KR101078817B1 - 기판 위치 결정 방법, 기판 위치 검출 방법 및 기판 회수 방법 - Google Patents

기판 위치 결정 방법, 기판 위치 검출 방법 및 기판 회수 방법 Download PDF

Info

Publication number
KR101078817B1
KR101078817B1 KR1020097000470A KR20097000470A KR101078817B1 KR 101078817 B1 KR101078817 B1 KR 101078817B1 KR 1020097000470 A KR1020097000470 A KR 1020097000470A KR 20097000470 A KR20097000470 A KR 20097000470A KR 101078817 B1 KR101078817 B1 KR 101078817B1
Authority
KR
South Korea
Prior art keywords
substrate
wafer
imaging means
board
detected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020097000470A
Other languages
English (en)
Korean (ko)
Other versions
KR20090026335A (ko
Inventor
타케히로 신도
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20090026335A publication Critical patent/KR20090026335A/ko
Application granted granted Critical
Publication of KR101078817B1 publication Critical patent/KR101078817B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020097000470A 2006-09-05 2007-08-20 기판 위치 결정 방법, 기판 위치 검출 방법 및 기판 회수 방법 Expired - Fee Related KR101078817B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006240037A JP5132904B2 (ja) 2006-09-05 2006-09-05 基板位置決め方法，基板位置検出方法，基板回収方法及び基板位置ずれ補正装置
JPJP-P-2006-240037 2006-09-05

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020117006693A Division KR101058884B1 (ko) 2006-09-05 2007-08-20 반도체 제조 장치

Publications (2)

Publication Number Publication Date
KR20090026335A KR20090026335A (ko) 2009-03-12
KR101078817B1 true KR101078817B1 (ko) 2011-11-01

Family

ID=39157046

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020097000470A Expired - Fee Related KR101078817B1 (ko) 2006-09-05 2007-08-20 기판 위치 결정 방법, 기판 위치 검출 방법 및 기판 회수 방법
KR1020117006693A Expired - Fee Related KR101058884B1 (ko) 2006-09-05 2007-08-20 반도체 제조 장치

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020117006693A Expired - Fee Related KR101058884B1 (ko) 2006-09-05 2007-08-20 반도체 제조 장치

Country Status (5)

Country Link
US (2) US8135486B2 (https=)
JP (1) JP5132904B2 (https=)
KR (2) KR101078817B1 (https=)
CN (1) CN101461053B (https=)
WO (1) WO2008029609A1 (https=)

Families Citing this family (60)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006059818B4 (de) * 2006-12-11 2017-09-14 Kleo Ag Belichtungsanlage
DE102009032210B4 (de) 2009-07-03 2011-06-09 Kleo Ag Bearbeitungsanlage
US8711340B2 (en) * 2011-05-31 2014-04-29 General Electric Company Auto-aligning spectroscopy system
US8614797B2 (en) * 2011-06-27 2013-12-24 Infineon Technologies Ag Wafer orientation sensor
JP5661022B2 (ja) 2011-11-21 2015-01-28 東京エレクトロン株式会社 基板処理装置及び基板処理方法並びに基板処理プログラムを記憶したコンピュータ読み取り可能な記憶媒体
JP6103805B2 (ja) * 2011-11-29 2017-03-29 富士機械製造株式会社 部品位置認識方法および部品供給装置
JP5600703B2 (ja) * 2012-03-30 2014-10-01 東京エレクトロン株式会社 搬送装置及び搬送方法
KR102073802B1 (ko) * 2012-04-25 2020-02-05 어플라이드 머티어리얼스, 인코포레이티드 웨이퍼 에지 측정 및 제어
CN103824743B (zh) * 2012-11-16 2016-08-31 北京北方微电子基地设备工艺研究中心有限责任公司 偏差监测系统及偏差监测方法、等离子体加工设备
JP6167622B2 (ja) * 2013-04-08 2017-07-26 オムロン株式会社 制御システムおよび制御方法
CN104425304B (zh) * 2013-09-09 2018-05-25 北京北方华创微电子装备有限公司 晶片位置检测装置
KR102053082B1 (ko) * 2014-02-17 2020-01-08 (주)테크윙 반도체소자 테스트용 핸들러 및 반도체소자 테스트용 핸들러의 작동 방법
JP5893695B1 (ja) * 2014-09-10 2016-03-23 ファナック株式会社 物品搬送システム
CN105603383B (zh) * 2014-11-24 2017-12-29 中晟光电设备（上海）股份有限公司 托盘晶圆定位系统、方法及mocvd设备
US9841299B2 (en) * 2014-11-28 2017-12-12 Canon Kabushiki Kaisha Position determining device, position determining method, lithographic apparatus, and method for manufacturing object
CN105762101B (zh) * 2014-12-19 2019-02-19 北京北方华创微电子装备有限公司 晶片定位装置及方法
KR102330017B1 (ko) * 2015-04-14 2021-11-24 가부시키가이샤 에바라 세이사꾸쇼 기판 처리 장치 및 기판 처리 방법
US9405287B1 (en) * 2015-07-22 2016-08-02 Applied Materials, Inc. Apparatus and method for optical calibration of wafer placement by a robot
JP6432742B2 (ja) * 2015-09-30 2018-12-05 信越半導体株式会社 エピタキシャル成長装置及びエピタキシャルウェーハの製造方法
JP6671993B2 (ja) * 2016-02-01 2020-03-25 東京エレクトロン株式会社 基板受け渡し位置の教示方法及び基板処理システム
CN105824200B (zh) * 2016-05-31 2017-08-29 京东方科技集团股份有限公司 一种基板支撑结构及曝光机
WO2017210576A1 (en) * 2016-06-02 2017-12-07 Universal Instruments Corporation Semiconductor die offset compensation variation
CN107946227B (zh) * 2017-02-08 2018-12-18 中晟光电设备（上海）股份有限公司 一种基于托盘的晶圆定位方法及系统
JP6276449B1 (ja) * 2017-03-30 2018-02-07 株式会社荏原製作所 基板処理装置、基板処理装置の制御方法、プログラムを格納した記憶媒体
CN109103122B (zh) * 2017-06-20 2020-10-16 梭特科技股份有限公司 影像校准的置晶方法及置晶设备
JP2019011961A (ja) * 2017-06-29 2019-01-24 セイコーエプソン株式会社 電子部品搬送装置および電子部品検査装置
CN107195571A (zh) * 2017-07-03 2017-09-22 上海华力微电子有限公司 一种侦测系统
JP2019021747A (ja) * 2017-07-14 2019-02-07 東京エレクトロン株式会社 基板位置調整方法、記憶媒体及び基板処理システム
JP6881188B2 (ja) * 2017-09-27 2021-06-02 オムロン株式会社 位置検出装置およびプログラム
CN109767998B (zh) * 2017-11-09 2021-11-23 台湾积体电路制造股份有限公司 处理腔室、半导体制造设备以及其校正方法
JP7097691B2 (ja) * 2017-12-06 2022-07-08 東京エレクトロン株式会社 ティーチング方法
JP7030497B2 (ja) 2017-12-13 2022-03-07 株式会社荏原製作所 基板処理装置、基板処理装置の制御方法、プログラムを格納した記憶媒体
US10984524B2 (en) * 2017-12-21 2021-04-20 Advanced Ion Beam Technology, Inc. Calibration system with at least one camera and method thereof
US11468590B2 (en) * 2018-04-24 2022-10-11 Cyberoptics Corporation Wireless substrate-like teaching sensor for semiconductor processing
JP7008609B2 (ja) * 2018-10-18 2022-01-25 東京エレクトロン株式会社 基板処理装置、及び搬送位置補正方法
JP7446714B2 (ja) * 2019-02-01 2024-03-11 株式会社荏原製作所 基板処理装置、および基板処理方法
CN113412534A (zh) * 2019-02-08 2021-09-17 朗姆研究公司 衬底位置检测和调整
CN111645064A (zh) * 2019-03-04 2020-09-11 北京北方华创微电子装备有限公司 机械手位置校准装置及方法、机械手控制系统
JP6709316B1 (ja) * 2019-07-16 2020-06-10 Dmg森精機株式会社 測定装置
JP7372078B2 (ja) * 2019-08-19 2023-10-31 株式会社Ｓｃｒｅｅｎホールディングス 基板の偏芯低減方法およびティーチング装置
CN110729216A (zh) * 2019-10-21 2020-01-24 华虹半导体(无锡)有限公司 晶圆位置检测装置、晶圆位置检测方法
CN113120596B (zh) * 2019-12-31 2022-11-22 旺矽科技股份有限公司 物料移载状态侦测系统及方法
JP7357549B2 (ja) * 2020-01-07 2023-10-06 東京エレクトロン株式会社 基板の位置ずれ検出方法、基板位置の異常判定方法、基板搬送制御方法、及び基板の位置ずれ検出装置
TWI781763B (zh) * 2020-09-18 2022-10-21 日商斯庫林集團股份有限公司 基板洗淨裝置及基板洗淨方法
CN113675123B (zh) * 2021-07-29 2024-01-05 长鑫存储技术有限公司 一种晶圆校准装置、方法及系统
US20230036587A1 (en) * 2021-07-29 2023-02-02 Changxin Memory Technologies, Inc. Wafer alignment device, wafer alignment method and wafer alignment system
KR102807827B1 (ko) 2021-08-27 2025-05-15 삼성전자주식회사 티칭 장치 및 이를 이용한 기판 정렬 장치
CN113725136B (zh) * 2021-08-30 2024-05-24 长江存储科技有限责任公司 晶圆的对准方法、系统、计算机可读存储介质及处理器
CN113467199B (zh) * 2021-09-06 2021-11-12 宁波润华全芯微电子设备有限公司 一种便于拆卸的防止反溅液体污染晶圆的装置
CN116995024A (zh) * 2022-04-26 2023-11-03 重庆康佳光电科技有限公司 晶圆取放装置及刻蚀设备、晶圆拾取方法
CN115621184A (zh) * 2022-10-31 2023-01-17 上海华力微电子有限公司 光刻机首层晶圆对准装置及其对准方法
JP2024067818A (ja) 2022-11-07 2024-05-17 東京エレクトロン株式会社 基板搬送システムおよび基板位置調整方法
CN116230569B (zh) * 2022-12-13 2026-04-24 西安奕斯伟材料科技股份有限公司 一种用于检测硅片的周缘损伤层的深度的系统及方法
CN115910830A (zh) * 2022-12-15 2023-04-04 西安奕斯伟材料科技有限公司 一种晶圆位置的检测方法、装置及介质
CN116093001A (zh) * 2023-03-03 2023-05-09 西安奕斯伟材料科技有限公司 相对于基座校准硅片的位置的装置、方法及外延设备
CN116864417B (zh) * 2023-07-19 2024-03-08 大连皓宇电子科技有限公司 一种对晶圆位置进行校准的装置及方法
CN117038550B (zh) * 2023-08-08 2025-04-08 大连皓宇电子科技有限公司 一种晶圆工艺位置校正系统及方法
CN117038495B (zh) * 2023-10-10 2024-01-30 浙江果纳半导体技术有限公司 晶圆检测机构、检测方法及晶圆传输装置
CN119965143B (zh) * 2024-12-31 2025-12-02 新毅东(北京)科技有限公司 一种预对准仪及对准方法
CN120319681B (zh) * 2025-06-18 2025-08-22 苏州赛腾精密电子股份有限公司 晶圆检测装置及检测方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100477199B1 (ko) * 2000-09-14 2005-03-21 올림푸스 가부시키가이샤 얼라이먼트 장치
JP2006071395A (ja) * 2004-09-01 2006-03-16 Nikon Corp 較正方法及び位置合わせ方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3752234T2 (de) * 1986-04-28 1999-05-12 Varian Associates, Inc., Palo Alto, Calif. Transfersystem für Halbleiterscheibe
JPH06181251A (ja) * 1992-12-11 1994-06-28 Ebara Corp 位置合わせ装置
US6225012B1 (en) * 1994-02-22 2001-05-01 Nikon Corporation Method for positioning substrate
JP2602415B2 (ja) * 1994-06-16 1997-04-23 山形日本電気株式会社 ウェーハ位置決め装置
KR100432975B1 (ko) * 1995-07-27 2004-10-22 닛토덴코 가부시키가이샤 반도체웨이퍼의수납·인출장치및이것에이용되는반도체웨이퍼의운반용기
JPH09181154A (ja) * 1995-12-25 1997-07-11 Dainippon Screen Mfg Co Ltd 基板熱処理装置
KR100257279B1 (ko) * 1996-06-06 2000-06-01 이시다 아키라 주변노광장치 및 방법
JP4063921B2 (ja) * 1997-08-07 2008-03-19 オリンパス株式会社 基板中心位置検出装置及び方法
JP3468056B2 (ja) 1997-09-23 2003-11-17 東京エレクトロン株式会社 基板検出装置
EP1063186A1 (en) * 1997-12-03 2000-12-27 Nikon Corporation Substrate transferring device and method
JP2000021861A (ja) * 1998-07-03 2000-01-21 Sony Corp ドライエッチング装置
US6690473B1 (en) * 1999-02-01 2004-02-10 Sensys Instruments Corporation Integrated surface metrology
JP2001318470A (ja) * 2000-02-29 2001-11-16 Nikon Corp 露光装置、マイクロデバイス、フォトマスク、及び露光方法
US6853874B2 (en) * 2000-12-08 2005-02-08 Fuji Machine Mfg. Co., Ltd. Variable-width substrate conveyor, method of changing width of the same, and method of matching widths of two adjacent substrate conveyors
JP2002280287A (ja) * 2001-03-19 2002-09-27 Nikon Corp 位置検出方法、位置検出装置、露光方法、露光装置、及びデバイス製造方法
JP3795820B2 (ja) * 2002-03-27 2006-07-12 株式会社東芝 基板のアライメント装置
JP4128540B2 (ja) * 2003-06-05 2008-07-30 株式会社新川 ボンディング装置
US7110106B2 (en) * 2003-10-29 2006-09-19 Coretech Optical, Inc. Surface inspection system
EP1791169A4 (en) * 2004-08-31 2011-03-02 Nikon Corp ALIGNMENT PROCESS, DEVELOPMENT SYSTEM, SUBSTRATED REPEATABILITY MEASURING METHOD, POSITION MEASURING METHOD, EXPOSURE METHOD, SUBSTRATE PROCESSING DEVICE, MEASURING METHOD AND MEASURING DEVICE

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100477199B1 (ko) * 2000-09-14 2005-03-21 올림푸스 가부시키가이샤 얼라이먼트 장치
JP2006071395A (ja) * 2004-09-01 2006-03-16 Nikon Corp 較正方法及び位置合わせ方法

Also Published As

Publication number Publication date
CN101461053A (zh) 2009-06-17
JP5132904B2 (ja) 2013-01-30
KR20110044328A (ko) 2011-04-28
WO2008029609A1 (en) 2008-03-13
US8135486B2 (en) 2012-03-13
US20120130529A1 (en) 2012-05-24
KR20090026335A (ko) 2009-03-12
JP2008066372A (ja) 2008-03-21
KR101058884B1 (ko) 2011-08-23
US9082798B2 (en) 2015-07-14
CN101461053B (zh) 2010-09-29
US20100030347A1 (en) 2010-02-04

Similar Documents

Publication Publication Date Title
KR101078817B1 (ko) 기판 위치 결정 방법, 기판 위치 검출 방법 및 기판 회수 방법
JP4656440B2 (ja) 基板位置検出装置及びその撮像手段位置調整方法
JP4799325B2 (ja) 基板受け渡し装置，基板処理装置，基板受け渡し方法
US20080056857A1 (en) Substrate transfer device, substrate processing apparatus and substrate transfer method
CN104779191B (zh) 标记检测方法
JP4257570B2 (ja) 搬送用ロボットのティーチング装置および搬送用ロボットのティーチング方法
KR101597211B1 (ko) 웨이퍼 정렬 장치 및 방법
JP7691887B2 (ja) 基板搬送ロボットおよび基板搬送ロボットの制御方法
US20090016857A1 (en) Substrate-replacing apparatus, substrate-processing apparatus, and substrate-inspecting apparatus
US6114705A (en) System for correcting eccentricity and rotational error of a workpiece
JP2000232147A (ja) プロセスチャンバでの基板位置決め装置、および搬送機構のアーム位置の監視装置
US20030222229A1 (en) Alignment apparatus
CN120280383A (zh) 晶圆寻边扫码方法及装置
US20230104871A1 (en) Wafer carrier disc installation/uninstallation device and installation/uninstallation method thereof
JP4334917B2 (ja) アライメント装置
TWI908277B (zh) 基板搬送機器人及基板搬送機器人的控制方法
WO2025170037A1 (ja) 基板搬送ロボットおよび基板搬送ロボットの制御方法
WO2024080332A1 (ja) 基板搬送ロボットシステム

Legal Events

Date Code Title Description
A201 Request for examination
AMND Amendment
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

A107 Divisional application of patent
AMND Amendment
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0104 Divisional application for international application

St.27 status event code: A-0-1-A10-A18-div-PA0104

St.27 status event code: A-0-1-A10-A16-div-PA0104

E601 Decision to refuse application
PE0601 Decision on rejection of patent

St.27 status event code: N-2-6-B10-B15-exm-PE0601

AMND Amendment
E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

J201 Request for trial against refusal decision
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PJ0201 Trial against decision of rejection

St.27 status event code: A-3-3-V10-V11-apl-PJ0201

PB0901 Examination by re-examination before a trial

St.27 status event code: A-6-3-E10-E12-rex-PB0901

B701 Decision to grant
PB0701 Decision of registration after re-examination before a trial

St.27 status event code: A-3-4-F10-F13-rex-PB0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

FPAY Annual fee payment

Payment date: 20141007

Year of fee payment: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

FPAY Annual fee payment

Payment date: 20151001

Year of fee payment: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

FPAY Annual fee payment

Payment date: 20191016

Year of fee payment: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 11

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 12

PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20231027

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20231027

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000