KR101064036B1 - 발광 소자 패키지 및 조명 시스템 - Google Patents

발광 소자 패키지 및 조명 시스템 Download PDF

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Publication number
KR101064036B1
KR101064036B1 KR1020100051998A KR20100051998A KR101064036B1 KR 101064036 B1 KR101064036 B1 KR 101064036B1 KR 1020100051998 A KR1020100051998 A KR 1020100051998A KR 20100051998 A KR20100051998 A KR 20100051998A KR 101064036 B1 KR101064036 B1 KR 101064036B1
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KR
South Korea
Prior art keywords
light emitting
emitting device
individual
lens
device package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020100051998A
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English (en)
Korean (ko)
Inventor
김충열
Original Assignee
엘지이노텍 주식회사
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Application filed by 엘지이노텍 주식회사 filed Critical 엘지이노텍 주식회사
Priority to KR1020100051998A priority Critical patent/KR101064036B1/ko
Priority to US13/115,291 priority patent/US8434910B2/en
Priority to EP11167966.8A priority patent/EP2400568B1/en
Priority to TW100118633A priority patent/TWI521738B/zh
Priority to JP2011123125A priority patent/JP5878305B2/ja
Priority to CN201110151924.8A priority patent/CN102270629B/zh
Application granted granted Critical
Publication of KR101064036B1 publication Critical patent/KR101064036B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape

Landscapes

  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
KR1020100051998A 2010-06-01 2010-06-01 발광 소자 패키지 및 조명 시스템 Expired - Fee Related KR101064036B1 (ko)

Priority Applications (6)

Application Number Priority Date Filing Date Title
KR1020100051998A KR101064036B1 (ko) 2010-06-01 2010-06-01 발광 소자 패키지 및 조명 시스템
US13/115,291 US8434910B2 (en) 2010-06-01 2011-05-25 Light emitting device package and lighting system
EP11167966.8A EP2400568B1 (en) 2010-06-01 2011-05-27 Light emitting device package including several lenses and lighting system
TW100118633A TWI521738B (zh) 2010-06-01 2011-05-27 發光裝置封裝件及照明系統
JP2011123125A JP5878305B2 (ja) 2010-06-01 2011-06-01 発光素子パッケージ及び照明システム
CN201110151924.8A CN102270629B (zh) 2010-06-01 2011-06-01 发光器件封装及照明系统

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020100051998A KR101064036B1 (ko) 2010-06-01 2010-06-01 발광 소자 패키지 및 조명 시스템

Publications (1)

Publication Number Publication Date
KR101064036B1 true KR101064036B1 (ko) 2011-09-08

Family

ID=44118011

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020100051998A Expired - Fee Related KR101064036B1 (ko) 2010-06-01 2010-06-01 발광 소자 패키지 및 조명 시스템

Country Status (6)

Country Link
US (1) US8434910B2 (enExample)
EP (1) EP2400568B1 (enExample)
JP (1) JP5878305B2 (enExample)
KR (1) KR101064036B1 (enExample)
CN (1) CN102270629B (enExample)
TW (1) TWI521738B (enExample)

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WO2013180890A1 (en) * 2012-06-01 2013-12-05 3M Innovative Properties Company Hybrid light bulbs using combinations of remote phosphor leds and direct emitting leds
KR20150040591A (ko) * 2013-10-07 2015-04-15 엘지이노텍 주식회사 렌즈모듈 및 이를 포함하는 발광소자패키지
WO2016123341A1 (en) * 2015-01-29 2016-08-04 Venntis Technologies, Llc Omni-directional light emitting device
WO2017099351A1 (ko) * 2015-12-09 2017-06-15 (주)파트론 광학 센서 패키지
KR20170068082A (ko) * 2015-12-09 2017-06-19 (주)파트론 광학 센서 패키지
KR20170129555A (ko) * 2016-05-17 2017-11-27 엘지이노텍 주식회사 발광 소자 및 이를 구비한 조명 모듈
WO2019132386A1 (ko) * 2017-12-26 2019-07-04 엘지이노텍 주식회사 발광소자 패키지 및 광원 장치
US11003020B2 (en) 2018-04-24 2021-05-11 Lg Display Co., Ltd. Light source package, backlight unit including light source package, and display device using the same

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US9070850B2 (en) 2007-10-31 2015-06-30 Cree, Inc. Light emitting diode package and method for fabricating same
US9335006B2 (en) 2006-04-18 2016-05-10 Cree, Inc. Saturated yellow phosphor converted LED and blue converted red LED
US10295147B2 (en) 2006-11-09 2019-05-21 Cree, Inc. LED array and method for fabricating same
US9425172B2 (en) 2008-10-24 2016-08-23 Cree, Inc. Light emitter array
WO2011148674A1 (ja) * 2010-05-26 2011-12-01 シャープ株式会社 Ｌｅｄ光源、ｌｅｄバックライト、液晶表示装置およびｔｖ受信装置
WO2012053571A1 (en) * 2010-10-22 2012-04-26 Semiconductor Energy Laboratory Co., Ltd. Light-emitting element, light-emitting device, and lighting device
TWI414714B (zh) 2011-04-15 2013-11-11 Lextar Electronics Corp 發光二極體杯燈
CN102588762A (zh) * 2011-01-06 2012-07-18 隆达电子股份有限公司 发光二极管杯灯
US9786811B2 (en) 2011-02-04 2017-10-10 Cree, Inc. Tilted emission LED array
JP5373859B2 (ja) * 2011-07-05 2013-12-18 デクセリアルズ株式会社 照明装置
US10842016B2 (en) * 2011-07-06 2020-11-17 Cree, Inc. Compact optically efficient solid state light source with integrated thermal management
CN103503178B (zh) * 2011-07-12 2015-04-29 松下电器产业株式会社 光学元件以及利用了该光学元件的半导体发光装置
KR101326518B1 (ko) 2011-09-02 2013-11-07 엘지이노텍 주식회사 조명 장치
JP5742629B2 (ja) * 2011-09-26 2015-07-01 東芝ライテック株式会社 発光装置及びこれを備えた照明器具
KR102017538B1 (ko) 2012-01-31 2019-10-21 엘지이노텍 주식회사 조명 장치
CN102543987A (zh) * 2012-02-07 2012-07-04 达亮电子（苏州）有限公司 固态发光组件
EP2645434A1 (en) * 2012-03-30 2013-10-02 Lumenmax Optoelectronics Co., Ltd. Led-packaging arrangement with uniform light and wide angle
CN102620215B (zh) * 2012-04-11 2014-08-13 深圳市华星光电技术有限公司 Led背光光源
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KR101961310B1 (ko) * 2012-07-09 2019-07-17 엘지이노텍 주식회사 발광 장치
KR20140096722A (ko) * 2013-01-29 2014-08-06 엘지이노텍 주식회사 램프 유닛
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TWI559053B (zh) * 2013-05-28 2016-11-21 潘宇翔 適用於直下式背光模組之光源裝置及其顯示器
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TWI582344B (zh) * 2013-08-05 2017-05-11 鴻海精密工業股份有限公司 透鏡及使用該透鏡的光源裝置
CN104344344A (zh) * 2013-08-06 2015-02-11 鸿富锦精密工业（深圳）有限公司 透镜及使用该透镜的光源装置
KR20150025231A (ko) * 2013-08-28 2015-03-10 서울반도체 주식회사 광원 모듈 및 그 제조 방법, 및 백라이트 유닛
KR102140028B1 (ko) * 2013-10-22 2020-08-03 삼성디스플레이 주식회사 표시 장치의 광원용 렌즈 및 이를 포함하는 표시 장치의 광원
CN104566211A (zh) * 2013-10-28 2015-04-29 鸿富锦精密工业（深圳）有限公司 复合透镜及使用该复合透镜的光源装置
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JP6659612B2 (ja) * 2017-03-31 2020-03-04 Ｈｏｙａ Ｃａｎｄｅｏ Ｏｐｔｒｏｎｉｃｓ株式会社 発光装置、光照射モジュール、及び光照射装置
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CN108019669B (zh) * 2017-11-28 2020-10-30 西安科锐盛创新科技有限公司 智能led地面灯
JP2020021823A (ja) * 2018-07-31 2020-02-06 日亜化学工業株式会社 発光装置
JP7178820B2 (ja) * 2018-08-09 2022-11-28 シチズン時計株式会社 Ｌｅｄ発光装置
CN111341765A (zh) * 2018-12-18 2020-06-26 深圳Tcl新技术有限公司 一种背光模组
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KR102457808B1 (ko) * 2020-08-26 2022-10-24 주식회사 예지아테크코리아 광학 렌즈, 발광 모듈 및 이를 구비한 라이트 유닛
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