KR101078902B1 - 페이스트 도포 장치 및 페이스트 도포 방법 - Google Patents

페이스트 도포 장치 및 페이스트 도포 방법 Download PDF

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Publication number
KR101078902B1
KR101078902B1 KR1020090061242A KR20090061242A KR101078902B1 KR 101078902 B1 KR101078902 B1 KR 101078902B1 KR 1020090061242 A KR1020090061242 A KR 1020090061242A KR 20090061242 A KR20090061242 A KR 20090061242A KR 101078902 B1 KR101078902 B1 KR 101078902B1
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South Korea
Prior art keywords
coating
application
paste
head
target
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KR1020090061242A
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Korean (ko)
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KR20100006541A (ko
Inventor
노리아키 시모다
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시바우라 메카트로닉스 가부시끼가이샤
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Publication of KR20100006541A publication Critical patent/KR20100006541A/ko
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1044—Apparatus or installations for supplying liquid or other fluent material to several applying apparatus or several dispensing outlets, e.g. to several extrusion nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0225—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/12—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by mechanical means

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  • Coating Apparatus (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Details Or Accessories Of Spraying Plant Or Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
KR1020090061242A 2008-07-09 2009-07-06 페이스트 도포 장치 및 페이스트 도포 방법 Active KR101078902B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008179086A JP5288917B2 (ja) 2008-07-09 2008-07-09 ペースト塗布装置及びペースト塗布方法
JPJP-P-2008-179086 2008-07-09

Publications (2)

Publication Number Publication Date
KR20100006541A KR20100006541A (ko) 2010-01-19
KR101078902B1 true KR101078902B1 (ko) 2011-11-01

Family

ID=41519761

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020090061242A Active KR101078902B1 (ko) 2008-07-09 2009-07-06 페이스트 도포 장치 및 페이스트 도포 방법

Country Status (4)

Country Link
JP (1) JP5288917B2 (enExample)
KR (1) KR101078902B1 (enExample)
CN (1) CN101623683B (enExample)
TW (1) TWI417144B (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5619537B2 (ja) * 2009-09-04 2014-11-05 デクセリアルズ株式会社 充填装置
JP5861166B2 (ja) * 2011-06-09 2016-02-16 株式会社ブイ・テクノロジー ディスペンサ装置、パターン欠陥修正装置、ディスペンサの詰まり解消方法
CN102411233B (zh) * 2011-11-23 2013-10-16 深圳市华星光电技术有限公司 液晶基板框胶涂覆装置及液晶基板框胶涂覆方法
US9475078B2 (en) * 2012-10-29 2016-10-25 Illinois Tool Works Inc. Automated multiple head cleaner for a dispensing system and related method
JP2015142905A (ja) * 2013-12-25 2015-08-06 芝浦メカトロニクス株式会社 接着剤塗布装置、接着剤塗布部材のクリーニング方法及び表示パネル製造装置、表示パネルの製造方法
KR102341945B1 (ko) * 2017-03-13 2021-12-22 주식회사 탑 엔지니어링 기판 처리 장치
KR101940598B1 (ko) 2017-05-25 2019-01-21 무사시 엔지니어링 가부시키가이샤 액체 재료 도포 장치 및 액체 재료 도포 방법
KR102449702B1 (ko) * 2017-12-13 2022-09-30 세메스 주식회사 액적 도포 장치 및 액적 도포 방법
JP7012213B2 (ja) * 2018-01-31 2022-01-28 パナソニックＩｐマネジメント株式会社 ペースト塗布装置及びペースト塗布方法
JP6982731B2 (ja) * 2018-01-31 2021-12-17 パナソニックＩｐマネジメント株式会社 ペースト塗布装置及びペースト塗布方法
KR101970444B1 (ko) * 2018-12-14 2019-04-18 문득수 단방향 또는 양방향 디스플레이 패널의 레진 도포장치, 그리고 이를 활용한 레진 도포방법
JP6990927B2 (ja) * 2019-01-21 2022-01-12 武蔵エンジニアリング株式会社 液体材料塗布装置および液体材料塗布方法
CN112477401B (zh) * 2020-12-21 2023-10-20 四川锐坤电子技术有限公司 一种移印设备

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100778147B1 (ko) * 2006-12-13 2007-11-21 주식회사 탑 엔지니어링 액정 디스플레이 패널 제조용 디스펜싱 장치

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4157149A (en) * 1977-10-31 1979-06-05 Moen Lenard E Multiple nozzle fluid dispenser for complex fluid delivery patterns
JPH0725967U (ja) * 1993-10-26 1995-05-16 日立テクノエンジニアリング株式会社 ペースト塗布機
JP3022855B1 (ja) * 1998-11-26 2000-03-21 埼玉日本電気株式会社 塗布装置のニードル硬化防止機構
CN1699054A (zh) * 1999-12-30 2005-11-23 阿克苏诺贝尔公司 胶粘方法以及使用该方法的设备
JP3993496B2 (ja) * 2001-09-27 2007-10-17 東京エレクトロン株式会社 基板の処理方法および塗布処理装置
JP2004014393A (ja) * 2002-06-10 2004-01-15 Dainippon Printing Co Ltd プラズマディスプレイパネルの蛍光面形成方法及び蛍光面形成装置
JP2004090264A (ja) * 2002-08-29 2004-03-25 Canon Inc インクジェット記録装置及びその制御方法、プログラム
CN2705239Y (zh) * 2003-09-28 2005-06-22 汕头市远东轻化装备有限公司 一种复合涂布机的上胶复合装置
TW200638083A (en) * 2005-04-18 2006-11-01 Shibaura Mechatronics Corp The coating apparatus and method thereof
TWM287028U (en) * 2005-10-17 2006-02-01 All Ring Tech Co Ltd Multiplexing dispenser
JP4893016B2 (ja) * 2006-02-17 2012-03-07 株式会社日立プラントテクノロジー ペースト塗布機
JP2007289796A (ja) * 2006-04-20 2007-11-08 Yamaha Motor Co Ltd 塗布装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100778147B1 (ko) * 2006-12-13 2007-11-21 주식회사 탑 엔지니어링 액정 디스플레이 패널 제조용 디스펜싱 장치

Also Published As

Publication number Publication date
CN101623683A (zh) 2010-01-13
KR20100006541A (ko) 2010-01-19
TW201006566A (en) 2010-02-16
TWI417144B (zh) 2013-12-01
JP5288917B2 (ja) 2013-09-11
JP2010017629A (ja) 2010-01-28
CN101623683B (zh) 2012-10-10

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