CN101354428B - 探针卡用台车和使用该台车的探针卡的操作方法 - Google Patents

探针卡用台车和使用该台车的探针卡的操作方法 Download PDF

Info

Publication number
CN101354428B
CN101354428B CN2008100869825A CN200810086982A CN101354428B CN 101354428 B CN101354428 B CN 101354428B CN 2008100869825 A CN2008100869825 A CN 2008100869825A CN 200810086982 A CN200810086982 A CN 200810086982A CN 101354428 B CN101354428 B CN 101354428B
Authority
CN
China
Prior art keywords
probe
temperature
chassis
inspection
pedestal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN2008100869825A
Other languages
English (en)
Chinese (zh)
Other versions
CN101354428A (zh
Inventor
长坂旨俊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of CN101354428A publication Critical patent/CN101354428A/zh
Application granted granted Critical
Publication of CN101354428B publication Critical patent/CN101354428B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
CN2008100869825A 2007-07-25 2008-04-03 探针卡用台车和使用该台车的探针卡的操作方法 Active CN101354428B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007193495 2007-07-25
JP2007-193495 2007-07-25
JP2007193495A JP5049419B2 (ja) 2007-07-25 2007-07-25 プローブカード用台車及びこの台車を用いるプローブカードの取り扱い方法

Publications (2)

Publication Number Publication Date
CN101354428A CN101354428A (zh) 2009-01-28
CN101354428B true CN101354428B (zh) 2011-07-27

Family

ID=40307330

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2008100869825A Active CN101354428B (zh) 2007-07-25 2008-04-03 探针卡用台车和使用该台车的探针卡的操作方法

Country Status (4)

Country Link
JP (1) JP5049419B2 (ja)
KR (1) KR101071024B1 (ja)
CN (1) CN101354428B (ja)
TW (1) TWI459492B (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI578000B (zh) * 2012-02-14 2017-04-11 精工愛普生股份有限公司 零件檢查裝置、及處理器

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101046769B1 (ko) * 2009-01-20 2011-07-06 주식회사 쎄믹스 프로브카드케이스
JP5517344B2 (ja) * 2010-02-12 2014-06-11 東京エレクトロン株式会社 プローブカードの搬送機構、プローブカードの搬送方法及びプローブ装置
CN104101425A (zh) * 2013-04-15 2014-10-15 镇江逸致仪器有限公司 具有常温检测与高温检测双夹具的巴条测试系统
JP6267928B2 (ja) * 2013-10-29 2018-01-24 東京エレクトロン株式会社 ウエハ検査装置の整備用台車及びウエハ検査装置の整備方法
JP5967509B1 (ja) * 2015-02-27 2016-08-10 株式会社東京精密 搬送ユニット及びプローバ
KR101854015B1 (ko) * 2015-11-06 2018-05-02 세메스 주식회사 프로브 카드 수납 장치
CN107664557B (zh) * 2017-11-15 2020-02-07 无锡阿尔法精密机械制造有限公司 陶瓷压力传感器等级分拣装置
JP6575663B2 (ja) * 2018-10-24 2019-09-18 株式会社東京精密 プローブカード型温度センサ及びウエハチャック温度測定方法
CN109782031A (zh) * 2018-12-27 2019-05-21 上海华岭集成电路技术股份有限公司 一种高低温测试环境自动更换探针卡的方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6043671A (en) * 1997-11-11 2000-03-28 Mitsubishi Denki Kabushiki Kaisha Semiconductor inspection device with guide member for probe needle for probe card and method of controlling the same

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05343486A (ja) * 1992-06-04 1993-12-24 Tokyo Electron Yamanashi Kk 検査装置
JPH06349909A (ja) * 1993-06-14 1994-12-22 Hitachi Ltd プローブ検査装置
JPH11330171A (ja) * 1998-05-11 1999-11-30 Sony Corp ウェーハプローバ及びそれにおけるウェーハの搬送処理方法
JP2000241454A (ja) * 1999-02-23 2000-09-08 Mitsubishi Electric Corp 高温テスト用プローブカード及びテスト装置
JP2003215162A (ja) * 2002-01-17 2003-07-30 Seiko Epson Corp プローブカード及びこれを備えた半導体測定装置
JP2004170267A (ja) * 2002-11-20 2004-06-17 Tokyo Seimitsu Co Ltd プローブカード搬送台車
JP4391744B2 (ja) * 2002-12-27 2009-12-24 東京エレクトロン株式会社 移動式プローブカード搬送装置、プローブ装置及びプローブ装置へのプローブカードの搬送方法
CN2695211Y (zh) * 2004-04-23 2005-04-27 陈国华 一种台车装置
KR100674417B1 (ko) 2005-07-28 2007-01-29 미래산업 주식회사 반도체 소자 테스트용 테스트 챔버 유닛
JP2007165715A (ja) * 2005-12-15 2007-06-28 Tokyo Electron Ltd プローブカードの装着方法及びこの方法に用いられるプローブカード移載補助装置
US20070166134A1 (en) * 2005-12-20 2007-07-19 Motoko Suzuki Substrate transfer method, substrate transfer apparatus and exposure apparatus
KR100698965B1 (ko) 2006-06-20 2007-03-23 주식회사 해동 금형의 온도제어장치

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6043671A (en) * 1997-11-11 2000-03-28 Mitsubishi Denki Kabushiki Kaisha Semiconductor inspection device with guide member for probe needle for probe card and method of controlling the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI578000B (zh) * 2012-02-14 2017-04-11 精工愛普生股份有限公司 零件檢查裝置、及處理器
TWI624673B (zh) * 2012-02-14 2018-05-21 精工愛普生股份有限公司 零件檢查裝置、及處理器

Also Published As

Publication number Publication date
KR20090012123A (ko) 2009-02-02
KR101071024B1 (ko) 2011-10-06
JP5049419B2 (ja) 2012-10-17
TW200921832A (en) 2009-05-16
TWI459492B (zh) 2014-11-01
CN101354428A (zh) 2009-01-28
JP2009032801A (ja) 2009-02-12

Similar Documents

Publication Publication Date Title
CN101354428B (zh) 探针卡用台车和使用该台车的探针卡的操作方法
JP6082453B2 (ja) プローブカードのプリヒート方法
JP4744382B2 (ja) プローバ及びプローブ接触方法
KR101018902B1 (ko) 검사 장치
KR101528342B1 (ko) 보정 장치, 프로브 장치 및 시험 장치
JP2004085259A (ja) プローブ装置
JP6674103B2 (ja) プローバ
KR101696682B1 (ko) 전자부품 핸들링 장치 및 전자부품 시험장치
US11092641B2 (en) Inspection apparatus and inspection method
JP6020758B1 (ja) プローバ
US10605829B2 (en) Transfer unit and prober
JP2007294665A (ja) プローブカード受け渡し方法、プローバ及びプローブカード供給・回収システム
US11249132B2 (en) Prober and method of preheating probe card
JP4999775B2 (ja) プローバ
JP2016180680A (ja) プローブカード型温度センサ
JP2009070874A (ja) 検査装置
JP2004266206A (ja) プローバ装置、プローブカードのプリヒート方法およびそのプログラム
JP2003344478A (ja) 検査装置及び検査方法
KR100831990B1 (ko) 프로브 카드의 탐침 예열 장치 및 방법
JPH11281705A (ja) Ｉｃ検査装置における温度制御方法およびｉｃ検査装置
WO2024062887A1 (ja) 測温用基板の校正方法、基板測温システム及び測温用基板
WO2022181377A1 (ja) 検査装置及び温度制御方法
JP2012178599A (ja) プローバおよびプローバの温度制御方法
JP2007234645A (ja) プローバ温度制御装置、及び、方法
JPH11121558A (ja) プローブ方法及びプローブ装置

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant