KR102535234B1 - Light emitting device package and light unit - Google Patents

Abstract

A light emitting device package disclosed in an embodiment of the present invention includes a first frame and a second frame spaced apart from each other; a body disposed between the first frame and the second frame; a light emitting element having a first bonding part facing the first frame and a second bonding part facing the second frame; a plurality of spacers disposed below the light emitting element and separating the light emitting element from upper surfaces of the first and second frames; a first resin disposed between the body and the light emitting element; and a second resin disposed around a lower circumference of the light emitting element, wherein the second resin may contact upper surfaces of the plurality of spacers and lower surfaces of side surfaces of the light emitting element.

Description

Light emitting device package and light source device {LIGHT EMITTING DEVICE PACKAGE AND LIGHT UNIT}

The embodiment relates to a light emitting device package, a semiconductor device package, a method for manufacturing a semiconductor device package, and a light source device.

Semiconductor devices including compounds such as GaN and AlGaN have many advantages, such as having a wide and easily adjustable band gap energy, and can be used in various ways such as light emitting devices, light receiving devices, and various diodes.

In particular, light emitting devices such as light emitting diodes or laser diodes using group 3-5 or group 2-6 compound semiconductor materials are developed in thin film growth technology and device materials to produce red, green, It has the advantage of being able to implement light in various wavelength bands such as blue and ultraviolet. In addition, a light emitting device such as a light emitting diode or a laser diode using a group 3-5 or group 2-6 compound semiconductor material can implement a white light source with high efficiency by using a fluorescent material or combining colors. These light emitting devices have advantages of low power consumption, semi-permanent lifespan, fast response speed, safety, and environmental friendliness compared to conventional light sources such as fluorescent lamps and incandescent lamps.

In addition, when light receiving devices such as photodetectors or solar cells are manufactured using Group 3-5 or Group 2-6 compound semiconductor materials, photocurrent is generated by absorbing light in various wavelength ranges through the development of device materials. By doing so, it is possible to use light in a wide range of wavelengths from gamma rays to radio wavelengths. In addition, such a light-receiving element has advantages of fast response speed, safety, environmental friendliness, and easy control of element materials, so that it can be easily used in power control or ultra-high frequency circuits or communication modules.

Accordingly, the semiconductor device can replace a transmission module of an optical communication means, a light emitting diode backlight that replaces a Cold Cathode Fluorescence Lamp (CCFL) constituting a backlight of an LCD (Liquid Crystal Display) display device, and can replace a fluorescent lamp or an incandescent bulb. Applications are expanding to white light emitting diode lighting devices, automobile headlights and traffic lights, and sensors that detect gas or fire. In addition, applications of semiconductor devices can be expanded to high-frequency application circuits, other power control devices, and communication modules.

The light emitting device (Light Emitting Device) may be provided as, for example, a p-n junction diode having a characteristic of converting electrical energy into light energy using a group 3-5 element or a group 2-6 element on the periodic table, and a compound semiconductor Various wavelengths can be implemented by adjusting the composition ratio.

For example, nitride semiconductors are of great interest in the field of developing optical devices and high-power electronic devices due to their high thermal stability and wide bandgap energy. In particular, blue light emitting devices, green light emitting devices, ultraviolet (UV) light emitting devices, red light emitting devices, and the like using nitride semiconductors are commercialized and widely used.

For example, in the case of an ultraviolet light emitting device, as a light emitting diode that generates light distributed in a wavelength range of 200 nm to 400 nm, in the wavelength range, in the case of a short wavelength, it is used for sterilization and purification, and in the case of a long wavelength, an exposure machine or a curing machine, etc. can be used

Ultraviolet light can be divided into three types in order of wavelength: UV-A (315nm ~ 400nm), UV-B (280nm ~ 315nm), and UV-C (200nm ~ 280nm). UV-A (315nm ~ 400nm) area is applied to various fields such as industrial UV curing, printing ink curing, exposure machine, counterfeit money discrimination, photocatalytic sterilization, special lighting (aquarium/agricultural use, etc.), and UV-B (280nm ~ 315nm) ) area is used for medical purposes, and the UV-C (200nm~280nm) area is applied to air purification, water purification, and sterilization products.

Meanwhile, as semiconductor devices capable of providing high output are requested, research on semiconductor devices capable of increasing output by applying high power is being conducted.

In addition, in a semiconductor device package, research is being conducted on a method capable of improving light extraction efficiency of the semiconductor device and improving light intensity at the package end. In addition, in a semiconductor device package, research into a method for improving a bonding force between a package electrode and a semiconductor device is being conducted.

In addition, in semiconductor device packages, research is being conducted on ways to reduce manufacturing cost and improve manufacturing yield through process efficiency improvement and structural change.

An embodiment of the present invention provides a light emitting device package in which a spacer is disposed between the light emitting device and the frame, a light emitting device package, a semiconductor device package, and a manufacturing method thereof.

Embodiments of the present invention provide a light emitting device package, a light emitting device package, a semiconductor device package, and a manufacturing method including a spacer for separating a light emitting device from an upper surface of a body.

Embodiments of the present invention provide a light emitting device package, a light emitting device package, a semiconductor device package, and a method for manufacturing the same, which can separate the light emitting device from the top surface of the frame and the top surface of the body by means of a plurality of spacers.

An embodiment of the present invention provides a light emitting device package, a light emitting device package, a semiconductor device package, and a method for manufacturing the same, which can attach the light emitting device to the body or frame by disposing a resin between the light emitting device and the frame or body. .

An embodiment of the invention is a light emitting device package, a light emitting device package, and a semiconductor device capable of strengthening the fixing power of the light emitting device and improving light reflectance by disposing a reflective or white material between the light emitting device and the frame or body. A package and a manufacturing method thereof are provided.

An embodiment of the present invention provides a light emitting device package capable of supporting the lower side of the light emitting device by disposing a resin attached to a body or frame on the lower side of the light emitting device, a light emitting device package, a semiconductor device package, and a manufacturing method thereof. do.

An embodiment of the present invention is a light emitting device package, a light emitting device package, a semiconductor device package including a diffusion guide portion for arranging a conductive portion between a bonding portion and a frame of a light emitting device and guiding diffusion of the conductive portion between a plurality of spacers, and manufacturing the same. provides a way

Embodiments of the present invention provide a light emitting device package having a recess on the upper part of the body between frames, a light emitting device package, a semiconductor device package, and a manufacturing method thereof.

An embodiment of the present invention provides a light emitting device package in which a resin is disposed in a recess, a light emitting device package, a semiconductor device package, and a manufacturing method thereof.

An embodiment of the present invention provides a light emitting device package, a semiconductor device package, and a manufacturing method thereof capable of preventing movement of the light emitting device and cracking of the conductive portion by using spacers around the lower portion of the light emitting device.

The embodiment may provide a semiconductor device package, a light emitting device package, a semiconductor device package manufacturing method, and a light source device capable of reducing manufacturing cost and improving manufacturing yield by improving package process efficiency and presenting a new package structure.

The embodiment manufactures a semiconductor device package, a light emitting device package, and a semiconductor device package capable of preventing re-melting from occurring in a bonding area of a semiconductor device package in the process of re-bonding the semiconductor device package to a substrate or the like. method can be provided.

A light emitting device package according to an embodiment of the present invention includes a first frame and a second frame spaced apart from each other; a body disposed between the first frame and the second frame; a light emitting element having a first bonding part facing the first frame and a second bonding part facing the second frame; a plurality of spacers disposed below the light emitting element and separating the light emitting element from upper surfaces of the first and second frames; a first resin disposed between the body and the light emitting element; and a second resin disposed around a lower circumference of the light emitting element, wherein the second resin may contact upper surfaces of the plurality of spacers and lower surfaces of side surfaces of the light emitting element.

According to an embodiment of the present invention, the plurality of spacers include first and second spacers on the outside of the first bonding part and third and fourth spacers on the outside of the second bonding part, and the light emitting elements face each other. Further comprising a first side and a second side for viewing, a third side and a fourth side facing each other and orthogonal to the first and second sides, wherein the first and second spacers are below the first side of the light emitting device. The third and fourth spacers are disposed under the second side of the light emitting element, the first and third spacers are disposed under the third side of the light emitting element, and the second and fourth spacers are disposed under the third side of the light emitting element. may be disposed under the fourth side of the light emitting device.

According to an embodiment of the invention, the second resin includes a first contact end disposed at a corner between different side surfaces of the light emitting element and a second contact end in contact with the center of each side surface of the light emitting element, The height of the first contact end may be higher than that of the second contact end.

According to an embodiment of the present invention, the length of the third side and the fourth side of the light emitting element is greater than the length between the first and second sides, and the light emitting element is disposed in the center of the third and fourth side. The height of the upper ends of the two resins may be lower than the height of the upper ends of the second resin disposed at the center of the first and second side surfaces of the light emitting device.

According to an embodiment of the present invention, the body includes a first support part supporting the first spacer, a second support part supporting the second spacer, a third support part supporting the third spacer, and supporting the fourth spacer. The first frame includes a first guide portion disposed between the first and second support portions, and the second frame includes a second guide portion disposed between the third and fourth support portions. wealth may be included.

According to an embodiment of the present invention, the body includes a first support part supporting the first spacer, a second support part supporting the second spacer, a third support part supporting the third spacer, and supporting the fourth spacer. It includes a fourth support part for connecting the first and second support parts, a first connection support part for connecting the first and second support parts, and a second connection support part for connecting the third and fourth support parts to each other, wherein the first frame is the first bonding part. A first guide part extending from an outside toward the first connection support part may be included, and the second frame may include a second guide part extending from an outside of the second bonding part toward the second connection support part.

According to an embodiment of the present invention, the body includes a cavity with an open top, and the first to fourth spacers may be connected to a lower portion of an inner surface of the cavity.

According to an embodiment of the present invention, first and second conductive parts are disposed between the first and second bonding parts of the light emitting element and the first and second frames, respectively, and the first and second conductive parts are connected to the second resin. can be contacted.

According to an embodiment of the invention, the second resin may be disposed at 70% or less of the thickness of the light emitting device from the upper surface of the light emitting device.

According to an embodiment of the present invention, the body may include a plurality of recesses overlapping at least a portion of the light emitting device in a vertical direction, and the first resin may be disposed in the recesses.

A light source device according to an embodiment of the present invention includes a circuit board; And it may include one or a plurality of light emitting device packages disclosed above on the circuit board.

According to an embodiment of the invention, it is possible to improve the fixing force on the lower surface and the lower side of the light emitting device.

According to an embodiment of the present invention, it is possible to improve the reflection efficiency on the lower surface and the lower side of the light emitting device.

According to an embodiment of the present invention, light loss due to the resin on the long and short sides of the light emitting device can be reduced.

According to an embodiment of the present invention, a spacer may be disposed around the lower portion of the light emitting device to separate the light emitting device from the upper surface of the frame and the body.

According to an embodiment of the present invention, a spacer may be disposed around the lower portion of the light emitting device to increase the thickness of the conductive portion and the resin in the space between the light emitting device and the frame and the body.

According to an embodiment of the present invention, it is possible to reduce crack defects in the conductive portion between the light emitting device and the frame due to thermal deformation of the body.

According to an embodiment of the present invention, a structure capable of supporting resin may be provided by giving a recess to the upper part of the body between the frames.

According to an embodiment of the invention, there is an advantage of improving light extraction efficiency, electrical characteristics, and reliability.

According to an embodiment of the invention, it is possible to prevent the tilt of the light emitting device.

According to an embodiment of the present invention, it is possible to prevent the light emitting element from being re-melted by external heat by bonding the light emitting element with resin.

According to an embodiment of the present invention, there is an advantage of reducing manufacturing cost and improving manufacturing yield by improving process efficiency and presenting a new package structure.

According to an embodiment of the present invention, by providing a body having high reflectivity, discoloration of the reflector can be prevented, thereby improving reliability of the semiconductor device package.

According to an embodiment of the present invention, there is an advantage in preventing a re-melting phenomenon from occurring in a bonding area of a semiconductor device package in a process of re-bonding the device package to a substrate or the like.

1 is a perspective view of a light emitting device package according to a first embodiment of the present invention.
FIG. 2 is a perspective view of the light emitting device package in FIG. 1 from which the molding portion is removed.
FIG. 3 is a perspective view of the light emitting device package in FIG. 1 from which the light emitting device is removed.
4 is an AA-side cross-sectional view of the light emitting device package of FIG. 1 .
FIG. 5 is an example of a plan view illustrating a conductive part, a spacer, and a support part in the light emitting device package of FIG. 3 .
FIG. 6 is another example of FIG. 5 in which a recess is disposed on the body.
FIG. 7 is an example in which first and second resins are disposed on a body and a frame in the light emitting device package of FIG. 3 .
8 is an example of a BB-side cross-sectional view of the light emitting device package of FIG. 7 .
9 is an example of a CC-side cross-sectional view of the light emitting device package of FIG. 7 .
10 is a perspective view illustrating an example in which a spacer and a second resin are disposed around a light emitting device in a light emitting device package according to an embodiment of the present invention.
11 is a plan view illustrating a first modified example of the light emitting device package according to the first embodiment.
12 is a detailed configuration diagram of the light emitting device package of FIG. 11 .
13 is a plan view of a light emitting device package according to a second embodiment.
14 is a DD-side cross-sectional view of the light emitting device package of FIG. 13 .
15 is an example of a perspective view of a light emitting device package according to a third embodiment.
FIG. 16 is a view showing an example in which a second resin is disposed on the light emitting device package of FIG. 15 .
FIG. 17 is an example of a plan view illustrating a light emitting device of the light emitting device package of FIG. 15 and an area around the light emitting device.
18 is a EE-side cross-sectional view of the light emitting device package of FIG. 16 .
19 is another example of the light emitting device package of FIGS. 16 and 18 .
20 is another example of the light emitting device package of FIG. 17 .
FIG. 21 is an example of a light source device having the light emitting device package of FIG. 4 .
22 is an example of a light emitting device of a light emitting device package according to an embodiment of the present invention.

An embodiment of the invention will be described with reference to the accompanying drawings. In the description of an embodiment of the invention, each layer (film), region, pattern or structure is "on/over" or "under" the substrate, each layer (film), region, pad or pattern. )”, “on/over” and “under” mean “directly” or “indirectly” formed through another layer. All inclusive. In addition, the criterion for the top/top or bottom of each layer will be described based on the drawings, but the embodiment is not limited thereto.

A semiconductor device package according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. In the present invention, the device package may include a semiconductor device or a light emitting device that emits light of ultraviolet, infrared, or visible light. Hereinafter, a description will be given based on the case where a light emitting element is applied as an example of a semiconductor device, and a package or light source device to which the light emitting element is applied may include a non-light emitting element such as a zener diode or a sensing element for monitoring wavelength or heat. can Hereinafter, a case in which a light emitting device is applied as an example of a semiconductor device will be described, and a light emitting device package will be described in detail.

<First Embodiment>

1 is a perspective view of a light emitting device package according to a first embodiment of the present invention, FIG. 2 is a perspective view of a light emitting device package in FIG. 1 from which a molding portion is removed, and FIG. 4 is a cross-sectional view on the A-A side of the light emitting device package of FIG. 1, FIG. 5 is an example of a plan view showing a conductive part, a spacer, and a support part in the light emitting device package of FIG. 3, and FIG. 6 is another example of FIG. , An example in which a recess is disposed on the body, FIG. 7 is an example in which the first and second resins are disposed on the body and the frame in the light emitting device package of FIG. 3, and FIG. 8 is the B-B side of the light emitting device package of FIG. 9 is an example of a C-C side cross-sectional view of the light emitting device package of FIG. 7, and FIG. 10 is an example in which a spacer and a second resin are disposed around a light emitting device in a light emitting device package according to an embodiment of the present invention. It is a perspective view shown.

Referring to FIGS. 1 to 10 , the light emitting device package 100 may include a package body 110 and a light emitting device 120 .

As shown in FIGS. 1, 2, and 4 , the length of the light emitting device package 100 in the first direction (X) may be greater than the length in the second direction (Y). The length in the first direction may be greater than the length X2 of the package body 110 in the first direction. A length X2 of the package body 110 in the first direction (X) may be longer than or equal to the length in the second direction (Y). Here, the first direction may be a direction of a longer side of the sides of the light emitting device 120 . For example, the first direction may be a long side direction of the light emitting device 120, and the second direction may be a short side direction. Both short sides of the light emitting device 120 may be disposed on opposite sides in the first direction, and both long sides of the light emitting device 120 may be disposed on opposite sides in the second direction.

The package body 110 may include a plurality of frames. The plurality of frames may include at least two frames or three or more frames. The plurality of frames may be spaced apart in a first direction, spaced apart in a second direction, or spaced apart in first and second directions. The plurality of frames may include, for example, a first frame 111 and a second frame 113 . For convenience of explanation, the plurality of frames will be described as two frames. The first frame 111 and the second frame 113 may be spaced apart from each other in the first direction (X).

The package body 110 may include a body 115. The body 115 may be disposed between a plurality of frames. The body 115 may be combined with a plurality of frames. The body 115 may be disposed between the first frame 111 and the second frame 113 . The body 115 may function as an electrode separation line between the first and second frames 111 and 113 . The body 115 may also be referred to as an insulating member. The body 115 may include a function of supporting the respective frames 111 and 113 by being coupled to the first and/or second frames 111 and 113 .

The body 115 may be disposed on the first frame 111 . The body 115 may be disposed on the second frame 113 . The body 115 may provide an inclined surface disposed on the first frame 111 and the second frame 113 . A cavity 102 may be provided on the first frame 111 and the second frame 113 by the inclined surface of the body 115 . According to an embodiment of the invention, the package body 110 may be provided in a structure with a cavity 102, or may be provided in a structure with a flat upper surface without the cavity 102. The body 115 may include an upper body 110A having a cavity 102 . The body 115 and the upper body 110A may be formed of the same material or may be made of different materials. The upper body 110A may be integrally formed with the body 115 or may be formed separately.

For example, the body 115 may be made of a resin material or an insulating resin material. The body 115 includes polyphthalamide (PPA), polychloro tri phenyl (PCT), liquid crystal polymer (LCP), polyamide9T (PA9T), silicone, epoxy, epoxy molding compound (EMC), silicone It may be formed of at least one selected from a group including a molding compound (SMC), ceramic, photo sensitive glass (PSG), sapphire (Al ₂ O ₃ ), and the like. The body 115 may be formed of a resin material, and may include a filler made of a high refractive index material such as TiO ₂ and SiO ₂ therein. The body 115 may be formed of a thermoplastic resin, and since the thermoplastic resin is a material that softens when heated and hardens again when cooled, when the frames 111 and 113 and materials in contact therewith expand or contract due to heat The body 115 may act as a shock absorber. At this time, when the body 115 performs the buffering action, it is possible to prevent damage to conductive parts such as solder-based paste, Ag-based paste, and SAC (Sn-Ag-Cu)-based paste. In the package, a coefficient of thermal expansion (CTE) according to thermal expansion and contraction may be greater in the first direction than in the second direction. The body 115 may include a PCT or PPA material, and the PCT or PPA material has a high melting point and is a thermoplastic resin.

As shown in FIG. 4 , the upper body 110A may provide an inclined inner surface 132 around the cavity 102 . The inner surface 132 may be inclined at different angles in the first direction and in the second direction. The inner surface 132 may be inclined at a second angle θ2, and the lower side surface 134 of the cavity 102 may be inclined at a first angle θ1. The first angle θ1 may be greater than the second angle θ2. When injection molding the upper body 110A, the lower side 134 of the cavity 102 may be formed at an angle of 45 degrees or more, for example, in a range of 45 degrees to 70 degrees so that parts such as burrs do not occur. there is. The height Z2 of the lower side surface 134 of the cavity 102 is disposed in a range of 100 micrometers or more, for example, 100 to 200 micrometers, and has the second angle θ2 of the light emitting element 120. You can face the side.

The first frame 111 and the second frame 113 may be provided as conductive frames. The conductive frame may be made of a metal such as copper (Cu), titanium (Ti), nickel (Ni), gold (Au), chromium (Cr), tantalum (Ta), platinum (Pt), tin (Sn), silver ( Ag), and may be formed as a single layer or multiple layers. The thickness T2 of the first and second frames 111 and 113 may be formed in consideration of heat dissipation characteristics and electrical conductivity characteristics, and may be formed in a range of 100 micrometers or more, for example, 100 to 300 micrometers. The first frame 111 and the second frame 113 may be provided as metal frames. The first frame 111 and the second frame 113 may stably provide structural strength of the package body 110 and may be electrically connected to the light emitting device 120 .

The first extension part 17 of the first frame 111 extends in the direction of the first side surface S1 of the package body 110 and may protrude one or more. The second extension part 37 of the second frame 113 extends in the direction of the second side surface S2 of the package body 110 and may protrude one or more. The first and second extension parts 17 and 37 may be disposed in one or a plurality, and in the case of a plurality of extension parts, they may protrude from the frames 111 and 113 in a branched form. The first and second extension parts 17 and 37 may not protrude. The first and second side surfaces S1 and S2 of the package body 110 are spaced apart in a first direction and may be opposite sides. The third and fourth side surfaces S3 and S4 of the package body 110 are spaced apart in a second direction orthogonal to the first direction and may be opposite sides to each other. The first to fourth side surfaces S1, S2, S3, and S4 may be vertically or inclinedly disposed.

The first extension part 17 protrudes from the lower part of the first side surface S1 of the body 110 with a width equal to the length of the first side surface S1 or has a shorter width than the first side surface S1. may protrude. The second extension part 37 protrudes from the lower part of the second side surface S2 of the body 115 with a width equal to the length of the second side surface S2 or has a shorter width than the second side surface S2. may protrude.

The first and second extension parts 17 and 37 are provided in different shapes, so that electrode polarities of the light emitting element 120 can be distinguished.

As shown in FIG. 11, a plurality of holes h1 and h2 may be disposed in the first and second frames 111 and 113, and the body 115 may be coupled through the holes h1 and h2. Step structures ST1 and ST2 may be disposed on the first and second frames 111 and 113 to strengthen coupling with the body 115 . The holes h1 and h2 may be disposed in an area overlapping the upper body 110A, thereby strengthening the bonding force with the body and suppressing moisture permeation. A concave structure by an injection gate may be formed on a part of the bottom of the body 115 .

As shown in FIGS. 3 and 4 , the first end of the first frame 111 may face the second end of the second frame 113 . The first end of the first frame 111 may have a stepped structure and be coupled to the body 115 . The second end of the second frame 113 may have a stepped structure and be coupled to the body 115 . The upper surface area of the body 115 disposed between the first and second frames 111 and 113 may be smaller than the lower surface area. The upper surface width of the body 115 disposed between the first and second frames 111 and 113 in the first direction may be narrower than the lower surface width.

The first frame 111 may include a protrusion 17A protruding or exposed to at least one of the third and fourth side surfaces S3. The second frame 113 may include a protrusion 37A protruding or exposed to at least one of the third and fourth side surfaces S4. The protrusions 17A and 37A of the first and second frames 111 and 113 are displaced from each other on both sides S3 and S4 of the body 115 or are disposed at different positions, so that the first and second protrusions of the body 115 A decrease in rigidity in one direction can be prevented.

A portion of the body 115 adjacent to the third side surface S3 may be bent or extended in the direction of the second side surface rather than the first side surface S1. A portion of the body 115 adjacent to the fourth side surface S4 may be bent or extended in the direction of the first side surface rather than the second side surface S2.

The first frame 111 may include a first upper recess ST1 stepped from a top surface. The plurality of first upper recesses ST1 may be spaced apart from each other in the second direction or connected to each other. The first upper recess ST1 may be spaced apart from the first end of the first frame 111 in a first direction. The first upper recess ST1 may be disposed at both corners adjacent to the first side surface S1 of the body 115 at the bottom of the cavity 102 and in a peripheral area thereof.

The second frame 113 may include a second upper recess ST2 stepped from the upper surface. A plurality of the second upper recesses ST2 may be spaced apart from each other in the second direction or connected to each other. The second upper recess ST2 may be spaced apart from the second end of the second frame 113 in a first direction. The second upper recess ST2 may be disposed at both corners adjacent to the second side surface S2 of the body 115 at the bottom of the cavity 102 and in a peripheral area thereof.

3 and 4, the depths of the first and second upper recesses ST1 and ST2 are disposed within a range of 40% to 60% of the thickness T2 of the first and second frames 111 and 113. It can be. When the depths of the first and second upper recesses ST1 and ST2 are less than the above range, the supporting force of the support parts 51, 52, 53 and 54 is reduced or the rigidity of the support parts 51, 52, 53 and 54 is reduced. This may be lowered, and if it is larger than the above range, the rigidity of the frame may be lowered. Inner portions of the first and second upper recesses ST1 and ST2 may be exposed to the bottom of the cavity 102 or may overlap a portion of the lower surface of the light emitting device 120 . The outer portions of the first and second upper recesses ST1 and ST2 may overlap the inner surface 132 and the lower inner surface 134 of the cavity 102 in a vertical direction.

A plurality of support parts 51 , 52 , 53 , and 54 may be included on the first frame 111 and the second frame 1113 . The plurality of support parts 51 , 52 , 53 , and 54 may be spaced apart from each other, or at least two of them may be connected to each other. The plurality of support parts 51 , 52 , 53 , and 54 may be formed of the material of the body 115 . The plurality of supports 51, 52, 53, and 54 include the first support 51 and the second support 52 disposed on the first frame 111 and the second support 51 disposed on the second frame 113. It may include third and fourth support parts 53 and 54 . The first and second support parts 51 and 52 may be spaced apart from each other in the second direction on the first frame 111 . The first and second support parts 51 and 52 may be respectively disposed in the first upper recess ST1 of the first frame 111 . The first and second support parts 51 and 52 may be connected to or extend from the lower part 134 of the inner surface of the cavity 102 . The third and fourth support parts 53 and 54 may be spaced apart from each other in the second direction on the second frame 113 . The third and fourth support parts 53 and 54 may be respectively disposed in the second upper recess ST2 of the second frame 113 . The third and fourth support parts 53 and 54 may be connected to or extend from the lower part 134 of the inner surface of the cavity 102 .

The first and second support parts 51 and 52 may be disposed at lower portions of both corners in contact with the first side surface of the light emitting device 120 and in a peripheral area thereof. The third and fourth support parts 53 and 54 may be disposed at lower portions of both corners in contact with the second side surface of the light emitting device 120 and in a peripheral area thereof. The first and second side surfaces of the light emitting device 120 may be opposite sides.

The first to fourth support parts 51 , 52 , 53 , and 54 may overlap the light emitting device 120 in a vertical direction or a third direction at the bottom of the cavity 102 . The first to fourth support portions 51 , 52 , 53 , and 54 may reflect light traveling from the light emitting device 120 in a lateral direction or a downward direction. The first to fourth support parts 51 , 52 , 53 , and 54 are formed of the same resin material as the body 115 and are disposed in dispersed areas, so that the conductive parts 321 and 323 , which are bonding members, are formed of the same resin material as the body 115 . ,52,53,54) can be prevented. The conductive parts 321 and 323 may include conductive paste, for example, solder-based paste, Ag-based paste, or SAC (Sn-Ag-Cu)-based paste. Adhesion between the light emitting device 120 and the frames 111 and 113 between the light emitting device 120 and the frames 111 and 113 between the conductive parts 321 and 323 can be improved by preventing the support parts 51, 52, 53 and 54 from passing over a material such as conductive paste. . The first to fourth support parts 51, 52, 53, and 54 suppress the flow or spread of the conductive parts 321 and 323 during the bonding process so that they adhere to the bonding parts 121 and 122 at the lower part of the light emitting element 120. Dam ( dam) or flow prevention membrane.

As shown in FIG. 4 , first and second bonding parts 121 and 122 may be disposed below the light emitting device 120 . The first and second bonding parts 121 and 122 may be spaced apart in the same direction as the first and second frames 111 and 113, that is, in the first direction.

The first frame 111 may face or face the first bonding part 121 of the light emitting element 120, and the second frame 113 may be the second bonding part 122 of the light emitting element 120. can face or be opposed to. The first frame 111 and the first bonding part 121 are bonded by a conductive member, for example, a bonding member, and as shown in FIG. 4 , they may be bonded by conductive parts 321 and 323 that are bonding members. The first conductive part 321 may be bonded between the first frame 111 and the first bonding part 121 and electrically connect the first bonding part 121 and the first frame 111. . The second conductive part 323 may be bonded between the second frame 113 and the second bonding part 122 and electrically connect the second frame 113 and the second bonding part 122. there is. Since these conductive parts 321 and 323 are provided in liquid form during the bonding process, they spread by the pressure applied from the light emitting element 120 toward the frames 111 and 113, and due to the spreading phenomenon of the conductive parts 321 and 323, the first, The thickness of the conductive parts 321 and 323 located under the second bonding parts 121 and 122 may be thin or non-uniform. In an embodiment of the present invention, in order to reduce the spread of the conductive parts 321 and 323 in the lateral direction, a resin material is further disposed around the conductive parts 321 and 323 to suppress the spread of the conductive parts 321 and 323. there is. Therefore, the conductive parts 321 and 323 are thick and uniform in the area between the first frame 111 and the first bonding part 121 and between the second frame 113 and the second bonding part 122. It can be glued with one distribution. In an embodiment of the present invention, spacers P1, P2, P3, and P4 are further disposed in the peripheral area of the conductive parts 321 and 323 to reduce the amount of spread of the conductive parts 321 and 323 in the lateral direction, so that the light emitting element 120 may be further spaced apart from the upper surfaces of the frames 111 and 113. Accordingly, the spacers P1, P2, P3, and P4 include a function of stopping the position where the light emitting element 120 is applied in the direction of the frames 111 and 113, thereby reducing the spreading amount of the conductive parts 321 and 323. can Therefore, the conductive parts 321 and 323 are thick and uniform in the area between the first frame 111 and the first bonding part 121 and between the second frame 113 and the second bonding part 122. It can be glued with one distribution.

As shown in FIGS. 2 to 4 , the light emitting device package 100 may include spacers P1 , P2 , P3 , and P4 . The spacers P1 , P2 , P3 , and P4 may separate the light emitting device 120 from the upper surfaces of the frames 111 and 113 . The spacers P1 , P2 , P3 , and P4 may be arranged on the edge of the lower surface of the light emitting device 120 or may overlap with the edge of the lower surface of the light emitting device 120 in a vertical direction. The spacers P1 , P2 , P3 , and P4 may include a material constituting the body 115 or may be made of the same material as the body 115 . As another example, the spacers P1 , P2 , P3 , and P4 may be formed of a material constituting the frames 111 and 113 or the same material as the frames 111 and 113 . The number of spacers P1 , P2 , P3 , and P4 may be 3 or more or 4 or more. The spacers P1, P2, P3, and P4 provide a gap between the light emitting device 120 and the upper surfaces of the frames 111 and 113, so that the bonding parts 121 and 122 of the light emitting device 120 and the frame ( 111 and 113), it is possible to prevent the light emitting element 120 from being tilted by the liquid conductive parts 321 and 323 disposed between the upper surfaces.

The spacers P1 , P2 , P3 , and P4 are disposed at each corner of the light emitting device 120 to reduce spread of the conductive parts 321 and 323 due to pressure applied from the light emitting device 120 . The conductive parts 321 and 323 are disposed in the space between the light emitting element 120 and the frames 1111 and 113 by the spacers P1, P2, P3, and P4, so that the thickness of the conductive parts 321 and 323 can be secured. there is. Accordingly, by increasing the thickness of the conductive parts 321 and 323 disposed below the light emitting element 120, it is possible to prevent cracks in the conductive parts 321 and 323, thereby preventing electrical reliability degradation. In addition, the diffusion path of the conductive parts 321 and 323 can be limited by the body 115 serving as a dam and the support parts 51, 52, 53, and 54, so that the diffusion of the conductive parts 321 and 323 can alleviate the problem. The spacers P1 , P2 , P3 , and P4 separate the light emitting device 120 from the upper surface of the frame to provide a space to facilitate an undo filling process.

The spacers P1, P2, P3, and P4 include first and second spacers P1 and P2 disposed on the first frame 111 and third and third spacers disposed on the second frame 113. 4 spacers P3 and P4 may be included.

The first spacer P1 may be disposed on the first support part 51 . The first spacer P1 may protrude from the upper surface of the first support part 51 . A part of the first spacer P1 may be disposed to overlap between the first support part 51 and the first corner of the light emitting element 120 .

The second spacer P1 may be disposed on the second support part 52 . The second spacer P2 may protrude from the upper surface of the second support part 52 . A part of the second spacer P2 may be disposed to overlap between the second support part 52 and the second corner of the light emitting element 120 .

The third spacer P3 may be disposed on the third support part 53 . The third spacer P3 may protrude from the upper surface of the third support part 53 . A part of the third spacer P3 may be disposed to overlap between the third support part 53 and the third corner of the light emitting element 120 .

The fourth spacer P4 may be disposed on the fourth support part 54 . The fourth spacer P4 may protrude from the upper surface of the fourth support part 54 . A portion of the fourth spacer P4 may be disposed to overlap between the fourth support part 54 and the fourth corner of the light emitting element 120 .

The first to fourth spacers P1 , P2 , P3 , and P4 may be arranged to overlap each corner of the light emitting device 120 in a vertical direction. The first and second spacers P1 and P2 may be disposed to correspond to the outside of each corner of the first bonding portion 121 of the light emitting device 120 . The third and fourth spacers P3 and P4 may be disposed to correspond to the outside of each corner of the second bonding portion 122 of the light emitting device 120 .

The first to fourth spacers P1 , P2 , P3 , and P4 may be selectively formed from among circular, elliptical, polygonal, atypical shapes, and curved and straight lines in a top view shape. Top view shapes of the first to fourth spacers P1 , P2 , P3 , and P4 may be identical to each other, or at least one may have a different shape.

Each of the first to fourth spacers P1 , P2 , P3 , and P4 may have the same upper and lower surface areas. As another example, each of the first to fourth spacers P1 , P2 , P3 , and P4 may have an upper surface area smaller than a lower surface area. Each of the first to fourth spacers (P1, P2, P3, P4) may be disposed in a range of 80% to 99% of the area of the upper surface of the lower surface, and when smaller than the above range, the light emitting element 120 It is difficult to align on (P1, P2, P3, P4) and if it is larger than the above range, burrs after injection may be generated.

Referring to FIGS. 5, 8, and 9, the area of the region connecting the outlines of the first to fourth spacers P1, P2, P3, and P4 may be smaller than the area of the upper surface of the light emitting device 120. there is. The distance b1 between the first and second spacers P1 and P2 or the distance b1 between the third and fourth spacers P3 and P4 may be smaller than the length Y1 of the light emitting element 120 in the second direction. can The distance b2 between the first and third spacers P1 and P3 or the distance b2 between the second and fourth spacers P2 and P4 is smaller than the length X1 of the light emitting element 120 in the first direction. can

Inner regions of the first to fourth support parts 51 , 52 , 53 , and 54 may extend further toward the light emitting device 120 than the respective spacers P1 , P2 , P3 , and P4 . An inner region of the first support part 51 may extend toward the first bonding part 121 of the light emitting device 120 than the first spacer P1 . An inner region of the second support part 52 may extend toward the first bonding part 121 of the light emitting device 120 than the second spacer P2 . An inner region of the third support part 53 may extend toward the second bonding part 122 of the light emitting device 120 than the third spacer P3 . An inner region of the fourth support part 54 may extend toward the second bonding part 122 of the light emitting device 120 than the fourth spacer P4 . The inner regions of the first to fourth support parts 51, 52, 53, and 54 extend toward the bonding parts 121 and 122 than the spacers P1, P2, P3, and P4, so that the bonding parts 121 and 122 ) and the conductive parts 321 and 323 that are bonded to each other can be prevented from spreading toward the support parts 51 , 52 , 53 , and 54 .

Referring to FIG. 5 , at least one or both of the first and second support parts 51 and 52 may have concave portions Ra and Rb disposed therein. The concave portions Ra and Rb may provide a space outside the corner of the first bonding portion 121 of the light emitting device 120 . The concave portions Ra and Rb may have a predetermined curvature or be provided in a curved shape to cover peripheries of both corners of the first bonding portion 121 . The concave portions Ra and Rb are boundary portions between the first frame 111 and the first and second support portions 51 and 52, and the conductive portion 321 bonded to the first bonding portion 121 is Diffusion in the direction of the concave portions Ra and Rb can be suppressed.

At least one or both of the third and fourth support portions 53 and 54 may have concave portions Rc and Rd disposed therein. The concave portions Rc and Rd may provide a space outside the corner of the second bonding portion 122 of the light emitting device 120 . The concave portions Rc and Rd may have a predetermined curvature or be provided in a curved shape to cover peripheries of both corners of the second bonding portion 121 . The concave portions Rc and Rd are boundary portions between the second frame 113 and the third and fourth support portions 53 and 54, and the conductive portion 323 bonded to the second bonding portion 122 is Diffusion in the direction of the concave portions Rc and Rd can be suppressed.

The first concave portion Ra may be concavely disposed in the direction of the first spacer P1 between the first bonding portion 121 and the first spacer P1. The second concave portion Rb may be concavely disposed in the direction of the second spacer P2 between the first bonding portion 121 and the second spacer P2. The third concave portion Rc may be concavely disposed in the direction of the third spacer P3 between the second bonding portion 122 and the third spacer P3. The fourth concave portion Rd may be concavely disposed in the direction of the fourth spacer P4 between the second bonding portion 122 and the fourth spacer P4 .

As shown in FIG. 5 , the distance k2 between the first and second support parts 51 and 52 corresponding to the first bonding part 121 is the width k1 of the first bonding part 121 in the second direction. ) can be greater than The distance k2 between the first and second support parts 51 and 52 may range from 120% to 160% based on the width k1 of the first bonding part 121 . Accordingly, both corner portions of the first bonding portion 121 can be easily disposed in an area between the first and second support portions 51 and 52 .

A distance k2 between the third and fourth support parts 53 and 54 corresponding to the second bonding part 122 may be greater than a width k1 of the second bonding part 122 in the second direction. . The distance k2 between the third and fourth support parts 53 and 54 may range from 120% to 160% based on the width k1 of the second bonding part 122 . Accordingly, both corner portions of the second bonding portion 121 can be easily disposed in an area between the third and fourth support portions 53 and 54 .

The first frame 111 may include a first guide part 11 between the first support part 51 and the second support part 52 . The first guide part 11 may serve as a path through which the first conductive part 321 disposed between the first bonding part 121 and the first frame 111 diffuses. The width b5 of the first guide part 11 in the second direction may be smaller than the width k1 of the first bonding part 121 in the second direction. For example, the first and second spacers P1, It may be equal to or smaller than the top width of P2). The first guide part 11 may provide a flow path for the first conductive part 321 . The first guide part 11 extends from the area between the first and second support parts 51 and 52 to the lower part 134 of the inner side surface of the cavity, so that the second frame ( 113) may be guided in the opposite first direction.

The first frame 111 may include second and third guide parts 12 and 13 protruding in the second direction. The second guide part 12 may be disposed between the first support part 51 and the body 115 . The third guide part 13 may be disposed between the second support part 52 and the body 115 . The second and third guide parts 12 and 13 may extend in opposite second directions based on the area where the first bonding part 121 is disposed. The second and third guide parts 12 and 13 may provide a path through which the first conductive part 321 flows in the second direction when bonded.

The second frame 113 may include fourth to sixth guide parts 31 , 32 , and 33 . The fourth guide part 31 is disposed between the third and fourth support parts 53 and 54 and may guide the flow of the second conductive part 323 in a direction opposite to the first frame 111 . The fifth guide part 32 may be disposed between the third support part 53 and the body 115 . The sixth guide part 33 may be disposed between the fourth support part 54 and the body 115 . The fifth and sixth guide parts 32 and 33 may extend in opposite second directions based on the area where the second bonding part 122 is disposed. The fifth and sixth guide parts 32 and 33 may provide a path through which the second conductive part 323 flows in the second direction when bonded. The structures and functions of the fourth to sixth guide parts 31 , 32 , and 33 will be described with reference to the descriptions of the first to third guide parts 11 , 12 , and 13 .

Here, in the body 115 disposed between the first and second frames 111 and 113, a portion extending in the direction of the third side surface S3 is obliquely extended in the direction of the fourth side surface, and the fourth side surface S4 The portion extending in the direction may obliquely extend in the direction of the third side surface. This allows the first end of the first frame 111 and the second end of the second frame 113 to partially overlap in the second direction, thereby preventing a decrease in body rigidity.

The support portions 51 , 52 , 53 , and 54 are disposed at corner regions of the light emitting element 120 among the regions of the first and second frames 111 and 113 , and conduction diffuses laterally from the lower part of the light emitting element 120 . Diffusion paths of the parts 321 and 323 may be provided. Accordingly, even if the amount of the conductive parts 321 and 323 overflows, it is possible to prevent a problem of deteriorating electrical reliability by extending in opposite frame directions, and contacting the side surface of the light emitting element 120 to prevent interlayer electricity within the element. potential short circuit problems can be avoided. In addition, since the support portions 51, 52, 53, and 54 are made of the same material as the body 115, the spreadability of the conductive portions 321 and 323 may be suppressed.

The spacers P1 , P2 , P3 , and P4 may space the light emitting device 120 a predetermined distance from the upper surfaces of the first and second frames 111 and 113 . The first to fourth spacers P1, P2, P3, and P4 may be disposed higher than upper surfaces of the first and second frames 111 and 113. The thickness b3 of the first to fourth spacers P1, P2, P3, and P4 is a vertical distance from the upper surfaces of the first and second frames 111 and 113, and is 30 micrometers or more, for example, 30 to 65 micrometers. It may be in the range of micrometers or in the range of 40 to 50 micrometers. When the thickness b3 of the first to fourth spacers P1, P2, P3, and P4 is smaller than the above range, it is difficult to secure the thickness of the conductive parts 321 and 323, causing cracks to occur in the conductive parts 321 and 323 or conducting electricity. Characteristics or thermal conduction characteristics may be deteriorated, and if the range is greater than the above range, the coating amount of the conductive parts 321 and 323 may be increased and penetration into other areas may occur. The first to fourth spacers P1, P2, P3, and P4 may have the same thickness b3 as each other. The first to fourth spacers P1 , P2 , P3 , and P4 may be spaced apart from the lower portion 134 of the inner surface 132 of the cavity 102 .

The width b4 of the top surface of the first to fourth spacers P1 , P2 , P3 , and P4 ( FIG. 4 ) may be 150 micrometers or more in the second direction, for example, 150 to 300 micrometers. When the widths of the first to fourth spacers P1, P2, P3, and P4 in the second direction are disposed within the above range, they partially overlap the lower portion of the light emitting device 120 and face the light emitting device 120. can The first to fourth spacers P1 , P2 , P3 , and P4 may have the same or different widths in the first and second directions.

The first to fourth spacers P1 , P2 , P3 , and P4 may protrude from the bottom of the cavity 102 above the bottom of the cavity 102 . The first to fourth spacers P1 , P2 , P3 , and P4 may protrude upward from the upper surface of the body 115 . Upper surfaces of the spacers P1 , P2 , P3 , and P4 may be disposed higher than lower surfaces of the first and second bonding parts 121 and 122 . A thickness b4 of the spacers P1 , P2 , P3 , and P4 may be thicker than that of the first and second bonding parts 121 and 122 .

According to an embodiment of the present invention, the area of a region in which straight lines passing through the inner surfaces of the plurality of spacers P1, P2, P3, and P4 in the first and second directions are connected to each other is smaller than the area of the lower surface of the light emitting device 120. can In an embodiment of the present invention, the area of a region in which straight lines passing through the inner surfaces of the plurality of spacers P1 , P2 , P3 , and P4 in the first and second directions are connected to each other is the bonding portion 121 and 122 of the light emitting element 120 . ) can be greater than the sum of their areas. According to an embodiment of the present invention, an area of a polygon obtained by connecting straight lines passing through outer surfaces of the plurality of spacers P1 , P2 , P3 , and P4 in the first and second directions may be greater than the area of the lower surface of the light emitting device.

As another example, the first frame 111 and the second frame 113 may be provided as insulating frames. The first frame 111 and the second frame 113 may stably provide structural strength of the package body 110 . When the frames 111 and 113 are made of an insulating material, they may be made of a resin material or an insulating material, for example, polyphthalamide (PPA), polychloro tri phenyl (PCT), liquid crystal polymer (LCP), polyamide9T (PA9T), It may be formed of at least one selected from a group including silicon, epoxy molding compound (EMC), silicon molding compound (SMC), ceramic, photo sensitive glass (PSG), sapphire (Al ₂ O ₃ ), and the like.

According to an embodiment of the invention, the light emitting device 120 may include a first bonding portion 121 , a second bonding portion 122 , and a light emitting structure 123 . The light emitting device 120 may include a substrate 124 . The length of the light emitting device 120 in the first direction may be equal to or longer than the length in the second direction.

The light emitting structure 123 may include a first conductivity type semiconductor layer, a second conductivity type semiconductor layer, and an active layer disposed between the first conductivity type semiconductor layer and the second conductivity type semiconductor layer. The first bonding part 121 may be electrically connected to the first conductivity type semiconductor layer. Also, the second bonding part 122 may be electrically connected to the second conductivity type semiconductor layer.

The substrate 124 is a light-transmitting layer and may be formed of an insulating material or a semiconductor material. The substrate 124 may be selected from a group including, for example, a sapphire substrate (Al ₂ O ₃ ), SiC, GaAs, GaN, ZnO, Si, GaP, InP, and Ge. For example, a concave-convex pattern may be formed on the surface of the substrate 124 .

According to an embodiment of the invention, the light emitting structure 123 may be provided as a compound semiconductor. For example, the light emitting structure 123 may be provided as a Group 2-6 or Group 3-5 compound semiconductor. For example, the light emitting structure 123 includes at least two or more elements selected from aluminum (Al), gallium (Ga), indium (In), phosphorus (P), arsenic (As), and nitrogen (N). It can be.

The light emitting structure 123 may include a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer. The first and second conductivity-type semiconductor layers may be implemented with at least one of group 3-5 or group 2-6 compound semiconductors. The first and second conductivity-type semiconductor layers are, for example, In _x Al _y Ga _{1 -x- y} N (0=x≤=1, 0≤=y≤=1, 0≤=x+y≤=1) It can be formed of a semiconductor material having a composition formula. For example, the first and second conductivity type semiconductor layers may include at least one selected from a group including GaN, AlN, AlGaN, InGaN, InN, InAlGaN, AlInN, AlGaAs, GaP, GaAs, GaAsP, AlGaInP, and the like. . The first conductivity-type semiconductor layer may be an n-type semiconductor layer doped with an n-type dopant such as Si, Ge, Sn, Se, or Te. The second conductivity-type semiconductor layer may be a p-type semiconductor layer doped with a p-type dopant such as Mg, Zn, Ca, Sr, or Ba.

The active layer may be implemented as a compound semiconductor. For example, the active layer may be implemented with at least one of Group 3-5 or Group 2-6 compound semiconductors. When the active layer is implemented as a multi-well structure, the active layer may include a plurality of well layers and a plurality of barrier layers alternately disposed, In _x Al _y Ga _{1 -x- y} N (0≤x≤1 , 0≤y≤1, 0≤x+y≤1) may be arranged as a semiconductor material having a composition formula. For example, the active layer is selected from a group including InGaN/GaN, GaN/AlGaN, AlGaN/AlGaN, InGaN/AlGaN, InGaN/InGaN, AlGaAs/GaAs, InGaAs/GaAs, InGaP/GaP, AlInGaP/InGaP, and InP/GaAs. may contain at least one.

The light emitting device 120 may be disposed on the package body 110 . The light emitting device 120 may be disposed on the first frame 111 and the second frame 113 . The light emitting device 120 may be disposed on the body 115 . The light emitting device 120 may be disposed within the cavity 102 provided by the package body 110 . The cavity 102 may be formed by the upper body 110A of the package body 110 . The upper body 110A may be disposed around the light emitting device 120 . The light emitting device 120 may be disposed within the cavity 102 . A first frame 111 , a second frame 113 , and a body 115 may be disposed on the bottom of the cavity 102 .

The cavity 102 has a sub-cavity 133A formed on the inner surface adjacent to the third or fourth side of the inner surface, and a part of the first and second frames 111 and 113 at the bottom of the sub-cavity 133A. may be exposed. A first frame 111 and a second frame 113 are exposed in the sub-cavity 113A, and a protection element 125 is disposed on one of the exposed frames and is electrically connected to the other frame through a wire 126. can be connected A reflective resin 135 is disposed in the sub-cavity 133A, and the reflective resin 135 seals the protection element 125 and the wire 126 . The reflective resin 135 is formed of a resin material such as silicon or epoxy, and may include a high refractive filler therein.

The first bonding part 121 and the second bonding part 122 are based on the body 115 where the first and second recesses R1 and R2 are disposed on the lower surface of the light emitting device 120. They may be arranged spaced apart from each other. The first bonding part 121 may be disposed on the first frame 111 . The second bonding part 122 may be disposed on the second frame 113 .

In the light emitting device package 100 according to an embodiment of the present invention, power is connected to the first bonding part 121 of the light emitting device 120 through the first frame 111, and the second frame 113 Power may be connected to the second bonding portion 122 of the light emitting element 120 through the power supply. The first and second bonding parts 121 and 122 may be electrodes or pads. Accordingly, the light emitting element 120 can be driven by driving power supplied through the first bonding part 121 and the second bonding part 122 . In addition, light emitted from the light emitting device 120 may be provided in an upper direction of the package body 110 .

The first bonding part 121 may be disposed between the light emitting structure 123 and the first frame 111 . The second bonding part 122 may be disposed between the light emitting structure 123 and the second frame 113 . The first bonding part 121 and the second bonding part 122 may be made of a metal material. The first and second bonding parts 121 and 122 are Ti, Al, In, Ir, Ta, Pd, Co, Cr, Mg, Zn, Ni, Si, Ge, Ag, Ag alloy, Au, Hf, Pt, Ru, Rh, ZnO, IrOx, RuOx, NiO, RuOx/ITO, Ni/IrOx/Au, and Ni/IrOx/Au/ITO may be formed using one or more materials or alloys selected from the group consisting of a single layer or multiple layers.

The light emitting device 120 may include one or a plurality of light emitting cells therein. The light emitting cell may include at least one of an n-p junction, a p-n junction, an n-p-n junction, and a p-n-p junction. The plurality of light emitting cells may be connected in series to each other within one light emitting device. Accordingly, the light emitting device may have one or a plurality of light emitting cells, and when n light emitting cells are disposed in one light emitting device, it may be driven with n times the driving voltage. For example, when the driving voltage of one light emitting cell is 3V and two light emitting cells are disposed in one light emitting device, each light emitting device can be driven with a driving voltage of 6V. Alternatively, when the driving voltage of one light emitting cell is 3V and three light emitting cells are disposed in one light emitting device, each light emitting device may be driven with a driving voltage of 9V. The number of light emitting cells disposed in the light emitting device may be 1 or 2 to 5.

As shown in FIG. 4 , the light emitting device package 100 of the present invention may include a first resin 160 between the body 115 and the light emitting device 120 . The first resin 160 may include an adhesive material or/and a reflective material. The first resin 160 may be disposed between the body 115 and the light emitting element 120 . The first resin 160 may be disposed between the upper surface of the body 115 and the lower surface of the light emitting element 120 . The first resin 160 may overlap the light emitting device 120 in a Z-axis direction, which is a vertical direction. For example, the first resin 160 may include at least one of an epoxy-based material, a silicone-based material, and a hybrid material including an epoxy-based material and a silicone-based material. can Also, as an example, when the first resin 160 includes a reflective function, the adhesive may include white silicone.

The first resin 160 may be adhered to the light emitting element 120 and the body 115 . The first resin 160 may be disposed between the first bonding part 121 and the second bonding part 122 of the light emitting device 120 or may come into contact with the first and second bonding parts 121 and 122 . . The first resin 160 may be adhered to a region between the lower surface of the light emitting device 120 and the frames 111 and 113 and a region between the light emitting device 120 and the body 115 . Accordingly, the first resin 160 may reinforce the lower adhesive force and supporting force of the light emitting element 120 . In the process of bonding the bonding parts 121 and 122 of the light emitting element 120 or when bonding on a circuit board, a problem in which the light emitting element 120 is tilted by the conductive parts 321 and 323 can be prevented. The first resin 160 may be formed of a reflective resin material to diffuse light and improve reflection efficiency.

The first resin 160 may provide a stable fixing force between the light emitting device 120 and the package body 110 . The first resin 160 may provide a stable fixing force between the light emitting device 120 and the body 115 .

The first resin 160 can provide a stable fixing force between the body 115 and the light emitting element 120, and when light is emitted from the lower surface of the light emitting element 120, the light emitting element 120 A light diffusing function may be provided between the and the body 115 . When light is emitted from the light emitting device 120 to the lower surface of the light emitting device 120, the first resin 160 provides a light diffusing function, thereby improving light extraction efficiency of the light emitting device package 100. there is. In addition, the first resin 160 may reflect light emitted from the light emitting device 120 . When the first resin 160 has a reflective function, the first resin 160 may include a filler such as TiO ₂ , SiO ₂ , or Al ₂ O ₃ therein.

Each of the frames 111 and 113 and each of the bonding parts 121 and 122 may be coupled by an intermetallic compound layer. The intermetallic compound may include at least one of Cu _x Sn _y , Ag _x Sn _y , and Au _x Sn _y , wherein x satisfies the conditions of 0<x<1, y=1-x, x>y can

The intermetallic compound layer may include a material constituting the conductive parts 321 and 323 . The conductive parts 321 and 323 disposed on the first and second frames 111 and 113 may be disposed in direct contact with lower surfaces of the first and second bonding parts 121 and 122, and may be disposed in direct contact with the first and second bonding parts. (121, 122) can be electrically connected.

The conductive parts 321 and 323 may include one material selected from a group including Ag, Au, Pt, Sn, Cu, Zn, In, Bi, contact, Ti, or the like, or an alloy thereof. The conductive parts 321 and 323 are solder paste, and may be formed by mixing powder particles or particle particles and flux. The solder paste may include Sn-Ag-Cu, and the weight % of each metal may vary. The conductive parts 321 and 323 may include SAC (Sn-Ag-Cu) or SAC-based materials.

For example, the conductive parts 321 and 323 may be formed using conductive paste. The conductive paste may include solder paste, silver paste, and the like, and may be composed of multiple layers composed of different materials or multiple layers or single layers composed of alloys.

The bonding parts 121 and 122 of the light emitting element 120 are bonded to the material constituting the conductive parts 321 and 323 during the process of forming the conductive parts 321 and 323 or during the heat treatment process after the conductive parts 321 and 323 are provided, the conductive parts 321 and 323 are formed. An intermetallic compound (IMC) layer may be formed between the portions 321 and 323 and the frames 111 and 113 .

Here, an alloy layer may be formed by a combination between a material constituting the conductive parts 321 and 323 and the metal of the frames 111 and 113 . Accordingly, the conductive parts 321 and 323 and the frames 111 and 113 can be physically and electrically stably coupled. The conductive parts 321 and 323, the alloy layer, and the frame can be physically and electrically stably coupled. The alloy layer may include at least one intermetallic compound layer selected from a group including AgSn, CuSn, AuSn, and the like. The intermetallic compound layer may be formed by combining a first material and a second material, the first material may be provided from the conductive parts 321 and 323, and the second material may be provided from the bonding parts 121 and 122 or the frames 111 and 113 ) can be provided. The intermetallic compound layer described above may have a higher melting point than other bonding materials. In addition, the heat treatment process for forming the metallic compound layer may be performed at a lower temperature than the melting point of a general bonding material. Therefore, since the re-melting phenomenon does not occur even when the light emitting device package 100 according to the embodiment is bonded to the main substrate through a reflow process, electrical connection and physical bonding strength are not deteriorated. There are advantages.

According to the light emitting device package 100 and the light emitting device package manufacturing method according to the embodiment, the package body does not need to be exposed to high temperatures in the process of manufacturing the light emitting device package. Therefore, according to the embodiment, it is possible to prevent the package body from being damaged or discolored due to exposure to high temperatures. Accordingly, the range of selection for the material constituting the body 115 can be widened. According to the embodiment, the body 115 may be provided using a relatively inexpensive resin material as well as an expensive material such as ceramic.

When the frames 111 and 113 have a multilayer structure including a base layer and a plating layer on a surface of the base layer, an alloy layer may be formed between the conductive parts 321 and 323 and at least one layer of the frames 111 and 113. The alloy layer may be formed by a combination between a material constituting the conductive parts 321 and 323 and a metal layer of the frames 111 and 113 . The alloy layer may be formed on surfaces of the frames 111 and 113 . The alloy layer may include an intermetallic compound layer having at least one selected from a group including AgSn, CuSn, AuSn, and the like. The intermetallic compound layer may be formed by combining a first material and a second material, the first material may be provided from the conductive parts 321 and 323, and the second material may be the metal layer or the base of the frames 111 and 113. It can be provided from layers.

When the first and second frames 111 and 113 are made of a conductive material, the first and second frames 111 and 113 may be electrically connected to the bonding parts 121 and 122 of the light emitting device 120 . The bonding parts 121 and 122 of the light emitting device 120 may be electrically connected to at least one or all of the conductive parts 321 and 323 and the frames 111 and 113 . Accordingly, the light emitting element 120 can be driven by driving power supplied through the first bonding part 121 and the second bonding part 122 . In addition, light emitted from the light emitting device 120 may be provided in an upper direction of the package body 110 .

The light emitting device package 100 according to an embodiment of the present invention may include a molding part 190 . The molding part 190 may be provided on the light emitting device 120 . The molding part 190 may be disposed on the first frame 111 and the second frame 113 . The molding part 190 may be disposed in the cavity 102 provided by the package body 110 .

The molding part 190 may include an insulating material. In addition, the molding part 190 may include a wavelength conversion means for receiving light emitted from the light emitting device 120 and providing wavelength-converted light. For example, the molding part 190 may be formed of at least one material selected from a group including phosphors and quantum dots. The light emitting device 120 may emit blue, green, red, white, infrared or ultraviolet light. The phosphor or quantum dot may emit blue, green, or red light. The molding part 190 may not be formed.

The light emitting device package 100 may be supplied mounted on a submount or a circuit board. However, when a conventional light emitting device package is mounted on a submount or a circuit board, a high-temperature process such as reflow may be applied. At this time, in the reflow process, a re-melting phenomenon occurs in a bonding area between the lead frame provided in the light emitting device package and the light emitting device, so that stability of electrical connection and physical coupling may be weakened.

The first bonding part 121 and the second bonding part 122 of the light emitting device according to the embodiment of the present invention may receive driving power through at least one or both of the frames 111 and 113 and the conductive parts 321 and 323. . Also, the melting point of the conductive parts 321 and 323 may be selected to have a higher melting point than that of other bonding materials. Therefore, since the re-melting phenomenon does not occur even when the light emitting device device package 100 according to the embodiment of the present invention is bonded to the main substrate through a reflow process, electrical connection and physical bonding force are improved. It has the advantage of not deteriorating. In addition, according to the light emitting device package 100 according to the embodiment of the present invention, the package body 110 does not need to be exposed to high temperatures in the process of manufacturing the light emitting device package. Therefore, according to an embodiment of the present invention, it is possible to prevent the package body 110 from being damaged or discolored due to exposure to high temperatures.

Accordingly, the range of selection for the material constituting the body 115 can be widened. According to an embodiment of the present invention, the body 115 may be provided using a relatively inexpensive resin material as well as an expensive material such as ceramic.

The light emitting device package according to the embodiment of the present invention may include the second resin 162 around the lower portion of the light emitting device 120 . The second resin 162 may be disposed on the lower circumference of the light emitting device 120 and the bottom of the cavity. The second resin 162 may be disposed between the molding part 190 and the bottom of the cavity, and may be disposed at a level equal to or lower than a lower surface of the light emitting device 120 . A portion of the second resin 162 may contact a side surface of the light emitting device 120 . The second resin 162 may be provided with a thin thickness to reflect light emitted in a lateral direction of the light emitting device 120 . The second resin 162 may contact the first to fourth support parts 51 , 52 , 53 , and 54 and the spacers P1 , P2 , P3 , and P4 . The second resin 162 may be disposed around the first resin 160 and come into contact with the first resin 160 .

The second resin 162 can provide a stable fixing force between the body 115 and the light emitting element 120, and when light is emitted to the side of the light emitting element 120, the body 115 and A light reflection function may be provided on the frames 111 and 113 . When light is emitted to the side of the light emitting device 120, the second resin 162 may improve light extraction efficiency of the light emitting device package 100 by providing a light reflecting function. When the second resin 162 has a reflective function, the second resin 162 may include a filler such as TiO ₂ , SiO ₂ , or Al ₂ O ₃ therein. The second resin 162 may be made of the same material as the first resin 160 . The first and second resins 160 and 162 may be made of a resin material different from that of the body 115 or made of the same resin material.

When the main material of the frames 111 and 113 is copper, since the second resin 162 has a low difference in coefficient of thermal expansion (CTE) with the copper material, the area of the copper material, that is, the first and second resins 162 Coupling holes described below may be arranged to reduce the area of the two frames 111 and 113. Due to the area reduction of the frame, thermal deformation caused by the frame may be reduced and generation of cracks in the conductive part may be suppressed.

The second resin 162 may improve luminous flux in the light emitting device package 100 . Since the second resin 162 adheres to the light emitting element 120, reliability due to thermal shock between the respective bonding parts 121 and 122 and the frames 111 and 113 can be improved. Since the second resin 162 adheres to the light emitting element 120, movement or tilt of the light emitting element 120 due to remelting may be prevented. In addition, since the second resin 162 covers the frames 111 and 113, when a plating layer, for example, an Ag layer, is formed on the upper surfaces of the frames 111 and 113, a problem in which the Ag layer turns yellow can be prevented.

Referring to FIGS. 6 and 4 , the body 115 may arrange concave recesses R1 and R2 in an upper region between the frames 111 and 113 . The recesses R1 and R2 may buffer the body 115 when the frames 111 and 113 and materials around them thermally expand or contract in one direction. The recesses R1 and R2 may be disposed in a direction orthogonal to a direction in which the thermal expansion or contraction is high. The recess of the body 115 may include a first recess R1 and a second recess R2 spaced apart from each other. Since the recesses R1 and R2 of the body 115 are spaced apart in the second direction, thermal expansion or contraction in the first direction can be buffered. The recesses R1 and R2 of the body 115 buffer thermal expansion or contraction in the first direction, thereby suppressing or preventing cracks in the frames 111 and 113 and the conductive parts 321 and 323 attached thereto. can do. The recesses R1 and R2 may be filled with a resin material disposed between the body 115 and the light emitting element 120 .

The first resin 160 is, for example, in direct contact with the upper surface of the body 115, disposed in the first and second recesses R1 and R2, and in contact with the lower surface of the light emitting element 120, , The light emitting element 120 can be fixed.

The depth of the first and second recesses R1 and R2 may be determined in consideration of the adhesive strength of the first resin 160 . The depth of the first and second recesses R1 and R2 takes into consideration the stable strength of the body 115 and/or cracks in the light emitting device package 100 due to heat emitted from the light emitting device 120 ( crack) can be determined so as not to occur.

The first and second recesses R1 and R2 may provide an appropriate space in which a kind of underfill process can be performed under the light emitting device 120 . Here, the under fill process may be a process of mounting the light emitting device 120 on the package body 110 and disposing the first resin 160 below the light emitting device 120, In the process of mounting the device 120 on the package body 110, the first resin 160 is inserted into the first and second recesses R1 and R2 and the body ( 15) It may be a process of attaching the light emitting device 120 after dispensing on the surface.

Since the upper width of the first and second recesses R1 and R2 is wider than the lower width, the inside of the first and second recesses R1 and R2 may be provided with an inclined surface or a curved surface. Accordingly, the first resin 160 may be guided and supported in the first and second recesses R1 and R2.

The first and second recesses R1 and R2 may include an inner portion disposed inside the side surface of the light emitting device 120 and an outer portion disposed outside the light emitting device 120 . A length ratio of the inner portion and the outer portion may be in the range of 3:7 to 7:3. If the length ratio of the inner part is less than 30% compared to the length ratio of the outer part, the injection efficiency of the first resin may decrease, and if the outer part is greater than 70% compared to the length ratio of the inner part, the inner surface 132 of the cavity 102 ) Adjacent to the lower part, a problem may occur in that the first resin 160 flows to the lower part of the inner surface. Inner portions of the first and second recesses R1 and R2 may overlap the light emitting device 120 in a vertical direction.

As another example, a third recess may be disposed between the first and second recesses R1 and R2, and the third recess is between the first and second bonding parts 121 and 122 of the light emitting device 120. It can be placed in an area corresponding to .

The first and second recesses R1 and R2 may be disposed above the body 115 . The depth of the first and second recesses R1 and R2 may be 25% or less of the thickness T2 of the first and second frames 111 and 113, for example, 1% to 25%. The depth of the first and second recesses R1 and R2 may be 25% or less of the thickness of the body 115 between the first and second frames 111 and 113, for example, 1% to 25%. The depth of the first and second recesses R1 and R2 may be greater than or equal to 1 micrometer, for example, in the range of 1 to 50 micrometers. Depths of the first and second recesses R1 and R2 may be the same as or different from each other, and if too deep, the rigidity of the body 115 may decrease. If too thin, the depth of the first resin 160 may decrease. Support may be reduced.

If the upper part of the body 115 does not have the recesses R1 and R2, it may be difficult to control the amount of the first resin 160, resulting in a bonding problem due to the overflow of the first resin 160. may occur. In addition, when there is no recess, solder cracks may occur due to impact transmitted to the solder by thermal deformation of each frame 111 and 113, and when such thermal deformation is repeated, the body between the two frames is damaged. It can be. An embodiment of the present invention can solve the above problems by securing the thickness of the conductive parts 321 and 323 and using a structure for relieving thermal deformation of the body. An embodiment of the invention is disposed between the first frame 111 and the second frame 113 and reduces the volume of the body 115 located in an area overlapping in the vertical direction with the light emitting element 120, When thermal deformation is generated by the first and second frames 111 and 113, the body 115 may buffer the heat.

As shown in FIG. 6, the body 115 is provided with first recesses R1 and R2 and a plurality of spacers P1, P2, P3 and P4, and the body 115 between the frames 111 and 113 provides a shock absorber. role, and suppression of cracks caused by the conductive parts 321 and 323. In addition, since the spacers P1 , P2 , P3 , and P4 correspond to or face the outside of the bonding parts 121 and 122 , it is possible to prevent the light emitting device 120 from tilting.

Referring to FIGS. 4 and 7 , the second resin 162 may cover the spacers P1 , P2 , P3 , and P4 . The second resin 162 may cover the first to fourth support parts 51 , 52 , 53 , and 54 . The second resin 162 may cover the first and second frames 111 and 113 and the body 115 disposed outside the light emitting element 120 .

The second resin 162 may be disposed between the lower part 134 of the inner surface 132 of the cavity 102 and the side surface of the light emitting element 120, and the lower part 134 and the light emitting element ( 120). The second resin 162 may include a concave curved surface or a shape having a concave curvature between the lower portion 134 of the inner surface 132 of the cavity 102 and the side surface of the light emitting device 120 . The second resin 162 may have the same height as or a different height from the lower portion 134 of the inner surface 132 of the cavity 102 and the side surface of the light emitting device 120 .

The second resin 162 may be dispensed on the inner surface 132 of the cavity 102 . For example, it may be dispensed on the inner surface 132 of the cavity adjacent to the first and second side surfaces S1 and S2 of the body 115 . This is because the space on the inner surface 132 of the cavity 102 adjacent to the first and second side surfaces S1 and S2 of the body 115 is larger than the space on the inner surface adjacent to the third and fourth side surfaces S3 and S4. It can be provided large, so insertion of the dispenser can be easy.

The height of the second resin 162 covering each side surface of the light emitting device 120 varies according to the dispensed amount, so that the luminous intensity of light emitted through the side surface of the light emitting device 120 may vary. The light efficiency of the light emitting device 120 may be improved by about 101% to 104% compared to the case where the second resin 162 is not present.

The second resin 162 may be disposed at a height of 70% or less of the thickness of the light emitting device 120 from the upper surface of the light emitting device 120 . Here, the reference height of 70% or less may be the height of an upper end of the second resin 162 disposed at each corner of the light emitting device 120 . When the height of the upper end of the second resin 162 exceeds 70% of the thickness of the light emitting element 120, the efficiency of light emitted through the side surface of the light emitting element 120 may decrease.

When the lengths of two adjacent side surfaces of the light emitting device 120 are different, the height difference between the centers of the two adjacent side surfaces of the second resin 162 may be in the range of 5% to 40%.

7 to 10, the second resin 162 has a contact height at the side surfaces CS1, CS2, CS3, and CS4 of the light emitting device 120 according to the side surface area of the light emitting device 120. can be different The height PL2 of the upper end of the second resin 162 disposed at each corner of the light emitting element 120 is the height PL1 of the upper end of the second resin 162 disposed at the center of each side of the light emitting element 120. PL3) may be higher. The second resin 162 includes a first contact end PL1 contacting a corner between the side surfaces CS1 , CS2 , CS3 , and CS4 of the light emitting element 120 and two adjacent side surfaces CS1 , CS2 , CS3 , CS4) may include second and third contact ends PL2 and PL3 contacting the central portion. The contact ends PL1 , PL2 , and PL3 may be upper ends of portions in contact with side surfaces or corners of the light emitting device 120 .

The light emitting element 120 has a long length Y1 in the second direction Y, and the first and second side surfaces CS1 and CS2 facing each other in the first direction X, and the first direction X It may include third and fourth side surfaces CS3 and CS4 having a long length X1 and facing each other in the second direction Y. The third and fourth side surfaces CS3 and CS4 may be disposed in a direction orthogonal to the first and second side surfaces CS1 and CS2.

The first and second spacers P1 and P2 may be disposed below the first side surface CS1 of the light emitting device 120 . The third and fourth spacers P3 and P4 may be disposed below the second side surface CS2 of the light emitting device 120 . The first and third spacers P1 and P3 may be disposed below the third side surface CS3 of the light emitting device 120 . The second and fourth spacers P2 and P4 may be disposed below the fourth side surface CS4 of the light emitting device 120 .

Lengths Y1 of the first and second side surfaces CS1 and CS2 in the second direction may be smaller than lengths Y1 and Y1<X1 of the third and fourth side surfaces CS3 and CS4 in the first direction. . The light emitting device 120 may have different lengths of two adjacent sides. At this time, the second contact end of the second resin 162 in contact with the center of the first and second side surfaces CS1 and CS2 of the light emitting element 120 is referred to as PL2, and the third and fourth side surfaces CS3 and CS4 When the third contact end of the second resin 162 in contact with the center of is PL3, the heights of the second and third contact ends may have a relation of PL2>PL3. That is, in the second resin 162, the height of the third contact end PL3 disposed at the center of the long side of the light emitting element 120 is greater than the height of the second contact end PL2 disposed at the center of the short side. Can be placed low.

The height of the first contact end PL1 contacting the corner between the two different side surfaces of the light emitting element 120 may be higher than the heights of the second and third contact ends PL2 and PL3.

Alternatively, the height of the second contact end PL2 of the second resin 162 disposed at the center between the first and second spacers P1 and P2 is at the center between the first and third spacers P1 and P3. It may be disposed higher than the height of the third contact end PL3 of the disposed second resin 162 . The height of the second contact end PL2 of the second resin 162 disposed at the center between the third and fourth spacers P3 and P4 is disposed at the center between the second and fourth spacers P2 and P4. may be disposed higher than the height of the third contact end PL3 of the second resin 162.

The height of the contact end of the second resin 162 contacting the side surface of the light emitting element 120 may be different depending on the dispensing position, the amount dispensed, and the size of the light emitting element 120 . As another example, when the light emitting device 120 has a square shape, heights of contact ends of the second resin 162 at the center of each side surface may be the same.

11 and 12 are modified examples of the light emitting device package according to the first embodiment. In the description of FIGS. 11 and 12, the same configuration as above can be selectively applied, and the above description will be referred to.

Referring to FIGS. 11 and 12 , the light emitting device package 100A includes first and second support parts 51 and 52 on a first frame 111 and third and fourth support parts on a second frame 1113 . Can contain (53,54).

The first and fourth support portions 51 and 54 refer to the description of the first embodiment disclosed above. The second support part 52 may be connected to the body 115 at the bottom of the cavity 102 . The second concave portion Rb1 of the second support portion 52 is spaced apart from the inner surface of the cavity adjacent to the fourth side surface S4 of the body 115 and is provided with a larger area than the first concave portion Ra. can Accordingly, when the conductive portion 321 diffuses through the second concave portion Rb1, a wider guide path may be provided.

The third support part 53 may be connected to the body 115 at the bottom of the cavity 102 . The third concave portion Rc1 of the third support portion 53 is spaced apart from the inner surface of the cavity adjacent to the third side surface S3 of the body 115 and provided with a larger area than the fourth concave portion Rd. can Accordingly, when the conductive portion 323 diffuses through the fourth concave portion Rc1, a wider guide path may be provided.

A sub inner surface 133 may be included between the inner surface 132 and the lower part 134 of the cavity 102, and the sub inner surface 133 is smaller than the inner surface 132 and the lower part 134. Can be inclined at an angle. That is, the sub-inside surface 133 is disposed to face the first and second side surfaces of the light emitting device 120, and can effectively reflect the incident light.

The light emitting element 120 may have a first resin disposed at a lower portion and a second resin disposed around the lower portion, and the description of the first embodiment will be referred to.

In the above embodiment(s), the conductive parts 321 and 323 may diffuse to the outside of the bonding parts 121 and 122 through the guide parts of the first and second frames 111 and 113 . In this case, portions of the conductive parts 321 and 323 may be disposed on at least one or more of the guide parts 11 , 121 , 13 , 31 , 32 , and 33 and the second resin 162 .

<Second Embodiment>

13 is a plan view of the light emitting device package according to the second embodiment, and FIG. 14 is a D-D cross-sectional view of the light emitting device package of FIG. 13 . In describing the second embodiment, the same parts as the first embodiment can be applied, and the description of the first embodiment will be referred to.

Referring to FIGS. 13 and 14 , the light emitting device package 100B may have the same length as the length of the upper body 115 in the first direction and in the second direction. The light emitting device 120 may be provided in a shape in which a length in the first direction is longer than a length in the second direction.

The light emitting device package 100B may include a first frame 111 , a second frame 113 and a body 115 . The body 115 may be disposed between the first and second frames 111 and 113. A cavity 112 may be disposed on the body 115 . A light emitting device 120 may be disposed on the first and second frames 111 and 113 .

The plurality of spacers P1 , P2 , P3 , and P4 may be respectively disposed at lower corners of the light emitting device 120 . The plurality of spacers P1 , P2 , P3 , and P4 may space the light emitting device 120 apart from the upper surfaces of the respective support units 51 , 52 , 53 , and 54 and the upper surfaces of the frames 111 and 113 .

Inner portions of the plurality of spacers P1 , P2 , P3 , and P4 overlap with the light emitting device 120 in the vertical direction, and may not overlap with the respective bonding parts 121 and 122 in the vertical direction.

The first frame 111 may include a first upper recess ST1, and the first upper recess ST1 may include first and second support parts 51 and 52 and a first connection support part 51A. can The second connection support portion 51A connects the first and second support portions 51 and 52 and may support the first and second support portions 51 and 52 .

The first guide part 11A between the first connection support part 51A and the light emitting device 120 may be spaced apart from the inner lower part 134 of the cavity 102 by a predetermined distance k4. The first guide part 11A may be spaced apart from the first bonding part 121 of the light emitting device 120 . The first guide part 11A is disposed between the first and second spacers P1 and P2 or between the first and second support parts 51 and 52, and is diffused from the lower part of the first bonding part 121. The first conductive part 321 may be accommodated or guided. The width k3 of the first guide part 11A in the second direction is larger than the width of the first bonding part 121 in the second direction, thereby facilitating the arrangement of the first bonding part 121, and The maximum diffusion path of the conductive portion 321 can be provided. The first connection support portion 51A may prevent the first conductive portion 321 from contacting the inner surface of the cavity.

The second frame 113 may include a second upper recess ST2, and the second upper recess ST2 may include the third and fourth support parts 53 and 54 and the second connection support part 53A. can The second connection support portion 53A connects the third and fourth support portions 53 and 54 and may support the third and fourth support portions 51 and 52 .

The fourth guide part 31A between the second connection support part 53A and the light emitting element 120 may be spaced apart from the inner lower part 134 of the cavity 102 by a predetermined distance k4. The fourth guide part 31A may be spaced apart from the second bonding part 122 of the light emitting device 120 . The fourth guide part 31A is disposed between the third and fourth spacers P3 and P4 or between the third and fourth support parts 53 and 54, and is diffused from the lower part of the second bonding part 122. The second conductive part 323 may be accommodated or guided. The width k3 of the fourth guide part 31A in the second direction is larger than the width of the second bonding part 122 in the second direction, thereby facilitating the arrangement of the second bonding part 122, and The diffusion path of the conductive portion 323 can be provided to the maximum. The second connection support portion 53A may prevent the second conductive portion 323 from contacting the inner surface of the cavity.

The distance k4 between the first and fourth guide parts 11A and 31A and the side surface of the light emitting element 120 is 0.5 of the width of the spacer P1 , P2 , P3 , and P4 in the first and second directions. It can be arranged more than twice, for example, between 0.5 times and 2 times. When the distance k4 is smaller than the range, the conductive portion may overflow, and when the distance k4 is larger than the range, the connection width of the connection support portions 51A and 53A may be reduced.

Both ends in the second direction of the body 115 disposed between the first and second frames 111 and 113 may be bent or inclinedly extended in the direction of the first and second support parts 51 and 52 . In this case, the widths of the second and third guide parts 12 and 13 in the first direction may be greater than the widths of the fifth and sixth guide parts 32 and 33 in the first direction. That is, the area of the upper surface of the first frame 111 at the bottom of the cavity may be greater than the area of the upper surface of the second frame 113 .

In the light emitting device package, the extensions or extension protrusions of the first and second frames 111 and 113 are disposed on the third and fourth side surfaces S3 and S4 of the body 115, not on the first and second side surfaces S1 and S2. It can be.

The first resin 160 described above may be disposed below the light emitting element 120, and the second resin 162 described above may be disposed around the lower portion. An upper portion of the body 115 may include the above-described recess. The second resin 162 may have the same top height on the side of the light emitting device 120 or may be provided with different heights in the center area and corner area.

As shown in FIG. 15 , in the light emitting device package disclosed above, the protection device 125 may be buried by placing a concave sub-cavity 135 on an inner surface of the package body, for example, the cavity. The protection element 125 may be covered with a resin for reflection or a resin for light absorption.

<Third Embodiment>

15 is an example of a perspective view of a light emitting device package according to a third embodiment, FIG. 16 is a view showing an example in which a second resin is disposed on the light emitting device package of FIG. 15, and FIG. 17 is a view of the light emitting device package of FIG. 15 18 is an E-E side sectional view of the light emitting device package of FIG. 16, FIG. 19 is another example of the light emitting device package of FIGS. 16 and 18, and FIG. 20 is FIG. 17 is another example of a light emitting device package of The third embodiment can selectively apply the embodiment(s) disclosed above, and redundant description will be omitted.

Referring to FIGS. 15 to 18 , the light emitting device package 200 may include a plurality of spacers P11 , P12 , P13 , and P14 . A plurality of spacers P11 , P12 , P13 , and P14 may be connected to a lower portion of the inner surface of the cavity 102 . Upper surfaces of the plurality of spacers P11 , P12 , P13 , and P14 may extend from an inner surface of the cavity 102 .

Upper surfaces of the plurality of spacers P11 , P12 , P13 , and P14 may overlap with the light emitting device 120 in a vertical direction and may be disposed at respective corners of the light emitting device 120 . The outer lines of the plurality of spacers P11 , P12 , P13 , and P14 may be disposed outside or higher than the bottom outline of the cavity.

The plurality of spacers P11 , P12 , P13 , and P14 may protrude from respective support portions 55A, 55B, 57A, and 57B. The first and second support parts 55A and 55B may be connected to the first support connection part 55 , and the third and fourth support parts 57A and 57B may be connected to the second support connection part 57 . Each of the support portions 55A, 55B, 57A, and 57B may include convex portions Ra2 , Rb2 , Rc2 , and Rd2 having convex curves corresponding to corners of the respective bonding portions 121 and 122 . The convex portions Ra2 , Rb2 , Rc2 , and Rd2 may correspond to outer corners of the first and second bonding portions 121 and 122 , respectively.

First and fourth guide parts 11B and 31B may be disposed at the first and second support connecting parts 55 and 57 . Here, the boundary regions Rab and Rcd between the first and second support connecting parts 55 and 57 and the first and fourth guide parts 11B and 31B are concavely disposed toward the inner surface of the cavity, so that the conductive part ( 321 and 323) may be guided or part of the conductive portion may be accommodated.

The first frame 111 may include second and third guide parts 12 and 13 extending in both directions in the second direction. The second frame 113 may include fifth and sixth guide parts 32 and 33 extending in both directions in the second direction.

A plurality of recesses R1 and R2 may be disposed on the body 115 . The plurality of recesses R1 and R2 will refer to the description of the first embodiment.

One of the inner surfaces of the cavity 102 includes a concave sub-cavity 135 in which frames are exposed, and a protective device 125 is disposed inside the sub-cavity 135 and connected to another frame by a wire 126. or flip bonded.

A first resin 160 may be disposed on the body 115 below the light emitting element 120 , and a second resin 162 may be disposed around the lower circumference of the light emitting element 120 . The first and second resins 160 and 162 will refer to the description of the embodiment(s) disclosed above.

Referring to FIG. 19 , the light emitting device package may include a body 115 between first and second frames 111 and 113 . Upper surfaces of the body 115 may protrude higher than upper surfaces of the first and second frames 111 and 113 . Since the upper surface of the body 115 protrudes higher than the upper surfaces of the first and second frames 111 and 113, when the recesses R1 and R2 are formed, the body 115 is formed of the recesses R1 and R2. The depth can be formed deep, and a dam function of preventing flow between the conductive parts 321 and 323 under the first and second bonding parts 121 and 122 can be performed.

The upper surface of the body 115 may be disposed between the lower surface of the first and second bonding parts 121 and 122 and the lower surface of the light emitting element 120 . In this structure, the amount of the first resin 160 can be reduced.

Referring to FIG. 20 , the first guide part 11 extends below the inner surface of the cavity and divides the first support connection part of FIG. 17 into two regions 55-1 and 55-2. The fourth guide part 31 extends below the inner surface of the cavity, and can divide the first support connecting part of FIG. 17 into two regions 57-1 and 56-2. These first and fourth guide parts 11 and 31 may provide a diffusion path of the conductive part.

FIG. 21 is an example of a light source device or light source module in which the light emitting device package of FIG. 4 is disposed on a circuit board. As an example, it will be described as an example of a light source device having a light emitting device package of the first embodiment, and will be described later with reference to the description and drawings disclosed above. The above-described embodiment(s) may be selectively applied to the light emitting device package.

Referring to FIGS. 4 and 21 , in the light source module according to the embodiment, one or a plurality of light emitting device packages 100 may be disposed on a circuit board 501 .

The circuit board 501 may include a substrate member having pads 511 and 513 . A power supply circuit for controlling driving of the light emitting device 120 may be provided on the circuit board 501 . Each frame 111 and 113 of the light emitting device package 100 may be connected to respective pads 511 and 513 of the circuit board 501 and bonding members 521 and 523 . Accordingly, the light emitting device 120 of the light emitting device package 100 may receive power from the respective pads 511 and 513 of the circuit board 501 . Each of the pads 511 and 513 of the circuit board 501 is, for example, at least one selected from the group consisting of Ti, Cu, Ni, Au, Cr, Ta, Pt, Sn, Ag, P, Fe, Sn, Zn, and Al. of or alloys thereof.

Bonding members 521 and 523 may be provided between the respective pads 511 and 513 of the circuit board 501 and the frames 111 and 113 . The bonding members 521 and 523 may be connected to the frames 111 and 113 and the conductive parts 321 and 323 .

According to the light emitting device package according to the embodiment, the bonding portions 121 and 122 of the light emitting device 120 may receive driving power through the conductive portions 321 and 323 disposed on the frames 111 and 113 . Also, the melting point of the conductive parts 321 and 323 may be selected to have a higher value than the melting point of a general bonding material. The light emitting device device package according to the embodiment has an advantage in that electrical connection and physical bonding force are not deteriorated because a re-melting phenomenon does not occur even when bonded to a main substrate or the like through a reflow process. According to the light emitting device package according to the embodiment, the package body 110 and the body 115 do not need to be exposed to high temperatures in the process of manufacturing the light emitting device package. Therefore, according to the embodiment, it is possible to prevent the package body 110 and the body 115 from being damaged or discolored due to exposure to high temperatures.

The light emitting device package 100 according to the embodiment may be supplied mounted on a submount or a circuit board. However, when a conventional light emitting device package is mounted on a submount or a circuit board, a high-temperature process such as reflow may be applied. At this time, in the reflow process, a re-melting phenomenon occurs in the bonding area between the frame provided in the light emitting device package and the light emitting device, and thus the stability of electrical connection and physical coupling may be weakened. Accordingly, the position of the light emitting device may be weakened. Since may change, optical and electrical characteristics and reliability of the light emitting device package may be deteriorated. However, according to the light emitting device package according to the embodiment, the first bonding part of the light emitting device according to the embodiment may receive driving power through the conductive part disposed in the through hole. Therefore, even when the light emitting device device package 100 according to the embodiment is bonded to the main substrate through a reflow process, since a re-melting phenomenon does not occur, electrical connection and physical bonding strength are not deteriorated. There are advantages to not

22 is a cross-sectional view showing an example of a light emitting device applied to a light emitting device package according to an embodiment of the present invention.

Referring to FIG. 22, the light emitting element conceptually illustrates only the relative arrangement relationship between the first electrode 627 and the second electrode 628. The first electrode 627 may include a first bonding portion 621 and a first branch electrode 625 . The second electrode 628 may include a second bonding portion 622 and a second branch electrode 626 .

The light emitting device may include a light emitting structure 623 disposed on a substrate 624 . The substrate 624 may be selected from a group including a sapphire substrate (Al ₂ O ₃ ), SiC, GaAs, GaN, ZnO, Si, GaP, InP, and Ge. For example, the substrate 624 may be provided as a patterned sapphire substrate (PSS) having a concavo-convex pattern formed on an upper surface thereof.

The light emitting structure 623 may include a first conductivity type semiconductor layer 623a, an active layer 623b, and a second conductivity type semiconductor layer 623c. The active layer 623b may be disposed between the first conductivity type semiconductor layer 623a and the second conductivity type semiconductor layer 623c. For example, the active layer 623b may be disposed on the first conductivity-type semiconductor layer 623a, and the second conductivity-type semiconductor layer 623c may be disposed on the active layer 623b.

According to an embodiment, the first conductivity-type semiconductor layer 623a may be provided as an n-type semiconductor layer, and the second conductivity-type semiconductor layer 623c may be provided as a p-type semiconductor layer. Of course, according to another embodiment, the first conductivity type semiconductor layer 623a may be provided as a p-type semiconductor layer, and the second conductivity type semiconductor layer 623c may be provided as an n-type semiconductor layer.

The light emitting device may include a first electrode 627 and a second electrode 628 . The first electrode 627 may include a first bonding portion 621 and a first branch electrode 625 . The first electrode 627 may be electrically connected to the second conductivity type semiconductor layer 623c. The first branch electrode 625 may be disposed to be branched from the first bonding part 621 . The first branch electrode 625 may include a plurality of branch electrodes branched from the first bonding part 621 . The second electrode 628 may include a second bonding portion 622 and a second branch electrode 626 . The second electrode 628 may be electrically connected to the first conductivity type semiconductor layer 623a. The second branch electrode 626 may be disposed to be branched from the second bonding part 622 . The second branch electrode 626 may include a plurality of branch electrodes branched from the second bonding part 622 .

The first branch electrodes 625 and the second branch electrodes 626 may be alternately arranged in a finger shape. Power supplied through the first bonding part 621 and the second bonding part 622 by the first branch electrode 625 and the second branch electrode 626 is transmitted to the light emitting structure 623 as a whole. It can be spread and provided.

The first electrode 627 and the second electrode 628 may be formed in a single-layer or multi-layer structure. For example, the first electrode 627 and the second electrode 628 may be ohmic electrodes. For example, the first electrode 627 and the second electrode 628 may be ZnO, IrOx, RuOx, NiO, RuOx/ITO, Ni/IrOx/Au, and Ni/IrOx/Au/ITO, Ag, Ni , Cr, Ti, Al, Rh, Pd, Ir, Ru, Mg, Zn, Pt, Au, and Hf, or at least one or an alloy of two or more of these materials.

Meanwhile, a protective layer may be further provided on the light emitting structure 623 . The protective layer may be provided on an upper surface of the light emitting structure 623 . Also, the protective layer may be provided on a side surface of the light emitting structure 623 . The protective layer may be provided to expose the first bonding portion 621 and the second bonding portion 622 . In addition, the protective layer may be selectively provided on the circumference and the lower surface of the substrate 624 .

For example, the protective layer may be provided with an insulating material. For example, the protective layer is Si _x O _y , SiO _x N _y , Si _x N _y , Al _x O _y It may be formed of at least one material selected from the group including.

In the light emitting device according to the embodiment, light generated in the active layer 623b may be emitted in directions of six surfaces of the light emitting device. Light generated in the active layer 623b may be emitted in six directions through the upper and lower surfaces of the light emitting device and four side surfaces.

As another example of the light emitting device, at least one of the first electrode and the second electrode may be implemented in a pattern form, and a conductive protrusion may be disposed on the pattern form electrode. The pattern may include a pattern having one or a plurality of arm shapes or branch shapes. Alternatively, conductive protrusions may be disposed on each bonding portion of the light emitting device. The light emitting device has been described as a structure having one light emitting cell. When the light emitting cell includes the above light emitting structure, the driving voltage of the light emitting device may be the voltage applied to one light emitting cell. As an example of the light emitting device disclosed in the embodiment, a light emitting device having two light emitting cells may be disclosed.

The light emitting device disclosed above has been described as a structure having one light emitting cell. When the light emitting cell includes the above light emitting structure, the driving voltage of the light emitting device may be the voltage applied to one light emitting cell. As an example of the light emitting device disclosed in the embodiment, a light emitting device having two or three or more light emitting cells may be included. Accordingly, a high voltage light emitting device package can be provided.

On the other hand, the light emitting device package according to the embodiment of the invention described above may be supplied mounted on a submount or a circuit board. However, when a conventional light emitting device package is mounted on a submount or a circuit board, a high-temperature process such as reflow may be applied. At this time, in the reflow process, a re-melting phenomenon occurs in the bonding area between the frame provided in the light emitting device package and the light emitting device, and thus the stability of electrical connection and physical coupling may be weakened. Accordingly, the position of the light emitting device may be weakened. Since may change, optical and electrical characteristics and reliability of the light emitting device package may be deteriorated. However, according to the light emitting device package and the method for manufacturing the light emitting device package according to the embodiment of the present invention, the bonding parts of the light emitting device according to the embodiment of the present invention may receive driving power through the conductive part. And, the melting point of the conductive part may be selected to have a higher value than the melting point of a general bonding material. Therefore, even when the light emitting device device package according to the embodiment of the present invention is bonded to the main substrate through a reflow process, the re-melting phenomenon does not occur, so that the electrical connection and physical bonding force are not deteriorated. There are advantages.

In addition, according to the light emitting device package and the light emitting device package manufacturing method according to an embodiment of the present invention, the package body does not need to be exposed to high temperatures in the process of manufacturing the light emitting device package. Therefore, according to an embodiment of the present invention, it is possible to prevent the package body from being damaged or discolored due to exposure to high temperatures. Accordingly, it is possible to widen the range of selection of materials constituting the body. According to an embodiment of the present invention, the body may be provided using a relatively inexpensive resin material as well as an expensive material such as ceramic.

Meanwhile, one or a plurality of light emitting device packages according to an embodiment of the present invention may be disposed on a circuit board and applied to a light source device. In addition, the light source device may include a display device, a lighting device, a head lamp, and the like according to industrial fields.

As an example of the light source device, the display device includes a bottom cover, a reflector disposed on the bottom cover, a light emitting module including a light emitting element that emits light, and a light emitting module disposed in front of the reflector and guiding light emitted from the light emitting module forward. A light guide plate, an optical sheet including prism sheets disposed in front of the light guide plate, a display panel disposed in front of the optical sheet, an image signal output circuit connected to the display panel and supplying image signals to the display panel, A color filter disposed on the front side may be included. Here, the bottom cover, the reflector, the light emitting module, the light guide plate, and the optical sheet may form a backlight unit. In addition, the display device may have a structure in which light emitting elements emitting red, green, and blue light are respectively disposed without including a color filter.

As another example of a light source device, a headlamp includes a light emitting module including a light emitting device package disposed on a substrate, a reflector for reflecting light emitted from the light emitting module in a predetermined direction, for example, forward, and a light reflected by the reflector. It may include a lens that refracts light forward, and a shade that blocks or reflects a part of the light reflected by the reflector and directed to the lens to achieve a light distribution pattern desired by a designer.

A lighting device, which is another example of a light source device, may include a cover, a light source module, a radiator, a power supply unit, an inner case, and a socket. In addition, the light source device according to an embodiment of the present invention may further include any one or more of a member and a holder. The light source module may include a light emitting device package according to an embodiment of the present invention.

Features, structures, effects, etc. described in the embodiments above are included in at least one embodiment, and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects, etc. illustrated in each embodiment can be combined or modified with respect to other embodiments by a person having ordinary knowledge in the field to which the embodiments belong. Therefore, contents related to these combinations and variations should be interpreted as being included in the scope of the embodiments.

Although the above has been described centering on the embodiment, this is only an example and is not intended to limit the embodiment, and those skilled in the art to which the embodiment belongs may find various things not exemplified above to the extent that they do not deviate from the essential characteristics of the present embodiment. It will be appreciated that variations and applications of branches are possible. For example, each component specifically shown in the embodiment can be modified and implemented. And differences related to these modifications and applications should be interpreted as being included in the scope of the embodiments set forth in the appended claims.

110: package body
111,113: frame
115: body
120: light emitting element
121: first bonding unit
122: second bonding unit
123: light emitting structure
124 Substrate
160: first resin
162: second resin
321,323: conductive part
R1,R2: Recess
P1,P2,P3,P4,P11,P12,P13,P14: Spacer

Claims (11)

A first frame and a second frame spaced apart from each other;
a body disposed between the first frame and the second frame;
a light emitting element having a first bonding part facing the first frame and a second bonding part facing the second frame;
a plurality of spacers disposed under the light emitting element and separating the light emitting element from upper surfaces of the first and second frames;
a first resin disposed between the body and the light emitting element; and
And a second resin disposed around the lower circumference of the light emitting element,
The second resin is in contact with the outside of the top surface of the plurality of spacers and the lower side of each side of the light emitting device. According to claim 1,
The plurality of spacers include first and second spacers outside the first bonding part and third and fourth spacers outside the second bonding part,
The light emitting element further includes first and second side surfaces opposite to each other, and third and fourth side surfaces orthogonal to the first and second sides and opposite to each other,
The first and second spacers are disposed under both sides of the first side of the light emitting element,
The third and fourth spacers are disposed under both sides of the second side of the light emitting element,
The first and third spacers are disposed under both sides of the third side of the light emitting element,
The second and fourth spacers are disposed under both sides of the fourth side surface of the light emitting device. The method of claim 2, wherein the second resin comprises a first contact end disposed at a corner between two adjacent side surfaces of the light emitting element, and a second contact end contacting the center of each side surface of the light emitting element,
A height of the first contact end is higher than a height of the second contact end of the light emitting device package. According to claim 2,
In the light emitting device, the length of each of the third and fourth sides is greater than the length of each of the first and second sides,
A height of an upper end of the second resin disposed at the center of the third and fourth sides of the light emitting device is lower than a height of an upper end of the second resin disposed at the center of the first and second sides of the light emitting device. 5. The method according to any one of claims 2 to 4, wherein the body comprises a cavity with an open top,
The body includes a first support for supporting the first spacer, a second support for supporting the second spacer, a third support for supporting the third spacer, and a fourth support for supporting the fourth spacer, ,
The first frame includes a first guide part extending toward an inner surface of the cavity between the first and second support parts,
The second frame includes a second guide part extending toward the inner surface of the cavity between the third and fourth support parts,
It includes first and second conductive parts disposed between first and second bonding parts of the light emitting element and the first and second frames, respectively;
The first conductive part is disposed on the first guide part and the second conductive part is disposed on the second guide part. 5. The method according to any one of claims 2 to 4, wherein the body comprises a cavity with an open top,
The body includes a first support part supporting the first spacer, a second support part supporting the second spacer, a third support part supporting the third spacer, and a fourth support part supporting the fourth spacer, It includes a first connection support for connecting the first and second supports, and a second connection support for connecting the third and fourth supports to each other,
The first frame includes a first guide part extending from the outside of the first bonding part toward the first connection support part,
The second frame includes a second guide part extending from the outside of the second bonding part toward the second connection support part,
It includes first and second conductive parts disposed between first and second bonding parts of the light emitting element and the first and second frames, respectively;
The first conductive part is disposed on the first guide part and the second conductive part is disposed on the second guide part.
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