KR101063127B1 - 기판 처리 장치 - Google Patents

기판 처리 장치 Download PDF

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Publication number
KR101063127B1
KR101063127B1 KR1020090029228A KR20090029228A KR101063127B1 KR 101063127 B1 KR101063127 B1 KR 101063127B1 KR 1020090029228 A KR1020090029228 A KR 1020090029228A KR 20090029228 A KR20090029228 A KR 20090029228A KR 101063127 B1 KR101063127 B1 KR 101063127B1
Authority
KR
South Korea
Prior art keywords
substrate
side plate
processing apparatus
movable member
processing
Prior art date
Application number
KR1020090029228A
Other languages
English (en)
Korean (ko)
Other versions
KR20090106997A (ko
Inventor
다케시 이토
요시투구 다나카
다카시 오모리
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20090106997A publication Critical patent/KR20090106997A/ko
Application granted granted Critical
Publication of KR101063127B1 publication Critical patent/KR101063127B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H01J37/32633—Baffles

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020090029228A 2008-04-07 2009-04-06 기판 처리 장치 KR101063127B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPJP-P-2008-098930 2008-04-07
JP2008098930 2008-04-07
JP2008275491A JP5113016B2 (ja) 2008-04-07 2008-10-27 基板処理装置
JPJP-P-2008-275491 2008-10-27

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020110025725A Division KR20110040808A (ko) 2008-04-07 2011-03-23 기판 처리 장치

Publications (2)

Publication Number Publication Date
KR20090106997A KR20090106997A (ko) 2009-10-12
KR101063127B1 true KR101063127B1 (ko) 2011-09-07

Family

ID=41174966

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020090029228A KR101063127B1 (ko) 2008-04-07 2009-04-06 기판 처리 장치
KR1020110025725A KR20110040808A (ko) 2008-04-07 2011-03-23 기판 처리 장치

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020110025725A KR20110040808A (ko) 2008-04-07 2011-03-23 기판 처리 장치

Country Status (4)

Country Link
JP (2) JP5113016B2 (zh)
KR (2) KR101063127B1 (zh)
CN (1) CN101556911B (zh)
TW (1) TWI467682B (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5067279B2 (ja) * 2008-06-25 2012-11-07 東京エレクトロン株式会社 処理装置
JP5141520B2 (ja) * 2008-12-02 2013-02-13 東京エレクトロン株式会社 プラズマ処理装置
KR101544004B1 (ko) 2014-07-10 2015-08-17 주식회사 나래나노텍 개선된 기판 열처리 챔버용 도어, 및 이를 구비한 기판 열처리 챔버 및 장치
JP6710134B2 (ja) * 2016-09-27 2020-06-17 東京エレクトロン株式会社 ガス導入機構及び処理装置
CN108598023B (zh) * 2018-05-16 2020-11-13 深圳市信展通电子有限公司 一种芯片加工方法
JP7437985B2 (ja) * 2020-03-16 2024-02-26 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP7350907B2 (ja) * 2022-01-24 2023-09-26 株式会社Ｓｃｒｅｅｎホールディングス 処理チャンバおよび基板処理装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10107009A (ja) * 1996-09-27 1998-04-24 Nec Corp ドライエッチング装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6037139A (ja) * 1983-08-10 1985-02-26 Hitachi Ltd ウェ−ハ移送経路におけるゲ−トバルブ機構
JP3244344B2 (ja) * 1993-05-28 2002-01-07 株式会社日立国際電気 半導体製造装置
JP2503879B2 (ja) * 1993-06-16 1996-06-05 日本電気株式会社 ドライエッチング装置
JP2638443B2 (ja) * 1993-08-31 1997-08-06 日本電気株式会社 ドライエッチング方法およびドライエッチング装置
JP3125831B2 (ja) * 1993-09-24 2001-01-22 日立プラント建設株式会社 高気密メタルシートダンパ
JP2000028014A (ja) * 1998-07-13 2000-01-25 Ckd Corp ゲート式真空遮断弁
JP2003163206A (ja) * 2001-11-28 2003-06-06 Tokyo Electron Ltd プラズマ処理装置、プラズマ処理方法及びマルチチャンバシステム

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10107009A (ja) * 1996-09-27 1998-04-24 Nec Corp ドライエッチング装置

Also Published As

Publication number Publication date
CN101556911B (zh) 2011-07-13
TWI467682B (zh) 2015-01-01
CN101556911A (zh) 2009-10-14
TW201003816A (en) 2010-01-16
JP5113016B2 (ja) 2013-01-09
JP2009272602A (ja) 2009-11-19
JP5351317B2 (ja) 2013-11-27
KR20110040808A (ko) 2011-04-20
JP2012238911A (ja) 2012-12-06
KR20090106997A (ko) 2009-10-12

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