KR101071024B1 - 프로브 카드용 대차 및 프로브 카드의 취급 방법 - Google Patents
프로브 카드용 대차 및 프로브 카드의 취급 방법 Download PDFInfo
- Publication number
- KR101071024B1 KR101071024B1 KR1020080072211A KR20080072211A KR101071024B1 KR 101071024 B1 KR101071024 B1 KR 101071024B1 KR 1020080072211 A KR1020080072211 A KR 1020080072211A KR 20080072211 A KR20080072211 A KR 20080072211A KR 101071024 B1 KR101071024 B1 KR 101071024B1
- Authority
- KR
- South Korea
- Prior art keywords
- probe card
- temperature
- inspection
- test
- inspection apparatus
- Prior art date
Links
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Tests Of Electronic Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007193495A JP5049419B2 (ja) | 2007-07-25 | 2007-07-25 | プローブカード用台車及びこの台車を用いるプローブカードの取り扱い方法 |
JPJP-P-2007-00193495 | 2007-07-25 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20090012123A KR20090012123A (ko) | 2009-02-02 |
KR101071024B1 true KR101071024B1 (ko) | 2011-10-06 |
Family
ID=40307330
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020080072211A KR101071024B1 (ko) | 2007-07-25 | 2008-07-24 | 프로브 카드용 대차 및 프로브 카드의 취급 방법 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5049419B2 (ja) |
KR (1) | KR101071024B1 (ja) |
CN (1) | CN101354428B (ja) |
TW (1) | TWI459492B (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101046769B1 (ko) * | 2009-01-20 | 2011-07-06 | 주식회사 쎄믹스 | 프로브카드케이스 |
JP5517344B2 (ja) * | 2010-02-12 | 2014-06-11 | 東京エレクトロン株式会社 | プローブカードの搬送機構、プローブカードの搬送方法及びプローブ装置 |
JP5874427B2 (ja) * | 2012-02-14 | 2016-03-02 | セイコーエプソン株式会社 | 部品検査装置、及び、ハンドラー |
CN104101425A (zh) * | 2013-04-15 | 2014-10-15 | 镇江逸致仪器有限公司 | 具有常温检测与高温检测双夹具的巴条测试系统 |
JP6267928B2 (ja) * | 2013-10-29 | 2018-01-24 | 東京エレクトロン株式会社 | ウエハ検査装置の整備用台車及びウエハ検査装置の整備方法 |
JP5967509B1 (ja) * | 2015-02-27 | 2016-08-10 | 株式会社東京精密 | 搬送ユニット及びプローバ |
KR101854015B1 (ko) * | 2015-11-06 | 2018-05-02 | 세메스 주식회사 | 프로브 카드 수납 장치 |
CN107664557B (zh) * | 2017-11-15 | 2020-02-07 | 无锡阿尔法精密机械制造有限公司 | 陶瓷压力传感器等级分拣装置 |
JP6575663B2 (ja) * | 2018-10-24 | 2019-09-18 | 株式会社東京精密 | プローブカード型温度センサ及びウエハチャック温度測定方法 |
CN109782031A (zh) * | 2018-12-27 | 2019-05-21 | 上海华岭集成电路技术股份有限公司 | 一种高低温测试环境自动更换探针卡的方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100674417B1 (ko) | 2005-07-28 | 2007-01-29 | 미래산업 주식회사 | 반도체 소자 테스트용 테스트 챔버 유닛 |
KR100698965B1 (ko) | 2006-06-20 | 2007-03-23 | 주식회사 해동 | 금형의 온도제어장치 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05343486A (ja) * | 1992-06-04 | 1993-12-24 | Tokyo Electron Yamanashi Kk | 検査装置 |
JPH06349909A (ja) * | 1993-06-14 | 1994-12-22 | Hitachi Ltd | プローブ検査装置 |
JPH11145215A (ja) * | 1997-11-11 | 1999-05-28 | Mitsubishi Electric Corp | 半導体検査装置およびその制御方法 |
JPH11330171A (ja) * | 1998-05-11 | 1999-11-30 | Sony Corp | ウェーハプローバ及びそれにおけるウェーハの搬送処理方法 |
JP2000241454A (ja) * | 1999-02-23 | 2000-09-08 | Mitsubishi Electric Corp | 高温テスト用プローブカード及びテスト装置 |
JP2003215162A (ja) * | 2002-01-17 | 2003-07-30 | Seiko Epson Corp | プローブカード及びこれを備えた半導体測定装置 |
JP2004170267A (ja) * | 2002-11-20 | 2004-06-17 | Tokyo Seimitsu Co Ltd | プローブカード搬送台車 |
JP4391744B2 (ja) * | 2002-12-27 | 2009-12-24 | 東京エレクトロン株式会社 | 移動式プローブカード搬送装置、プローブ装置及びプローブ装置へのプローブカードの搬送方法 |
CN2695211Y (zh) * | 2004-04-23 | 2005-04-27 | 陈国华 | 一种台车装置 |
JP2007165715A (ja) * | 2005-12-15 | 2007-06-28 | Tokyo Electron Ltd | プローブカードの装着方法及びこの方法に用いられるプローブカード移載補助装置 |
US20070166134A1 (en) * | 2005-12-20 | 2007-07-19 | Motoko Suzuki | Substrate transfer method, substrate transfer apparatus and exposure apparatus |
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2007
- 2007-07-25 JP JP2007193495A patent/JP5049419B2/ja not_active Expired - Fee Related
-
2008
- 2008-04-03 CN CN2008100869825A patent/CN101354428B/zh active Active
- 2008-07-24 KR KR1020080072211A patent/KR101071024B1/ko active IP Right Grant
- 2008-07-24 TW TW097128187A patent/TWI459492B/zh active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100674417B1 (ko) | 2005-07-28 | 2007-01-29 | 미래산업 주식회사 | 반도체 소자 테스트용 테스트 챔버 유닛 |
KR100698965B1 (ko) | 2006-06-20 | 2007-03-23 | 주식회사 해동 | 금형의 온도제어장치 |
Also Published As
Publication number | Publication date |
---|---|
KR20090012123A (ko) | 2009-02-02 |
JP5049419B2 (ja) | 2012-10-17 |
CN101354428B (zh) | 2011-07-27 |
TW200921832A (en) | 2009-05-16 |
TWI459492B (zh) | 2014-11-01 |
CN101354428A (zh) | 2009-01-28 |
JP2009032801A (ja) | 2009-02-12 |
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