparatus that a dummy wafer, a boat loaded the wafer, a circular plate disposed under the boat, and an internal tube accommodated the boat are manufactured using a sintered material of ceramic so that durability and a manufacturing efficiency of semiconductor can be enhanced and cost can be down.

[11] It is another object of the present invention to provide a semiconductor manufacturing apparatus that a convenience can be enhanced by cleaning by a cleaning gas without separation of the internal tube from the body.

[12]

Technical Solution

[13] In order to achieve the above objects, the present invention provides a semiconductor manufacturing apparatus comprising: a dummy wafer; a boat for loading the wafer and formed an insertion hole for supporting the loaded state of the wafer; a circular plate disposed under the boat for keeping a temperature of the boat; and a processing tube having an internal tube and an outer tube for accommodating the boat for a diffusion process, wherein said dummy wafer, boat, circular plate and process tube are made of a material of ceramic.

[14] The dummy wafer, boat, circular plate and process tube according to the present invention are made of a sintered material of ceramic.

[15]

Advantageous Effects

[16] A semiconductor manufacturing apparatus according to the present invention as the foregoing constructions has the advantages that a durability and a manufacturing efficiency of semiconductor can be enhanced and cost can be down and cleaning is easy. [17]

Brief Description of the Drawings [18] Fig. 1 shows a boat and a wafer loaded thereon manufactured by a sintered material of a ceramic according to a present invention. [19] Fig. 2 shows a state that a boat manufactured by a sintered material of ceramic is disposed in a process tube according to a present invention. [20]

Best Mode for Carrying Out the Invention [21] A preferred embodiment according to the present invention will now be in detail described with reference to the accompanying drawings. [22] Fig. 1 shows a boat and a wafer loaded thereon manufactured by a sintered material of a ceramic according to a present invention, Fig. 2 shows a state that a boat manufactured by a sintered material of ceramic is disposed in a process tube according to a present invention.

[23] As shown in Figs. 1 and 2 a diffusion process of a semiconductor is executed under a state that a dummy wafer 10 is loaded on a boat 20 and thereafter the boat 20 loaded the wafers 10 is in a process tube 60. The process tube 60 includes an internal tube 70 and an outer tube 80.

[24] The boat 20 is formed with a vertical plate 40 at a body 30 for being loaded the wafer 10. The conventional plate 40 is made of materials of SiC, Si or quarz, and accordingly the diffusion process can be executed by being supplying a process gas to the wafer 10.

[25] Furthermore, the plate 30 is formed with a plurality of insertion holes 50 for supporting the wafer 10 loaded on the boat 20 so that manufacturing of a semiconductor can be stabilized.

[26] Further, a circular plate 90 is disposed under the boat 20 loaded the wafer 10 for preventing more heat loss at the lower portion rather than the medium and upper portions of the boat 20 .

[27] Meanwhile, the circular plate 90 can be established at the boat 20 in one body or two body.

[28] The boat 20, the vertical plate 40 and the insertion hole 50 of the semiconductor manufacturing apparatus according to the present invention having as the foregoing description are made of the sintered material of an alumina ceramic Al O

[29] The sinter means that when minute particles are heated by a high temperature they stick and dry even at a temperature below a melting point. A force for sinter reduces a surface energy. A mechanical and physical properties for material are enhanced by being reduced an entire surface area because the particles are partially united by a diffusion process according to the progress of the sinter.

[30] Therefore, the sintered material enhances mechanical and physical properties of the components of the present invention, for example although the wafer 10 contacts many times to the vertical plate 40 and the insertion hole 50 during being loaded on the boat 20, wearing of them 40 and 50 can be prevented not to be produced wearing particles.

[31] That is, in the conventional semiconductor manufacturing apparatus, the more the plate and the insertion hole contact to the wafer the more the wearing particles are produced. This causes the contamination of the wafer, and accordingly, the manufacturing efficiency of the semiconductor is deteriorated. However, the present invention can prevent the wearing particles so that the manufacturing efficiency of the semiconductor is enhanced by the cleanliness of the wafer.

[32] Furthermore, the boat 20 and the dummy wafer 10 of the present invention are made of the sintered material of the alumina ceramic so that the wearing can be prevented and cleaning can be executed by the cleaning gas without separation of the boat 20 and the wafer 10.

[33] Furthermore, the internal tube 70 of the process tube 60 and the plate 90 under the boat 20 are made of the sintered material of the ceramic so that the wearing can be prevented after the process in many times.

[34] The alumina ceramic Al O has the structure of multi layers not single layer so that a crack progressing distance is lengthen because a crack is progressed between the layers in case when multi holes layer and densify layer are overlapped. The crack of the alumina ceramic material is progressed plumb to the densify layer, however is progressed according to the holes in the multi holes layer thereby be lengthen the progressing distance.

[35] The above construction that the dummy wafer 10 is loaded on the boat 20 for the diffusion process can not limit the scope of the claims of the present invention, the construction of the boat 20 having the vertical plate 40 and the insertion hole 50 can be changed.

[36] Furthermore, the constructions of the circular plate 90 under the boat 20 and the process tube 60 including the internal tube 70 and the outer tube 80 can be changed.

[37] Furthermore, the method of the sintered material of the ceramic according to the present invention can be changed. For example, the boat 20 can be made of several pieces of the boat 20 by combination or can be originally made of one body.

[38]

Industrial Applicability

[39] The present invention can apply to a semiconductor manufacturing apparatus that a dummy wafer, a boat, a circular plate and a process tube are manufactured by a sintered of material of ceramic. Therefore, a durability and a manufacturing efficiency of semiconductor can be enhanced and cost can be down and cleaning is easy.

Claims

[1] A semiconductor manufacturing apparatus comprising: a dummy wafer 10; a boat 20 for loading the wafer 10 and formed an insertion hole 50 for supporting the loaded state of the wafer 10; a circular plate 90 disposed under the boat 20 for preventing the heat loss of the lower portions of the boat 20; and a processing tube 60 having an internal tube 70 and an outer tube 80 for accommodating the boat 20 for a diffusion process; wherein said dummy wafer 10, boat 20, circular plate 90 and process tube 60 are made of a material of ceramic. [2] The apparatus in accordance with the claim 1, wherein said dummy wafer 10, boat 20, circular plate 90 and process tube 60 are made of a sintered material of ceramic.