US11417804B2 - Light emitting device package and light source device - Google Patents
Light emitting device package and light source device Download PDFInfo
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- US11417804B2 US11417804B2 US16/958,043 US201816958043A US11417804B2 US 11417804 B2 US11417804 B2 US 11417804B2 US 201816958043 A US201816958043 A US 201816958043A US 11417804 B2 US11417804 B2 US 11417804B2
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- Prior art keywords
- light emitting
- emitting device
- frame
- disposed
- conductive
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/508—Wavelength conversion elements having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
Definitions
- An embodiment of the invention relates to a light emitting device package and a light source device.
- Light emitting devices such as Light Emitting Diode or Laser Diode using Group III-V or II-VI compound semiconductor materials have an advantage capable of realizing light of various wavelength bands such as red, green, blue, and ultraviolet light by development as thin film growth technology and device materials.
- a light emitting device capable of providing a high output is requested, research is being conducted on a device capable of high output by applying high power.
- research is being conducted on a method of improving the bonding strength between the electrode of the light emitting device package and the light emitting device.
- An embodiment of the present invention provides a light emitting device package that may expose or protrude a region of each frame corresponding to each bonding portion of the light emitting device.
- An embodiment of the present invention provides a light emitting device package that may arrange a body on a periphery of a region of each frame corresponding to each bonding portion of the light emitting device or protrude the region in a vertical direction.
- An embodiment of the present invention provides a light emitting device package in which a protrusion of a frame facing each bonding portion of the light emitting device protrudes in a horizontal direction or a vertical direction.
- An embodiment of the present invention provides a light emitting device package and a method of manufacturing the same, which reduces the region of discoloration of the frame and increases the reflection area by the body by reducing the region of the frames in which the light emitting devices are disposed or dispersing the frames.
- An embodiment of the invention provides a light emitting device package having at least one or both of a recess and a spacer on the upper portion of the body.
- An embodiment of the present invention provides a light emitting device package and a method of manufacturing the same so that the bonding portion of the light emitting device is spaced apart from the conductive protrusion of the frame by disposing the support portion of the body at a height different from the height of the conductive protrusion of the frame.
- An embodiment of the present invention provides a light emitting device package and a method of manufacturing the same, which improve light reflection efficiency by disposing a first resin around a conductive protrusion of the frame.
- An embodiment of the present invention provides a light emitting device package and a method of manufacturing the same, which reduce the exposed area of the frame by disposing a reflective wall made of a resin having a multi-step structure around the lower portion of the light emitting device.
- An embodiment of the invention provides a light emitting device package having a protrusion or spacer to prevent the moving of the light emitting device around the light emitting device and a method for manufacturing the same.
- the embodiment may provide a light source device in which a light emitting device package is disposed on a board.
- the light emitting device package comprises a first frame and a second frame spaced apart from each other; a body disposed between the first frame and the second frame; and a light emitting device disposed on the first frame and the second frame, wherein the first frame includes a first end portion adjacent to the second frame, and the second frame includes a second end portion adjacent to the first frame and an disposed facing the first end portion, the first end portion includes a first protrusion protruding toward the second frame, and the second end portion includes a second protrusion protruding toward the first frame, the light emitting device includes a first bonding portion disposed on the first protrusion and a second bonding portion disposed on the second protrusion, the body includes first and second reflective portions extending to both side surfaces of the first protrusion toward the first frame, and third and fourth reflective portions extending to both side surfaces of the second protrusion toward the second frame, wherein the light emitting device may overlap with the first to fourth reflective portions in the vertical direction.
- a light emitting device package comprises: first and second frames spaced apart from each other and including an upper surface and a lower surface thereof, respectively; a body disposed between the first frame and the second frame; and a light emitting device disposed on the body.
- the first frame and the second frame include a first conductive protrusion and a second conductive protrusion respectively protruding toward the light emitting devices from the upper surfaces of the first and second frames, wherein the light emitting devices may include a first bonding portion facing the first conductive protrusion and a second bonding portion facing the second conductive protrusion.
- the body includes first and second recesses spaced apart from each other between the first and second frames, and the first and second recesses may include an inner portion overlap the light emitting device in a vertical direction and an outer portion extending outward from the side surface of the light emitting device.
- the first end portion of the first frame includes third and fourth protrusions spaced from both sides of the first protrusion and protruding in the direction of the second frame, and the second end portion of the second frame includes fifth and sixth protrusions protruding in a direction of the first frame and spaced on both sides of the second protrusion, the first reflective portion is disposed between the first and third protrusions, and the second reflective portion is disposed between the first and fourth portions, The third reflective portion may be disposed between the second and fifth protrusions, and the fourth reflective portion may be disposed between the second and sixth protrusions.
- a first resin is disposed between the light emitting device and the body.
- the first to fourth reflective portions include a plurality of spacers respectively disposed on a lower surface of the corner portion of the light emitting device, and the plurality of spacers are spaced apart the light emitting devices from the upper surfaces of the first and second protrusions.
- a conductive portion may be disposed between the first bonding portion of the light emitting device and the first protrusion, and between the second bonding portion of the light emitting device and the second protrusion.
- the body may include a support portion protruding from the first and second protrusions.
- the support portion of the body has a first height based on the upper surface of the first frame, and the first and second conductive protrusions have a second height based on the upper surface of the first frame, the first height and the second heights may be different from each other.
- the upper surface of the first frame and the upper surface of the second frame may be disposed on the same plane with each other, and the first and second conductive protrusions have first and second flat surfaces with a flat upper surface, and a width of the first and second bonding portions and width of the first and second flat surfaces may be different from each other.
- the first height is disposed higher than the second height
- the upper surface of the support portion may be disposed higher than the upper surface of the first and second bonding portions based on the upper surface of the first frame.
- the light emitting device package may include a first conductive portion disposed between the first bonding portion and the first conductive protrusion, and a second conductive portion between the second bonding portion and the second conductive protrusion, and a thickness of the first and second conductive portions may be equal to the difference between the first and second heights.
- an upper body is disposed around an upper portion of the body and the first and second frames and has a cavity therein, the inner surface of the cavity may include a reflective wall having a flat upper surface and extending in the inner direction.
- a second resin includes in a periphery of the lower portion of the light emitting device, and the reflective wall has an angle greater than an inclination angle of the inner surface of the cavity, and the second resin is disposed around the first and second conductive protrusions and may protrude along the reflective wall.
- a sub-reflective wall extending inward from the reflective wall is provided at a lower portion of a side of the cavity, and an upper surface of the sub-reflective wall has a lower height than a height of the upper surface of the reflective wall, and upper surfaces of the reflective wall and the sub-reflective wall is flat, and an area of the flat upper surface of the reflective wall may be larger than an area of the flat upper surface of the sub-reflective wall.
- the height of the sub-reflective wall is lower than the lower surface of the light emitting device and is disposed higher than the upper surface of the first and second conductive protrusions, and the sub-reflective wall may be connected to the support portion.
- Light source device a circuit board; and one or more light emitting device packages on the circuit board.
- the end portions of the frames corresponding to each other are divided into a plurality and are be coupled with the body, thereby dispersing thermal stress and preventing crack defects in the solder material due to thermal deformation of the body.
- at least one recess is provided on the body, thereby improving adhesion between the resin disposed in the recess and the light emitting device and preventing the light emitting device from tilting.
- the supporting force of the light emitting device may be improved and the heat dissipation characteristics and heat conduction characteristics may be improved by a conductive portion disposed between the bonding portion of the light emitting device and the frame.
- reflection efficiency may be improved.
- FIG. 1 is an exploded perspective view of a light emitting device package according to a first embodiment of the invention.
- FIG. 2 is a plan view of the light emitting device of the light emitting device package in FIG. 1 .
- FIG. 3 is a bottom view of the light emitting device package in FIG. 2 .
- FIG. 4 is a cross-sectional view taken along A-A side of the light emitting device package in FIG. 2 .
- FIG. 5 is a view showing a body of the light emitting device package.
- FIG. 6 is a cross-sectional view seen from C-C side of the light emitting device package of FIG. 1 .
- FIG. 7 is a view showing a region of the first resin in the light emitting device package of FIG. 2 .
- FIG. 8 is a cross-sectional side view showing a through hole of the body as another example of the light emitting device package of FIG. 7 .
- FIG. 9 is a view showing a recess of the body as another example of the light emitting device package of FIG. 7 .
- FIG. 10 is a cross-sectional view taken along E-E side sectional view of the light emitting device package of FIG. 9 .
- FIG. 11 is a perspective view illustrating a first modification example in the light emitting device package of FIG. 1 .
- FIG. 12 is a view showing a cross section in a second direction based on the first frame in the light emitting device package of FIG. 11 .
- FIG. 13 is a view showing a cross section in a first direction passing through the first and second frames in the light emitting device package of FIG. 11 .
- FIG. 14 is an example of a plan view of a body deformed in the light emitting device package of FIG. 11 .
- FIG. 15 is a perspective view illustrating a second modification example of the light emitting device package of FIG. 1 .
- FIG. 16 is a view showing a region of the first resin under the light emitting device in the light emitting device package of FIG. 15 .
- FIG. 17 is a perspective view showing a third modification example of the light emitting device package according to the embodiment(s) of the present invention.
- FIG. 18 is a perspective view showing a fourth modification of the light emitting device package according to the embodiment(s) of the present invention.
- FIG. 19 is an example of a top view showing the structure of the frames of FIGS. 17 and 18 .
- FIG. 20 is an exploded perspective view of a light emitting device package according to a second embodiment of the present invention.
- FIG. 21 is a combined plan view of the light emitting device package of FIG. 20 .
- FIG. 22 is a bottom view of the light emitting device package of FIG. 21 .
- FIG. 23 is a cross-sectional view taken along A 1 -Al side of the light emitting device package in FIG. 21 .
- FIG. 24 is an enlarged view illustrating a conductive protrusion of the frame of the light emitting device package and a bonding portion of the light emitting device in FIG. 21 .
- FIG. 25 is a side cross-sectional view showing a recess in the support portion of the body of the light emitting device package in FIG. 21 .
- FIG. 26 is a cross-sectional view taken along B 1 -B 1 side of the light emitting device package of FIG. 21 .
- FIG. 27 is a view showing another example of the light emitting device package of FIG. 21 .
- FIG. 28 is a plan view illustrating another example of the light emitting device package of FIG. 21 .
- FIG. 29 is a side cross-sectional view of the light emitting device package of FIG. 28 .
- FIG. 30 is a view showing an example in which the phosphor is disposed on the inner surface of the cavity in the light emitting device package of FIG. 29 .
- FIG. 31 is another example of the light emitting device package of FIG. 28 .
- a light emitting device package 100 may include a package body 110 and a light emitting device 120 .
- a length of the first direction X may be greater than a length of the second direction Y.
- the length of the first direction of the package may be greater than the length of the first direction of the package body 110
- the length of the first direction X of the package body 110 may be equal to or greater than the length of the second direction Y.
- the first direction is the X direction
- the second direction is the Y direction orthogonal to the X direction
- a third direction may be a Z direction or the vertical direction orthogonal to the X and Y directions.
- the first direction may be a direction of a longer side of the sides of the light emitting device 120 .
- both short sides of the light emitting device 120 may be disposed on opposite sides
- both long sides of the light emitting device 120 may be disposed on opposite sides.
- the package body 110 may include first and second side surfaces S 1 and S 2 extending in the second direction, and third and fourth side surfaces S 3 and S 4 extending in the first direction.
- the first and second side surfaces S 1 and S 2 are opposite sides from each other, and the third and fourth side surfaces S 3 and S 4 are opposite sides from each other, and an interval between the first and second side surfaces S 1 and S 2 is the length of the third and fourth sides S 3 and S 4 in the first direction, and an interval between the third and fourth sides S 3 and S 4 mat be the length of the first and second side surfaces S 1 and S 2 in the second direction.
- Each side surface S 1 , S 2 , S 3 , and S 4 may be the outer side of the body 115 and may be disposed vertically or inclined.
- the package body 110 may include a body 115 and a plurality of frames.
- the plurality of frames may include, for example, a first frame 111 and a second frame 113 spaced apart from each other in the first direction.
- the body 115 is disposed between the first and second frames 111 and 113 and may be coupled to the frames 111 and 113 .
- the body 115 may be disposed around each frame, and may function as an electrode separator or may be referred to as an insulating body.
- the body 115 may be disposed on the first and second frames 111 and 113 .
- the body 115 may provide a cavity 102 having an inner surface 132 inclined above the first and second frames 111 and 113 .
- the package body 110 may be provided in a structure with a cavity 102 , or may be provided in a flat structure without a cavity 102 .
- the body 115 may include an upper body 110 A having a cavity 102 , and the body 115 and the upper body 110 A may be formed of the same material or may be different materials.
- the upper body 110 A may be integrally formed with the body 115 or separately formed.
- the body 115 may be a resin material or an insulating resin material.
- the body 115 may be formed of at least one of PPA (Polyphthalamide), PCT (Polychloro Triphenyl), LCP (Liquid Crystal Polymer), PAST (Polyamide9T), silicone, epoxy, EMC (Epoxy molding compound), SMC (Silicon molding compound), ceramic, PSG (photo sensitive glass), and sapphire (Al 2 O 3 ).
- the resin material of the body 115 may include fillers of high refractive material such as TiO 2 and SiO 2 .
- the body 115 may be formed of a thermoplastic resin, and the thermoplastic resin is a material that is re-hardened when heated and cooled, when the frames 111 and 113 and materials in contact with it expand or contract by heat, the body 115 may act as a buffer.
- conductive portions such as solder-based paste, Ag-based paste, and SAC (Sn-Ag-Cu)-based paste may be prevented from being damaged.
- a coefficient of thermal expansion (CTE) due to thermal expansion and contraction may have a first direction greater than a second direction.
- the body 115 may include a PCT or PPA material, and the PCT or PPA material has a high melting point and is a thermoplastic resin.
- the inner surface 132 of the cavity 102 may be inclined at different angles from the first direction and the second direction.
- the inner surface 132 is inclined at a second angle with respect to a horizontal straight line
- the inner surface of the reflective wall 134 extending to a lower portion of the side surface of the cavity 102 is inclined at a first angle and faces to a side of the light emitting device 120 , and the upper surface of the reflective wall may be formed as a flat surface.
- the first angle may be greater than the second angle with respect to the horizontal straight line.
- the first angle of the reflective wall 134 may be formed at an angle in the range of 45 degrees or more, for example, 45 degrees to 70 degrees, so that a material such as burr is not formed.
- the interval b 2 in the first direction between the reflective wall 134 and the light emitting device 120 may be 400 ⁇ m or less, for example, in a range of 200 to 400 ⁇ m, and the interval in the second direction may be equal to or smaller than the interval b 2 .
- the maximum distance (b 1 ) from the side of the light emitting device 120 to the upper surface of the reflective wall 134 is 700 ⁇ m or less, for example, in the range of 450 to 700 ⁇ m, thereby reducing light loss.
- the width Wb in the first direction of the reflective wall 134 may be 230 ⁇ m or less, for example, in a range of 180 to 230 ⁇ m, and the width in the second direction may be equal to or smaller than the width Wb in the first direction and may be, for example, 200 ⁇ m or less, for example, in a range of 130 to 200 ⁇ m.
- the widths of the first and second directions of the reflective wall 134 may consider distribution of a light directing angle by the cavity 120 or provide a space for a fixture for an under-fill process.
- the first and second frames 111 and 113 may be provided as conductive or metal frames.
- the frames 111 and 113 are metals, for example, as least one selected from copper (Cu), titanium (Ti), nickel (Ni), gold (Au), chromium (Cr), tantalum (Ta), platinum (Pt), tin (Sn), silver (Ag), and may be formed in a single layer or multiple layers.
- the thicknesses of the first and second frames 111 and 113 may be 100 ⁇ m or more, for example, in a range of 100 to 300 ⁇ m, thereby preventing heat and electric conductivity from being lowered. As shown in FIGS.
- the first extension portions 17 and 18 of the first frame 111 may extend in the direction of the first side surface Si or protrude outward than the first side surface S 1 .
- the second extension portions 37 and 38 of the second frame 113 may extend in the direction of the second side surface S 2 or protrude outward from the second side surface S 2 .
- the first extension portion 17 and 18 and the second extension portion 37 and 38 may be arranged in one or a plurality.
- the outer surfaces of the first and second frames 111 and 113 may be coupled to the body 115 in step structures ST 1 and ST 2 .
- the outer sides of the first extension portions 17 and 18 and the second extension portions 37 and 38 may be coupled to the body 115 in stepped structures ST 3 and ST 4 .
- a region between the first extension portions 17 and 18 and a region between the second extension portions 37 and 38 may be partially disposed of the body 115 , respectively.
- the stepped structures ST 1 , ST 2 , ST 3 , and ST 4 may increase the coupling area between the frames 111 and 113 and the body 115 , and prevent moisture penetration.
- a plurality of holes H 1 , H 2 , H 3 , and H 4 may be disposed inside the extension portions 17 , 18 , 37 , and 37 of each of the frames 111 and 113 , and the concave portions Ra, Rb, Rc, and Rd may concavely disposed on the outside of the extension portions 17 , 18 , 37 , and 37 .
- the concave portions Ra, Rb, Rc, and Rd and the holes H 1 , H 2 , H 3 , and H 4 may be disposed in a region overlapping the body 115 to enhance the bonding force with the body and suppress moisture penetration.
- the first end portion of the first frame 111 may include a plurality of protrusions 11 , 12 and 13 protruding in a direction of the second frame 113 or in a direction of the second side surface S 2 .
- the second end portion of the second frame 113 may include a plurality of protrusions 31 , 32 and 33 protruding in the direction of the first frame 111 or in a direction of the first side surface S 1 .
- the first frame 111 may include a first protrusion 11 on the center region and the second frame 113 may include a second protrusion 31 on the center region.
- the first frame 111 may include a third protrusion 12 adjacent to the third side surface S 3 of the body 115 and a fourth protrusion 13 adjacent to the fourth side surface S 4 .
- the second frame 113 may include a fifth protrusion 32 adjacent to the third side surface S 3 of the body 115 and a sixth protrusion 33 adjacent to the fourth side surface S 4 .
- the first and second protrusions 11 and 31 may overlap the light emitting device 120 in the vertical direction Z.
- the first protrusion 11 may be disposed between the third and fourth protrusions 12 and 13 .
- the second protrusion 31 may be disposed between the fifth and sixth protrusions 32 and 33 .
- the third protrusion 12 may be disposed between the first protrusion 11 and the third side surface S 3
- the fourth protrusion 13 may be disposed between the first protrusion 11 and the fourth side surface S 4
- the fifth protrusion 32 may be disposed between the second protrusion 31 and the third side surface S 3
- the sixth protrusion 33 may be disposed between the second protrusion 31 and the fourth side surface S 4 .
- the first, third and fourth protrusions 11 , 12 and 13 may overlap in the second direction.
- the second, fifth and sixth protrusions 31 , 32 and 33 may overlap in the second direction.
- the third and fifth protrusions 12 and 32 may be spaced apart from the third side surface S 3
- the fourth and sixth protrusions 32 and 33 may be spaced apart from the fourth side surface S 4
- the second, fifth and sixth protrusions 31 , 32 and 33 may overlap in the second direction.
- Each of the first, third and fourth protrusions 11 , 12 and 13 and the second, fifth and sixth protrusions 31 , 32 and 33 may be exposed at the bottom of the body 15 .
- the outer portions of the third and fifth protrusions 12 and 32 and the fourth and sixth protrusions 13 and 33 may overlap the upper body 110 A in a vertical direction.
- the first and second protrusions 11 and 31 are disposed at the center of the bottom of the cavity 102 , and the inner regions of the third to sixth protrusions 12 , 13 , 32 and 33 may be spaced apart from to a bottom of cavity 102 or partially exposed to the bottom of the cavity 102 .
- the area of the upper surface of the first or second protrusions 11 and 31 may be larger than that of the third and fourth protrusions 12 and 13 or the area of the upper surfaces of the fifth and sixth protrusions 32 and 33 , thereby improving the heat dissipation efficiency of the light emitting device 120 .
- the upper surface area of the light emitting device 120 at the bottom of the cavity 102 may be greater than the sum of the upper surface areas of the frames 111 and 113 disposed on the bottom of the cavity 102 or the sum of the upper surface areas the first and second protrusions 11 and 31 .
- the number of each of the first and second protrusions 11 and 31 may be the same as the number of light emitting devices 120 .
- Each of the first and second protrusions 11 and 31 may face each of the bonding portions 121 and 122 of the light emitting device 120 .
- the conductive portion 321 is disposed between the first frame 111 and the first bonding portion 121 and between the second frame 113 and the second bonding portion 122 and may electrically connected.
- the protrusions 11 , 12 , 13 of the first frame 111 and the protrusions 31 , 32 , 33 of the second frame 113 are disposed so that at least a portion overlaps in the second direction, a rigidity of the package body 110 or the body 115 may be enhanced.
- an end portion of the fourth protrusion 13 may protrude more in a direction of the second frame than the first and third protrusions 11 and 12 .
- End portion of the fifth protrusions 34 may protrude more in a direction of the first frame than the second and sixth protrusions 31 and 33 .
- the end portion of the fourth protrusion 13 and the end portion of the fifth protrusion 32 may overlap in the second direction.
- the fourth protrusion 13 and the fifth protrusion 32 are disposed to overlap in the second direction in regions opposite to each other based on the first and second protrusions 11 and 31 , so that a center rigidity of the body 115 may be enhanced.
- four or more protrusions may be disposed on at least one or both of the first and second frames 111 and 113 .
- the third and fourth protrusions 12 and 13 , and the fifth and sixth protrusions 32 and 33 may be disposed under the upper body 110 A and may not be exposed to the bottom of the cavity 102 . Accordingly, the area of the body 115 may be provided larger than the area of the frames 111 and 113 based to the bottom of the cavity 102 . Since the reflective properties of the body 115 are higher than the reflective properties of the frames 111 and 113 , the light reflection efficiency at the bottom of the cavity 102 may be improved.
- the reflective portion of the body 115 may disposed between the protrusions 11 , 12 , and 13 of the first frame 111 and the protrusions 31 , 32 , and 33 of the second frame 113 , respectively.
- the body 115 includes a first reflective portion C 11 extending into the region between the first and third protrusions 11 and 13 , a second reflective portion C 12 extending into the region between the first and fourth protrusions 11 and 13 , a third reflective portion C 13 extending into the region between the second and fifth protrusions 31 and 32 , and a fourth reflective portion C 14 extending into the region between the second and sixth protrusions 31 and 33
- Each of the reflective portions C 11 , C 12 , C 13 , and C 14 is coupled to a concave curved or rounded area of the frame 111 , 113 , and the contact area with each protrusion 11 , 12 , 13 , 31 , 32 , and 33 is increased and may suppress moisture penetration.
- the first and third reflective portions C 11 and C 13 overlap in the first direction and extend in opposite directions, and the second and fourth reflective portions C 12 and C 14 may overlap in the first direction and may be extended in opposite directions to each other.
- the first protrusion 11 is disposed between the first and second reflective portions C 11 and C 12
- the second protrusion 31 may be disposed between the third and fourth reflective portions C 13 and C 14 .
- the first and second reflective portions C 11 and C 12 contact the outer surface of the first protrusion 11
- the third and fourth reflective portions C 13 and C 14 may be contacted with outer surfaces of the second protrusion 31 .
- Light reflectivity may be improved by a reflective portion of a body material disposed on the bottom of the cavity 102 .
- Each of the reflective portions C 11 , C 12 , C 13 , and C 14 may overlap the light emitting device 120 in the vertical direction, and may reflect light traveling in the lateral or downward direction from the light emitting device 120 .
- Each of the reflective portions C 11 , C 12 , C 13 , and C 14 may be formed of the same resin material as the body 115 and may disposed in a dispersed region, thereby preventing the conductive portion 321 from diffusing. Since the reflective portions C 11 , C 12 , C 13 , and C 14 prevent diffusion of the conductive portion 321 , the bonding force of the conductive portion 321 disposed between the light emitting device 120 and the frames 111 and 113 may be improved.
- Each of the reflective portions C 11 , C 12 , C 13 , and C 14 may serve as a dam preventing diffusion of the conductive portion 321 , and the light emitting device 120 may include the first and second protrusions 11 and 31 may be prevented from being distorted.
- the conductive portion 321 may include a conductive paste, for example, a solder-based paste, an Ag-based paste or a SAC (Sn—Ag—Cu) series.
- An embodiment of the invention may reduce the problem of thermal deformation of the body due to thermal expansion by reducing the area of the frames. Due to the reduction in thermal deformation of the body, crack generation of the conductive portion may be reduced. In addition, it is possible to reduce the problem of discoloration of the surface of the frame by improving the reflection efficiency by the material of the reflective portions C 11 , C 12 , C 13 , and C 14 and improving the adhesion with the molding portion 190 .
- the light emitting device 120 may include a first bonding portion 121 , a second bonding portion 122 and a light emitting structure 123 .
- the light emitting device 120 may include a substrate 124 on the light emitting structure 123 .
- the light emitting device 120 may have a length in the first direction equal to or longer than the length in the second direction.
- the first bonding portion 121 is disposed between the light emitting structure 123 and the first frame 111
- the second bonding portion 122 may be disposed between the light emitting structure 123 and the second frame 113 .
- the first and second bonding portions 121 and 122 may be a metal material or a conductive material.
- the first and second bonding portions 121 and 122 may be one material or alloy selected from group consisting of Ti, Al, In, Ir, Ta, Pd, Co, Cr, Mg, Zn, Ni, Si, Ge, Ag, Ag alloy, Au, Hf, Pt, Ru, Rh, ZnO, IrOx, RuOx, NiO, RuOx/ITO, Ni/IrOx/Au, Ni/IrOx/Au/ITO and may be formed of single layer or multi-layers.
- the light emitting structure 123 may include a first conductive semiconductor layer, a second conductive semiconductor layer, and an active layer disposed between the first and second conductive semiconductor layers.
- the first bonding portion 121 may be electrically connected to the first conductive semiconductor layer.
- the second bonding portion 122 may be electrically connected to the second conductive semiconductor layer.
- the substrate 124 is a light-transmitting material and may be formed of an insulating material or a semiconductor material.
- the light emitting structure 123 may be provided as a compound semiconductor, for example, may be provided as a compound semiconductor of Group II-Group VI or a Group III-Group V.
- the first and second conductive semiconductor layers are formed of, for example, a semiconductor material having a composition formula of In x Al y Ga 1-x-y N (0 ⁇ x ⁇ 1, 0 ⁇ y ⁇ 1, 0 ⁇ x+y ⁇ 1), and may include at least one of GaN, AlN, AlGaN, InGaN, InN, InAlGaN, AlInN, AlGaAs, GaP, GaAs, GaAsP, AlGaInP.
- the first conductive semiconductor layer may be an n-type semiconductor layer, and the second conductive semiconductor layer may be a p-type semiconductor layer.
- the active layer may be embodied as at least one of compound semiconductors of Group III-V or Group II-VI.
- the active layer may include a plurality of well layers and a plurality of barrier layers, for example, may include at least one selected from the group including InGaN/GaN, GaN/AlGaN, AlGaN/AlGaN, InGaN/AlGaN, InGaN/InGaN, AlGaAs/GaAs, InGaAs/GaAs, InGaP/GaP, AlInGaP/InGaP, InP/GaAs.
- the light emitting device 120 may include one or a plurality of light emitting cells therein.
- the light emitting cell may include at least one of n-p junction, p-n junction, n-p-n junction, and p-n-p junction.
- the plurality of light emitting cells may be connected to each other in series within one light emitting device. Accordingly, the light emitting device may have one or a plurality of light emitting cells, and when n (n is 2 or more) light emitting cells are disposed in one light emitting device, the light emitting device may be driven with a driving voltage of n times.
- the light emitting device 120 may be disposed on the body 115 and the first and second frames 111 and 113 .
- the first and second bonding portions 121 and 122 of the light emitting device 120 may be disposed on the first and second protrusions 11 and 31 of the first and second frames 111 and 113 .
- the light emitting device 120 may be disposed in the cavity 102 , and the upper body 110 A may be arranged around the light emitting device 120 .
- the sub-cavity 133 A may be disposed on a side adjacent to the third side or the fourth side among the inner surfaces of the cavity 102 .
- a portion of the first and second frames 111 and 113 may be exposed on the bottom of the sub-cavity 133 A, and a protective device 125 is disposed on any one of the exposed frames, and electrically connected to other frames or may be connected by wire 126 .
- a reflective resin 135 is disposed in the sub-cavity 133 A, and the reflective resin 135 seals the protective device 125 and the wire 126 .
- the reflective resin 135 is formed of a resin material such as silicone or epoxy, and may include a high refractive filler therein.
- the protective device 125 may be disposed on the third protrusion 12 of the first frame 111 and the fifth protrusion 32 of the second frame 113 .
- the sub-cavity 133 A may be connected to the cavity 102 or separated by a resin wall.
- the first resin 160 may be disposed between the body 115 and the light emitting device 120 .
- the first resin 160 may include an adhesive material and/or a reflective material.
- the first resin 160 may be disposed between the upper surface of the body 115 and the lower surface of the light emitting device 120 , and may overlap the light emitting device 120 in a vertical direction.
- the first resin 160 may include at least one of an epoxy-based material, a silicon-based material, an epoxy-based material, and a hybrid material including a silicon-based material.
- the first resin 160 may include white silicone, and may include a filler such as TiO 2 , SiO 2 , or Al 2 O 3 therein.
- the first resin 160 may be adhered to the light emitting device 120 and the body 115 .
- the first resin 160 is disposed between the first bonding portion 121 and the second bonding portion 122 of the light emitting device 120 and may be in contact with the first and second bonding portions 121 and 122 .
- the first resin 160 may be adhered to a region between the lower surface of the light emitting device 120 and the frames 111 and 113 and a region between the light emitting device 120 and the body 115 . Accordingly, the first resin 160 may enhance the lower adhesive force and the supporting force of the light emitting device 120 .
- the first resin 160 may prevent the light emitting device 120 from being tilted by the conductive portion 321 and diffuse light and improve the reflection efficiency.
- Each of the frames 111 and 113 and each of the bonding portions 121 and 122 may be combined by an intermetallic compound layer.
- the first and second protrusions 11 and 31 of each of the frames 111 and 113 and the bonding portions 121 and 122 may be combined by an intermetallic compound layer.
- the intermetallic compound layer may include a material constituting the conductive portion 321 .
- the conductive portion 321 disposed on the first protrusion 11 of the first frame 111 is in direct contact with the lower surface of the first bonding portion 121 , and is electrically connected to the first bonding portion 121 .
- the conductive portion 321 disposed on the second protrusion 31 of the second frame 113 is in direct contact with the lower surface of the second bonding portion 122 , and may be electrically connected to the second bonding portion 122 .
- the conductive portion 321 may include at least one of Ag, Au, Pt, Sn, Cu, Zn, In, Bi, and Ti or an alloy thereof.
- the conductive portion 321 is a solder paste, and may be formed by mixing powder particles or particle particles and flux.
- the solder paste may include Sn—Ag—Cu, and the weight percentage of each metal may vary.
- the conductive portion 321 may include SAC (Sn—Ag—Cu) or SAC-based material.
- the conductive portion 321 may include a solder-based paste or a silver-based paste.
- the bonding portions 121 and 122 of the light emitting device 120 may be formed of an intermetallic compound (IMC) layer between the conductive portion 321 and the frames 111 and 113 , in a heat treatment process of a material constituting the conductive portion 321 and a process of forming the conductive portion 321 or after the conductive portion 321 is provided.
- IMC intermetallic compound
- an alloy layer may be formed by bonding between the material constituting the conductive portion 321 and the metal of the frames 111 and 113 , so that the alloy layer is physically and electrically coupled to the conductive portion 321 and the frame 111 and 113 .
- the alloy layer may include at least one of AgSn, CuSn, and AuSn.
- the frames 111 and 113 have a multi-layer structure having a base layer and a plating layer on the surface of the base layer, the alloy layer may be formed between the conductive portion 321 and at least one layer of the frames 111 and 113 .
- the alloy layer may be formed by bonding between the materials constituting the conductive portion 321 and the metal layers of the frames 111 and 113 .
- the intermetallic compound layer may be formed of at least one of AgSn, AuSn, CuSn, or AgSn.
- the intermetallic compound layer may have a higher melting point than other bonding materials.
- the heat treatment process in which the metallic compound layer is formed may be performed at a lower temperature than the melting point of a common bonding material. Therefore, when the light emitting device package is bonded to the main substrate through a reflow process, re-melting does not occur, so that the electrical connection and physical bonding force are not deteriorated.
- the package body may be prevented from being damaged or discolored because the package body is not exposed to high temperatures in the process of manufacturing the light emitting device package, and the selection range for the material constituting the body 115 may be widened.
- the molding portion 190 may be disposed on the light emitting device 120 and the first and second frames 111 and 113 .
- the molding portion 190 may be disposed in the cavity 102 .
- the molding portion 190 may include an insulating material, or may include a wavelength conversion means therein.
- the molding portion 190 may include at least one of phosphors or quantum dots.
- the light emitting device 120 may emit light of blue, green, red, white, infrared, or ultraviolet light.
- the phosphor or the quantum dot may emit blue, green, and red light.
- the molding portion 190 may not be formed.
- the distance between the side of the light emitting device 120 and the reflective wall 134 of the cavity 102 is arranged narrowly, a separate reflective resin may not be formed to the region between the light emitting device 120 and the side of the cavity 102 .
- the exposed areas of the frames 111 and 113 may be reduced, thermal deformation caused by the frames may be reduced, and crack generation of the conductive portion 321 may be suppressed.
- FIGS. 7 and 8 are other examples of the light emitting device package according to the first embodiment.
- the through hole TH 1 may be disposed in the body 115 disposed between the first and second frames 111 and 113 .
- the through hole TH 1 may have the same depth as the thickness of the body 115 or may penetrate from the upper surface to the lower surface of the body 115 .
- the lower surface area of the through hole TH 1 may be equal to or larger than the upper surface area.
- the lower width b 4 in the first direction from the through hole TH 1 may be equal to or greater than the upper width.
- the lower width b 4 is 250 ⁇ m or more, for example, it may be in the range of 250 to 350 ⁇ m, and when it is larger than the above range, the rigidity of the body 115 may be reduced and when it is smaller than the above range, the first resin 160 may decrease an injecting efficiency.
- the lower width in the second direction from the through hole TH 1 may be equal to or greater than the upper width.
- the upper width in the first direction from the through hole TH 1 may be smaller than the distance between the first frame 111 and the second frame 113 .
- the upper width in the second direction from the through hole TH 1 may be equal to or less than the width of the first and second protrusions 11 and 31 .
- the through hole TH 1 and the first and second protrusions 11 and 31 may overlap each other in the first direction.
- the through hole TH 1 may overlap the light emitting device 120 in a vertical direction.
- the first resin 160 is disposed in the through hole TH 1 , and may be adhered between the body 115 and the light emitting device 120 .
- the first resin 160 is cured after being injected through the through hole TH 1 and the light emitting device 120 may be attached to the body 115 .
- the space for dispensing the resin through the cavity 102 may be removed, and the light emitting device 120 and The interval b 1 between the side surfaces of the cavity 102 may be further narrowed.
- FIGS. 9 and 10 are other examples of the light emitting device package according to the first embodiment.
- the light emitting device package may include one or a plurality of recesses on the bottom or body 115 of the cavity 102 .
- the first and second recesses R 1 and R 2 may be spaced apart from the upper portion of the body 115 in the second direction, and may be concave in a direction of the lower surface from the upper surface of the body 115 . At least part or all of the first and second recesses R 1 and R 2 may overlap the light emitting device 120 in a vertical direction.
- the first resin 160 may be disposed and supported in the first and second recesses R 1 and R 2 .
- the depths of the first and second recesses R 1 and R 2 may be smaller than the thicknesses of the first and second frames 111 and 113 , and may be 300 ⁇ m or less, for example, in a range of 15 to 300 ⁇ m, and when it is small, the resin holding force may be lowered, and when it is larger than the above range, the rigidity of the body 115 may be lowered or light leakage through the body 115 may be caused.
- the first and second recesses R 1 and R 2 may include an inner portion kl overlapping the light emitting device 120 in a vertical direction, and an outer portion k 2 protruding outward from a side surface of the light emitting device 120 .
- the side surfaces of the light emitting device 120 overlapping the first and second recesses R 1 and R 2 may be both sides or long sides in the second direction.
- the inner portion kl of each of the recesses R 1 and R 2 may be disposed or spaced between the first and second protrusions 11 and 31 .
- the outer portions k 2 of the recesses R 1 and R 2 may not overlap the first and second protrusions 11 and 31 in the first direction.
- the first recess R 1 may be disposed between the first and third reflective portions C 11 and C 13
- the second recess R 2 may be disposed between the second and fourth reflective portions C 12 and C 14 .
- Each of the recesses R 1 and R 2 may have a length ratio of the inner portion kl and the outer portion k 2 in a range of 4:6 to 6:4. Since the second resin 160 is disposed in the recesses R 1 and R 2 , the second resin 160 extends on the outer portion k 2 , thereby reducing light loss.
- the body 115 is provided with a recess having a length in the range of 40% to 120% of the length of the light emitting device 120 in the second direction, so as to relieve heat distortion in the first direction and to suppress the crack of the conductive portion.
- each recess R 1 , R 2 is spaced apart from the reflective wall 134 of the cavity 102 , so that the first resin 160 extends to the surface of the reflective wall 134 may be suppressed.
- the width of the recesses R 1 and R 2 in the first direction may be smaller than the interval between the first and second protrusions 11 and 31 .
- the lengths of the recesses R 1 and R 2 in the second direction may be smaller than the lengths of the second direction of the light emitting device 120 , thereby enhancing adhesion to the first resin at the bottom of the light emitting device 120 .
- the length of the second direction of the recesses R 1 and R 2 may be greater than the width of the first direction of the recesses R 1 and R 2 .
- Each of the recesses R 1 and R 2 may have a top view shape, a polygonal shape, for example, a triangular shape, a square shape, or a pentagonal shape.
- each of the recesses R 1 and R 2 may have a circular shape or an elliptical shape, and may be provided in a shape capable of guiding the first resin 160 .
- Each of the recesses R 1 and R 2 may have a side cross-sectional shape of a polygonal shape or a curved shape, for example, a triangular shape or a square shape or a hemispherical shape.
- each of the recesses R 1 and R 2 may be provided in a structure in which the supporting force is not reduced while reducing the influence on the body 115 .
- the recesses R 1 and R 2 have an upper width disposed wider than a lower width, so that the inside may be provided with an inclined surface.
- a through hole may be disposed in the body between the first and second recesses R 1 and R 2 .
- the first and second recesses R 1 and R 2 , the first resin 160 disposed between the body 115 and the light emitting device 120 fix the light emitting device 120 and may improve reflection efficiency.
- FIGS. 11 to 13 are views of a first modification example of the light emitting device package according to the first embodiment.
- the first modification example may be selectively applied while referring to the configuration and description of the first embodiment disclosed above.
- the body 115 may include a support portion 115 A protruding from the upper surfaces of the frames 111 and 113 .
- the support portion 115 A is disposed on the bottom of the cavity 102 and may protrude in the direction of the light emitting device 120 from the upper surfaces of the frames 111 and 113 .
- the support portion 115 A may protrude above the upper surfaces of the first and second protrusions 11 and 31 .
- the support portion 115 A may protrude higher the body 115 and the first to fourth reflective portions C 11 , C 12 , C 13 , and C 14 than the upper surfaces of the frames 111 and 113 .
- the support portion 115 A may function as a dam around the first and second protrusions 11 and 31 .
- the first and second protrusions 11 and 31 may be connected to the reflective wall 134 and function as a dam for the conductive portions on the first and second protrusions 11 and 31 .
- the conductive portions 321 disposed on the first and second protrusions 11 and 31 may be provided in a uniform distribution with a predetermined thickness or more by the support portion 115 A. That is, by arranging a resin wall around the conductive portion 321 using the support portion 115 A of the body 115 , it is possible to secure a uniform thickness of the conductive portion and prevent cracking, so that electricity reliability of the light emitting device may improve.
- the upper surface area of the support portion 115 A may be larger than the upper surface area of the first and second protrusions 11 and 31 exposed to the bottom of the cavity 102 .
- the support portion 115 A may separate the lower surface (excluding the bonding portion) of the light emitting device 120 from the upper surfaces of the first and second frames 111 and 113 or the first and second protrusions 11 and 31 .
- the support portion 115 A may be disposed in regions that do not overlap with the first and second bonding portions 121 and 122 of the light emitting device 120 in the vertical direction.
- diffusion of the conductive portion provided in the liquid phase during the bonding process is suppressed, the thickness of the conductive portion may be secured, and crack generation may be suppressed.
- the recesses R 1 and R 2 may be disposed on the support portion 115 A of the body 115 .
- the depth of the recesses R 1 and R 2 disposed on the support portion 115 A may be 300 ⁇ m or less, for example, in the range of 15 to 300 ⁇ m, when it is small than the above range, a supporting force of the resin may be deteriorated, when it is greater than the above range, the rigidity of the body 115 may be deteriorated and the improvement of the supporting force may be insignificant and may cause light leakage through the body 115 .
- the light emitting device package may include a concave portion R 1 b in a corner region of the cavity 102 .
- the concave portion R 1 b is disposed on a relatively large area in a space between the light emitting device 120 and the inner surface 132 of the cavity 102 , or may be a recessed shape outward from a corner portion of the cavity 102 .
- the concave portion R 1 b may be arranged in one or a plurality, and the concave portion R 1 b may be disposed in regions corresponding to each of the corner portions of the light emitting device 120 .
- the concave portion R 1 b may provide a space in which a structure for dispensing the second resin 162 may be easily inserted.
- the diameter of the concave portion R 1 b is provided in the range of 300 to 400 ⁇ m, and it is possible to enable the insertion of the structure.
- the second resin 162 may include a filler such as TiO 2 , SiO 2 , or Al 2 O 3 in a transparent resin.
- the process of accelerating the precipitation phenomenon for the fillers added to the second resin 162 is performed, the fillers added to the second resin 162 may precipitate in the bottom direction.
- the process of accelerating the precipitation phenomenon may include a process of accelerating by using a centrifugal separator.
- the second resin 162 may be connected to the first resin 160 .
- the second resin 162 may be disposed around the first resin 160 .
- the second resin 162 may be disposed around the bonding portions 121 and 122 of the light emitting device 120 to prevent diffusion of the conductive portion and thus function as a dam of the conductive portion.
- the support portion 115 B of the body 115 is disposed between the first protrusion 11 of the first frame 111 and the second protrusion 31 of the second frame 113 .
- One or a plurality of recesses R 1 and R 2 may be disposed in the support portion 115 B.
- the support portion 115 B has a long length in the second direction and may overlap the light emitting device 120 in the vertical direction.
- the length of the support portion 115 B may have a length longer than the length of the second direction of the light emitting device 120 .
- the width in the first direction of the support portion 115 B may be equal to or smaller than the interval between the first and second protrusions 11 and 31 .
- the support portion 115 B may protrude in the direction of the light emitting device 120 than the upper surfaces of the first and second frames 111 and 113 or the upper surfaces of the first and second protrusions 11 and 31 .
- the support portion 115 B may be disposed between the first and second bonding portions 121 and 122 of the light emitting device 120 .
- the support portion 115 B may support a lower surface disposed between the first and second bonding portions 121 and 122 .
- the thickness of the support portion 115 B may be formed in a range of 40 ⁇ m or less, for example, in a range of 30 to 40 ⁇ m, from the upper surfaces of the first and second frames 111 and 113 .
- the support portion 115 B may function as a dam of the conductive portion 321 between the first and second protrusions 11 and 31 .
- a first resin 160 is adhered between the support portion 115 B and the light emitting device 120 to prevent the light emitting device 120 from being tilted or flowed.
- the body 115 may include spacers P 1 , P 2 , P 3 , and P 4 .
- the spacers P 1 , P 2 , P 3 , and P 4 may separate the light emitting device 120 from the upper surfaces of the frames 111 and 113 .
- the plurality of spacers P 1 , P 2 , P 3 , and P 4 may separate the first and second bonding portions 121 and 122 of the light emitting device 120 from the upper surfaces of the first and second frames 111 and 113 .
- the upper surfaces of the spacers P 1 , P 2 , P 3 , and P 4 may protrude higher than the lower surfaces of the first and second bonding portions 121 and 122 .
- the spacers P 1 , P 2 , P 3 , and P 4 may be disposed on an edge of the lower surface of the light emitting device 120 or may overlap the edge of the lower surface of the light emitting device 1200 in the vertical direction.
- the spacers P 1 , P 2 , P 3 , and P 4 may be the same material as the body 115 .
- the spacers P 1 , P 2 , P 3 , and P 4 are other examples of the material constituting the frame 111 and 113 or the same material as the frame 111 and 113 .
- the number of spacers P 1 , P 2 , P 3 , and P 4 may be 3 or more, or 4 or more.
- the spacers P 1 , P 2 , P 3 , and P 4 may provide an interval between the light emitting device 120 and the upper surfaces of the frames 111 and 113 , and may prevent the light emitting device 120 from being tilted in the manufacturing process.
- the spacers P 1 , P 2 , P 3 , and P 4 include the first and second protrusions 11 and 31 , the thickness of the conductive portion 321 may be prevented from falling, and the light emitting device 120 is spaced apart from the upper surface of the frame to provide a space to facilitate the under-fill process.
- the spacers P 1 , P 2 , P 3 , and P 4 include first and second spacers P 1 and P 2 disposed on both sides of the first protrusion 11 of the first frame 111 in the second direction, and third and fourth spacers P 3 and P 4 disposed on both sides of the second protrusion 31 of the second frame 113 in the second direction.
- the first and second spacers P 1 and P 2 extend in the first lateral direction on the first and second reflective portions C 11 and C 12 and may overlap the upper surfaces of the first frame 111 or the first protrusion 11 in the vertical direction.
- An area of the first and second spacers P 1 and P 2 that overlaps the first and second reflecting parts C 11 and C 12 has greater than an area overlapping the first frame 111 or the first protrusion 11 , thereby reinforcing the support force.
- the third and fourth spacers P 3 and P 4 extend in the second side direction on the third reflective portion C 13 and may be overlapped with the upper surface of the second frame 113 or the second protrusion 31 in the vertical direction.
- An area of the third and fourth spacers P 3 and P 4 that overlaps the third and fourth reflecting parts C 13 and C 14 has greater than the area overlapping the second frame 113 or the second protrusion 31 , thereby reinforcing the support force.
- the interval between the first and second spacers P 1 and P 2 and the interval between the third and fourth spacers P 3 and P 4 are equal to or smaller than the lengths of the first and second protrusions 11 and 31 in the second direction, and may be support the lower surface of the light emitting device 120 .
- the interval between the first and third spacers P 1 and P 3 and the interval between the second and fourth spacers P 2 and P 4 may be smaller than the length in the first direction of the light emitting device 120 , and may be supported the lower surface of light emitting device 120 .
- the first to fourth spacers P 1 , P 2 , P 3 , and P 4 may be disposed under each corner of the light emitting device 120 and correspond to corners of the first and second bonding portions 121 and 122 .
- the spacers P 1 , P 2 , P 3 , and P 4 are formed of the same material as the body 115 , may be suppressed the spreadability of the conductive portion 321 , and may be spaced the light emitting device 120 from the upper surfaces of first and second frame 111 and 113 in a predetermined distance.
- the thickness of the spacers P 1 , P 2 , P 3 , and P 4 is a vertical distance from the upper surfaces of the first and second frames 111 and 113 , and may be 35 ⁇ m or more, for example, in a range of 35 to 65 ⁇ m or 40 to 50 ⁇ m.
- the thickness of the pacers P 1 , P 2 , P 3 , and P 4 is smaller than the above range, it is difficult to secure the thickness of the conductive portion 321 , so that cracks are generated in the conductive portion 321 , or electrical or thermal conductivity characteristics are deteriorated.
- it is larger than the above range the dispensing amount of the conductive portion 321 is increased, which may cause a problem of penetration into other regions.
- the spacers P 1 , P 2 , P 3 , and P 4 may have the same thickness.
- Each of the spacers P 1 , P 2 , P 3 , and P 4 may include a circular shape, a polygonal shape, an elliptical shape, or a polygonal shape with rounded corners.
- the first to fourth spacers P 1 , P 2 , P 3 , and P 4 may be connected to the reflective wall 134 of the inner surface 132 of the cavity 102 .
- the first to fourth spacers P 1 , P 2 , P 3 , and P 4 may protrude above the bottom of the cavity 102 .
- the first to fourth spacers P 1 , P 2 , P 3 , and P 4 may be disposed higher than the upper surface of the body 115 or the lower surfaces of the first and second bonding portions 121 and 122 .
- the area of the polygon connecting the inner surfaces of the plurality of spacers P 1 , P 2 , P 3 , and P 4 in the first direction and the second direction to each other is smaller than the area of the lower surface of the light emitting device, or may be greater than a sum of the areas of bonding portions of the light emitting device.
- the area of the polygonal line connecting the straight lines passing in the first direction and the second direction with respect to the outer lines of the plurality of spacers P 1 , P 2 , P 3 , and P 4 may be larger than the lower surface area of the light emitting device.
- the first and third spacers P 1 and P 3 may be disposed on both sides based on the support portion 115 B.
- the second and fourth spacers P 2 and P 4 may be disposed on both sides based on the support portion 115 B.
- the support portion 115 B may be disposed between the first and second bonding portions 121 and 122 of the light emitting device 120 .
- the thickness of the first to fourth spacers P 1 , P 2 , P 3 , and P 4 may be provided thicker than the thickness of the support portion 115 B.
- the thickness of the support portion 115 B may be disposed lower than 10 ⁇ m, for example, in a range of 10 to 20 ⁇ m, based on the thickness of the spacers P 1 , P 2 , P 3 , and P 4 . Accordingly, the first resin 160 may be adhered with a predetermined thickness between the upper surface of the support portion 115 B and the lower surface of the light emitting device 120 .
- FIGS. 17 to 19 are views showing third and fourth modified examples of the light emitting device package.
- the first frame 111 may have a plurality of first protrusions 11 A and 11 B, and the second frame 113 may have a plurality of second protrusions 31 A and 31 B.
- the first frame 111 may have third and fourth protrusions, and the second frame 113 may have fifth and sixth protrusions.
- the first frame 111 may have a concave groove C 10 between the protrusions, and the second frame 113 may have a concave groove C 30 between the protrusions.
- First and second light emitting devices 120 A and 120 B may be disposed on the plurality of first protrusions 11 A and 11 B and the plurality of second protrusions 31 A and 31 B.
- a reflective portion of the body 115 may be disposed between the plurality of first protrusions 11 A and 11 B and the plurality of second protrusions 31 A and 31 B.
- a plurality of recesses R 3 , R 4 , and R 5 may be disposed on the body 115 .
- the plurality of recesses R 3 , R 4 , and R 5 may include first and third recesses R 3 and R 5 disposed under the first light emitting device 120 A, and second and third recesses R 4 and R 5 disposed under the second light emitting device 120 B.
- the third recesses R 5 may be disposed under the first and second light emitting devices 120 A and 120 B, respectively.
- the first to third recesses R 3 , R 4 , and R 5 are spaced apart from each other in the second direction and may be disposed on the same straight line.
- the length of the third recess R 5 in the second direction may be longer than an interval between the first and second light emitting devices 120 A and 120 B.
- the first and third recesses R 3 and R 5 may include an inner portion that partially overlaps the first light emitting device 120 A and an outer portion that does not overlap.
- the second and third recesses R 4 and R 5 may include an inner portion overlapping a portion of the second light emitting device 120 B and an outer portion not overlapping.
- a first resin 160 see FIG.
- the first resin 160 may be attached the plurality of light emitting devices 120 A and 120 B to the body 115 , and may be disposed on the first to third recesses R 3 , R 4 , and R 5 .
- the light emitting device package will refer to the configuration of the body 115 as shown in FIG. 11 .
- the body 115 may include a support region protruding from the upper surfaces of the frames 111 and 113 .
- the support region may include at least one of the support portion 115 A as shown in FIG. 11 or the support portion 115 B and spacers P 1 , P 2 , P 3 , and P 4 as shown in FIG. 15 .
- the light emitting devices 120 A and 120 B may be spaced apart from, for example, upper surfaces of the frames 111 and 113 , for example, an upper surfaces of the first protrusions 11 A and 11 B and the second protrusions 31 A and 31 B.
- the first protrusions 11 A and 11 B are disposed in plural in the first frame 111
- the second protrusions 31 A and 31 B may be disposed in plural in the second frame 113 .
- Light emitting devices 120 A and 120 B may be disposed on the plurality of first protrusions 11 A and 11 B and the plurality of second protrusions 31 A and 31 B, respectively.
- FIGS. 20 to 26 are views of a light emitting device package according to a second embodiment of the invention.
- the description of the second embodiment refers to the description and configuration of the first embodiment disclosed above, and may be selectively applied.
- the upper surface of the support portion 115 B of the body 115 may be provided as a flat surface, and may be provided at a width equal to or smaller than the bottom width Wa.
- the upper surface of the support portion 115 B may include at least one of a convex curved surface, a convex curved surface or an inclined surface.
- Each of the third and fourth side surfaces S 3 and S 4 of the body 115 or the package body 110 may include a plurality of step structures ST 5 .
- the step structure ST 5 may be a locking jaw for a finger when the package body 110 is injected.
- the step structure ST 5 may be disposed to be concave in an inner direction than the third and fourth side surfaces S 3 and S 4 .
- the first frame 111 may include a first conductive protrusion F 1 and the second frame 113 may include a second conductive protrusion F 2 .
- the first and second conductive protrusions F 1 and F 2 may be spaced apart from the bottom of the cavity 102 in a first direction, located under a region of the light emitting device 120 and may overlapped with the light emitting device 120 in the vertical direction.
- the first conductive protrusion F 1 may be formed of the first frame 111 and may protrude in a direction of the light emitting device 120 higher than the upper surface of the first frame 111 .
- the second conductive protrusion F 2 may be formed of the second frame 113 and may protrude in the direction of the light emitting device 120 higher than the upper surface of the second frame 113 .
- the first and second conductive protrusions F 1 and F 2 may protrude in the vertical direction Z on the upper and lower surfaces of the first and second frames 111 and 113 .
- the first frame 111 includes a first concave portion F 10 under the first conductive protrusion F 1
- the second frame 113 may include a second concave portion F 20 under the second conductive protrusion F 2 .
- the first and second concave portions F 10 and F 20 may overlap the first and second conductive protrusions F 1 and F 2 in the vertical direction.
- the first and second recesses F 10 and F 20 are concave in a direction from the lower surface of each frame 111 and 113 toward the upper surface, and may be formed in a cup shape or a recess structure.
- the heights Pb of the first and second conductive protrusions F 1 and F 2 may be equal to the depth e of the first and second concave portions F 10 and F 20 .
- the height Pb may be in the range of 50 ⁇ m or less, for example, 25 to 50 ⁇ m, based on the flat upper surfaces of the first and/or second frames 111 and 113 , and when it is smaller than the range, a thickness of the second resin 162 may be thinner, thereby reducing the light reflection efficiency, and when it is larger than the above range, the size of the conductive protrusions F 1 and F 2 may be increased.
- the height Pa of the support portion 115 B may be referred to as a first height
- the height Pb of the conductive protrusions F 1 and F 2 may be referred to as a second height
- the first height may be different from the second height.
- the first height may be greater than the second height.
- the upper surfaces of the first and second conductive protrusions F 1 and F 2 have a length W 7 (W 7 >W 1 ) in the second direction Y greater than a width W 1 in the first direction X.
- the first direction may be a direction in which an imaginary line connecting the centers of the first and second conductive protrusions F 1 and F 2 extends.
- the first and second conductive protrusions F 1 and F 2 face the first and second bonding portions 121 and 122 of the light emitting device 120 and may overlap in the vertical direction.
- the vertical direction may be a direction from the upper surface of the first and second frames 111 and 113 toward the lower surface or toward the light emitting device.
- the support portion 115 B of the body 115 is disposed between the first and second conductive protrusions F 1 and F 2 , and may have a length longer than the length of the first and second conductive protrusions F 1 and F 2 in the second direction.
- the thickness Pa of the support portion 115 B may be disposed greater than the thickness Pb of the first and second conductive protrusions F 1 and F 2 based on the upper surfaces of the first and second frames 111 and 113 .
- the thickness Pa of the support portion 115 B may be formed in a range of 50 ⁇ m or more, for example, 50 to 80 ⁇ m, from the upper surfaces of the first and second frames 111 and 113 , and when the thickness Pa is smaller than the range, the difference of heights between the conductive protrusions F 1 and F 2 and the support portion 115 B is small, so it is difficult to secure the thickness of the conductive portions 127 and 129 , and when it is larger than the above range, the light emitting device 120 may be tilted.
- the upper surface of the support portion 115 B may be disposed higher than the lower surfaces of the first and second bonding portions 121 and 122 of the light emitting device 120 .
- the first and second bonding portions 121 and 122 of the light emitting device 120 may be spaced apart from the upper surfaces of the first and second conductive protrusions F 1 and F 2 .
- the height difference Pc-Pb between the support portion 115 B and the conductive protrusions F 1 and F 2 may be 20 ⁇ m or more, for example, in a range of 20 to 50 ⁇ m.
- the height difference Pc-Pb between the support portion 115 B and the conductive protrusions F 1 and F 2 may be equal to the thickness of the conductive portions 127 and 129 .
- the upper surfaces of the first and second frames 111 and 113 may be disposed on the same plane with each other.
- Upper surfaces of the first and second conductive protrusions F 1 and F 2 have first and second flat surfaces, and widths of the first and second flat surfaces may be different the widths of the first and second bonding portions 121 and 122 .
- the widths of the flat lower surfaces of the first and second bonding portions 12 and 122 may be larger than the widths of the first and second flat surfaces.
- an interval between each bonding portion 121 and 122 of the light emitting device 120 and each of the conductive protrusions F 1 and F 2 may secure the thickness of the conductive portion disposed between the bonding portions 121 and 122 and the conductive protrusions F 1 and F 2 above a certain thickness. Accordingly, it is possible to prevent a cracking problem due to the uneven thickness of the conductive portions 127 and 129 and a decrease in electrical and thermal conductivity.
- the conductive portions 127 and 129 have increased spreadability and have a thinner thickness or a non-uniform distribution, and the electrical conduction characteristics and heat conduction characteristics on a space between the bonding portions 121 and 122 and the conductive protrusions F 1 and F 2 may be reduced.
- the conductive portions 127 and 129 may include a first conductive portion 127 between the first bonding portion 121 and the first conductive protrusion F 1 , and a second conductive portion 129 between the second bonding portion 122 and the second conductive protrusion F 2 .
- the first conductive portion 127 may be disposed and bonded between the first conductive protrusion F 1 of the first frame 111 and the first bonding portion 121 of the light emitting device 120 .
- the second conductive portion 129 may be disposed and bonded between the second conductive protrusion F 2 of the second frame 113 and the second bonding portion 122 of the light emitting device 120 .
- the first and second conductive portions 127 and 129 may be connected between the first frame 111 and the first bonding portion 121 and between the second frame 113 and the second bonding portion 122 .
- a portion of the first and second conductive portions 127 and 129 may be disposed around the first and second conductive protrusions F 1 and F 2 .
- the conductive portions 127 and 129 will be referred to the description of the conductive portion material, the intermetallic compound layer, and the alloy layer disclosed in the first embodiment.
- the height Pb of the conductive protrusions F 1 and F 2 in each frame 111 and 112 may be smaller than the thickness T 1 of the frames 111 and 112 .
- the height Pb may be 10% or more, for example, in a range of 10% to 50% of the thickness T 1 , and when it is smaller than the above range, the conductive portion extends to the side surface of the light emitting device 120 , thereby occurring in short problems or light loss, and when it exceeds the above range, the rigidity of the frames 111 and 112 may be reduced.
- the thicknesses T 1 of the frames 111 and 112 may be 100 ⁇ m or more, for example, in a range of 100 to 300 ⁇ m, or 200 to 270 ⁇ m.
- the height Pb of the conductive protrusions F 1 and F 2 When the height Pb of the conductive protrusions F 1 and F 2 is smaller than the above range, the thickness of the second resin 162 becomes thinner than 50 micrometers, and there is a problem that it cannot function as a reflective resin. Accordingly, the height Pb of the conductive protrusions F 1 and F 2 may secure the thickness of the second resin 162 , thereby preventing a decrease in light reflection efficiency.
- the outer surfaces F 11 and F 12 of the first and second conductive protrusions F 1 and F 2 may be inclined surfaces or surfaces having curved surfaces.
- the entire area of the upper surface of each of the first and second conductive protrusions F 1 and F 2 may be equal to or smaller than the lower surface areas of the first and second bonding portions 121 and 122 .
- the area of the upper surface of the first and second conductive protrusions F 1 and F 2 may be larger than the sum of the areas of the outer surfaces F 11 and F 12 , thereby
- the width W 1 in the upper regions of the first and second conductive protrusions F 1 and F 2 in the first direction X may be less than or equal to the width W 2 of the first and second bonding portions 121 .
- the width W 2 of the first and second bonding portions 121 and 122 is 20% or more compared to the width of the first direction of the light emitting device 120 and may be, for example, in a range of 20% to 40%.
- the width W 1 may be 50% or more, for example, in a range of 50% to 90% of the width W 2 of the bonding portions 121 and 122 , and thermal conductivity and electrical conductivity may be improved in the range. As shown in FIG.
- the length W 7 of the upper regions of the first and second conductive protrusions F 1 and F 2 in the second direction Y may be smaller than the length W 3 of the first and second bonding portions 121 and 122 .
- the length W 3 of the first and second bonding portions 121 and 122 may be 70% or more, for example, in a range of 70% to 95%, compared to the length of the first light emitting device 120 in the second direction.
- the width W 1 may be 200 ⁇ m or more, for example, in a range of 200 to 300 ⁇ m.
- a supporting force e.g., DST: die shear test strength
- the distance W 5 from the edge of the upper region of the first and second conductive protrusions F 1 and F 2 to the ends of the first and second bonding portions 121 and 122 may be provided in a range of 40 ⁇ m to 60 ⁇ m, thereby improving process or reliability by the conductive portion.
- the distance W 6 between the first and second bonding portions 121 and 122 and the side surface of the light emitting device 120 may be disposed in a range of 60 ⁇ m or more, for example, 60 to 90 ⁇ m.
- the distance W 6 is not secured, it is difficult to secure the distance from the conductive portions 127 and 129 , and a problem due to the conductive paste may occur. That is, when the distance W 5 +W 6 between the flat surfaces of the first and second bonding portions 121 and 122 and the side surface of the light emitting device 120 may be spaced in a range of at least 100 ⁇ m, a safe distance by the conductive portions 127 and 129 around the conductive protrusions F 1 and F 2 may be secured.
- the width W 1 and the length W 7 of the upper regions of the first and second conductive protrusions F 1 and F 2 may be smaller than the width and length of the lower region. Accordingly, it is possible to prevent a problem that a strength of a portion protruding from the frame decreases or a thickness of an inclined side portion becomes thin.
- the first and second conductive protrusions F 1 and F 2 may have a polygonal shape, an elliptical shape, or a circular shape. Side cross-sectional shapes of the first and second conductive protrusions F 1 and F 2 may be polygonal, hemispherical, or semi-elliptical.
- the side surfaces F 11 and F 12 may have slopes having different slopes, or may be arranged as curved surfaces having different curvatures.
- the distance between the first conductive protrusion F 1 and the second conductive protrusion F 2 on the lower surface regions of the first frame 111 and the second frame 112 may be provided in 100 ⁇ m or more, for example, in a range of 100 to 150 ⁇ m, thereby preventing the occurrence of an electrical short on the main substrate.
- the distance W 4 between the edges of the conductive protrusions F 1 and F 2 and the body 113 may be 120 ⁇ m or more, for example, in the range of 120 to 300 ⁇ m, or in the range of 200 to 270 ⁇ m.
- the ratio (W 4 :T 1 ) of the distance W 4 and the thickness T 1 of the frames 111 and 112 may be in the range of 0.8:1 to 1:0.8, for example, the distance W 4 and the thickness T 1 may be a ratio of 1:1.
- the width W 1 of the upper region of the conductive protrusions F 1 and F 2 or the distance W 4 between the conductive protrusions F 1 and F 2 and the body based on the thickness T 1 of the frames 111 and 112 may be in a range of 80% to 120%.
- W 1 :W 4 :T 1 may include 1:1:1.
- the frames 111 and 112 may be prevented from curled or wound problem by the conductive protrusions F 1 and F 2 , and the flat areas of the bonding portions 121 and 122 and the conductive protrusions F 1 and F 2 may be provided in a range in which thermal conductivity and electrical conductivity are not deteriorated.
- a conductive protrusion may be provided on the upper portions of the frames 111 and 112 by a mold without a separate half etching process.
- a distance Pr from the bottom of the support portion 115 B of the body 115 to the recesses R 1 and R 2 may be spaced in a range of 15 ⁇ m or more, for example, in a range of 15 to 40 ⁇ m. Due to the separation distance Pr, the rigidity of the support portion 115 B may be prevented from being reduced in the region where the recesses R 1 and R 2 are formed in the support portion 115 B.
- the support portion 115 B may be connected to the reflective wall 134 of the cavity 102 , thereby preventing external rigidity from deteriorating. That is, the length of the upper surface in the second direction of the support portion 115 B may be greater than the length of the second direction of the bottom of the cavity 102 .
- the first and second recesses R 1 and R 2 and the first resin 160 disposed on the body 115 or the support portion 115 B will be referred to the description of the embodiment disclosed above.
- the first resin 160 may be disposed between the first conductive protrusion F 1 and the second conductive protrusion F 2 .
- the first resin 160 contacts the side surface of the first bonding portion 121 and the side surface of the second bonding portion 122 and may correspond to or contact with an inside of the first conductive protrusion F 1 and the second conductive protrusion F 2 .
- the thickness of the first resin 160 may be greater than the height Pb or thickness of the conductive protrusions F 1 and F 2 , thereby being in contact with the light emitting device 120 .
- the second resin 162 may be formed by a process disposing the light emitting device 120 and then dispensing it.
- the second resin 162 may contact a region between the first and second frames 111 and 113 and a lower portion of the light emitting device 120 , side surfaces of the first bonding portion 121 and the second bonding portion 122 , and the lower surface of the light emitting device 120 .
- the thickness of the second resin 162 may be greater than the height Pb or thickness of the conductive protrusions F 1 and F 2 , thereby being in contact with the light emitting device 120 .
- the second resin 162 may surround or contact the outside of the conductive protrusions F 1 and F 2 .
- the first resin 160 and the second resin 162 may contact the outside of the conductive portions 127 and 129 disposed on the side surfaces F 11 and F 12 of the conductive protrusions F 1 and F 2 . Accordingly, even if the conductive portions 127 and 129 are re-melted, the second resin 162 may prevent the material of the conductive portions 127 and 129 from flowing to other regions.
- the second resin 162 may ride on the reflective wall 134 of the cavity 102 and may be disposed higher than the upper surface of the other region.
- FIG. 27 is another example of FIG. 21 , and the same parts as those described above will be referred to the above description.
- a support portion 115 B of the body, a plurality of conductive protrusions F 1 and F 2 and a plurality of spacers Ps 1 may be disposed on the bottom of the cavity 102 .
- the spacer Ps 1 may separate the light emitting device 120 from the upper surfaces of the frames 111 and 113 .
- the plurality of spacers Ps 1 will refer to the configuration of the spacer disclosed in FIG. 15 .
- the spacer Ps 1 may be disposed at the same height as the support portion 115 B, or may be disposed at a lower height, and space the outer portion of the light emitting device 120 from the upper surfaces of the frames 111 and 113 .
- the spacer Ps 1 is disposed outside the first and second conductive protrusions F 1 and F 2 to block pressure from the light emitting device 120 to prevent diffusion of the liquid conductive portion.
- FIGS. 29 to 31 show examples of other packages in FIGS. 21 . 29 to 31 , a reflective wall 134 and a sub-reflective wall 136 adjacent to the light emitting device 120 are disposed on a lower portion of the inner surface 132 of the cavity 102 , and the reflective wall 134 and the sub-reflective wall 136 may reduce the process of disposing the second resin and improve the light reflection efficiency by a body material. That is, since the sub-reflective wall 136 having the same reflective resin material as the body extends to a region adjacent to the light emitting device 120 and covers the lower periphery of the light emitting device 120 , the light loss may reduce on the lower periphery of the light emitting device 120 . Referring to FIG.
- the reflective wall 134 has a flat upper surface, and when the phosphor 191 added in the molding portion 190 precipitates, the phosphor 191 is accumulated on the flat upper surface and some phosphors 191 may be positioned as a peripheral region 103 of the light emitting device 120 . In this case, since the inclination angle of the inner surface 132 of the cavity 102 may be inclined at a greater angle than the structure without the reflective wall 134 , the phosphor 191 may be moved to the peripheral region 103 .
- the reflective wall 134 may have the phosphor 191 distributed on a surface thereof.
- the sub-reflective wall 136 may have a flat upper surface and the phosphor 191 may be distributed on a surface thereof.
- the phosphors 191 disposed on the surfaces of the reflective walls 134 and the sub-reflective walls 136 are distributed in a larger amount in the peripheral region 103 of the light emitting device 120 , thereby surrounding the light emitting device 120 .
- the wavelength conversion efficiency in the region 103 may be improved. This is because the light emitting device 120 disposed in the form of a flip chip has an active layer positioned in a region adjacent to the frames 111 and 113 , so that light of a predetermined amount or more is emitted in the lateral direction through the active layer. These side lights rarely travel through the surface of the frame and may be emitted by reflection by a resin or wavelength conversion by a phosphor.
- the height Ta of the upper surface of the reflective wall 134 is disposed to a half point of the side height of the light emitting device 120 or a point between the upper and lower surfaces of the substrate 124 , thereby facing to the light emitting structure 123 of the light emitting device 120 . Accordingly, the phosphors 191 disposed on the reflective wall 134 may increase the wavelength conversion efficiency by light emitted from the side surface of the light emitting device 120 .
- the height Ta of the upper surface of the reflective wall 134 may be 200 ⁇ m or less, for example, in a range of 120 to 200 ⁇ m, and when it is larger than the above range, wavelength conversion efficiency may be reduced and when it is smaller than the range, when it is smaller than the above range, an inclination angle of the side surface 132 may be reduced, thereby reducing the function of guiding the phosphor 191 to the peripheral region 103 .
- the upper surface area or upper surface width of the reflective wall 134 may be greater than the upper surface area or upper surface width of the sub-reflective wall 136 .
- the upper surface height Tb of the sub-reflective wall 136 may be smaller than the upper surface height Ta of the reflective wall 134 .
- the sub-reflective wall 136 may be disposed closer to the light emitting device 120 than the reflective wall 134 and may be disposed at a lower height. Accordingly, the sub-reflective wall 136 extends in the direction of the first and second conductive protrusions F 1 and F 2 lower than the lower surface (excluding the bonding portion) of the light emitting device 120 , and thus the exposed area of the frames 111 and 113 may be reduced.
- the reflective wall 134 may have an interval Ga of 300 ⁇ m or less, for example, in a range of 150 to 300 ⁇ m, from a side surface of the light emitting device 120 .
- the sub-reflective wall 136 may have an interval Gb from a side surface of the light emitting device 120 of 80 ⁇ m or more, for example, in a range of 80 to 120 ⁇ m.
- the difference between the intervals Ga and Gb may be arranged in a range of 70 ⁇ m or more, for example, 70 to 120 ⁇ m. This is because the sub-reflective wall 136 has a width of 70 to 120 ⁇ m and extends from the reflective wall 134 in the direction of the first and second conductive protrusions F 1 and F 2 , the exposed area of the upper surfaces of the frames 111 and 113 may be reduced, and the decrease in the light flux due to the discoloration of the frames 111 and 113 may prevent.
- the intervals Ga and Gb are examples of distances based on the first direction, and an interval of the second direction may be equal to or smaller than the distance in the first direction.
- the height Tb of the sub-reflective wall 136 may be arranged in a range of 70 ⁇ m or less, for example, 30 to 70 ⁇ m, and when it is smaller than the above range, the shape of the sub-reflective wall 136 is not maintained and is difficult to form. When it is larger than the above range, the phosphor induction ratio may be lowered without a difference in height from the reflective wall 134 , and light reflection efficiency may be lowered.
- the height of the upper surface of the sub-reflective wall 136 may be lower than that of the light emitting device 120 .
- the height Tb of the sub-reflective wall 136 may be disposed to be equal to or higher than the thickness Pb of the first and second conductive protrusions F 1 and F 2 disclosed in the embodiment of the present invention. This provides the height Tb of the sub-reflective wall 136 to a predetermined thickness or more, thereby improving light reflection efficiency and preventing deterioration of adhesion to the frames 111 and 113 .
- the inner surfaces of the first and sub-reflective walls 134 and 136 may include an inclined surface or a curved surface.
- the support portions 115 B of the body 115 may be provided with recesses R 3 , R 4 and R 5 .
- the plurality of conductive protrusions F 1 a , F 2 a , F 1 b , and F 2 b protruding from the respective frames 111 and 113 may correspond to the bonding portions 121 and 122 of the light emitting devices 120 A and 120 B, respectively.
- the plurality of recesses R 3 , R 4 , and R 5 may include first and third recesses R 3 and R 5 disposed under the first light emitting device 120 A, and second and third recesses R 4 and R 5 disposed under the second light emitting device 120 B.
- the first and third recesses R 3 and R 5 may include an inner portion that partially overlaps the first light emitting device 120 A and an outer portion that does not overlap.
- the second and third recesses R 4 and R 5 may include an inner portion overlapping a portion of the second light emitting device 120 B and an outer portion not overlapping.
- the third recess R 5 may be disposed between the first and second light emitting devices 120 A and 120 B and below the first and second light emitting devices 120 A and 120 B.
- Configurations of the first and second embodiments, configurations of other examples, and configurations of modified examples may be selectively applied to or merged with other examples.
- the through-holes and/or spacers of the body disclosed in the first embodiment may be selectively applied to other examples.
- One or a plurality of light emitting device packages according to an embodiment may be disposed on a circuit board and applied to a light source device.
- the light source device may include a display device, a lighting device, a head lamp, etc. according to the industrial field.
Abstract
Description
Claims (20)
Applications Claiming Priority (5)
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KR1020170179453A KR102471686B1 (en) | 2017-12-26 | 2017-12-26 | Light emitting device package and light source unit |
KR10-2017-0179453 | 2017-12-26 | ||
KR1020170180819A KR102471691B1 (en) | 2017-12-27 | 2017-12-27 | Light emitting device package and light unit |
KR10-2017-0180819 | 2017-12-27 | ||
PCT/KR2018/016165 WO2019132386A1 (en) | 2017-12-26 | 2018-12-18 | Light-emitting element package and light source device |
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US20210066552A1 US20210066552A1 (en) | 2021-03-04 |
US11417804B2 true US11417804B2 (en) | 2022-08-16 |
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CN110875408A (en) * | 2018-08-30 | 2020-03-10 | 深圳市聚飞光电股份有限公司 | High-strength LED support, LED and light-emitting device |
JP6916450B2 (en) * | 2019-04-01 | 2021-08-11 | 日亜化学工業株式会社 | Light emitting device and its manufacturing method |
DE102020118693A1 (en) | 2020-07-15 | 2022-01-20 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | COMPONENT AND METHOD FOR MAKING A COMPONENT |
JP7389363B2 (en) * | 2021-05-26 | 2023-11-30 | 日亜化学工業株式会社 | light emitting device |
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