KR101054673B1 - 반도체 장치 및 그 제조 방법 - Google Patents

반도체 장치 및 그 제조 방법 Download PDF

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Publication number
KR101054673B1
KR101054673B1 KR1020067005772A KR20067005772A KR101054673B1 KR 101054673 B1 KR101054673 B1 KR 101054673B1 KR 1020067005772 A KR1020067005772 A KR 1020067005772A KR 20067005772 A KR20067005772 A KR 20067005772A KR 101054673 B1 KR101054673 B1 KR 101054673B1
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layer
conductive
electrode
smoothing
dielectric
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KR1020067005772A
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Korean (ko)
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KR20070017953A (ko
Inventor
안토니 씨안씨오
마크 디. 그리스월드
아무드하 알. 이루다얌
제니퍼 에이치. 모리슨
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프리스케일 세미컨덕터, 인크.
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/60—Capacitors
    • H10D1/68—Capacitors having no potential barriers
    • H10D1/692—Electrodes
    • H10D1/696—Electrodes comprising multiple layers, e.g. comprising a barrier layer and a metal layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5222—Capacitive arrangements or effects of, or between wiring layers
    • H01L23/5223—Capacitor integral with wiring layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/60—Capacitors
    • H10D1/68—Capacitors having no potential barriers
    • H10D1/692—Electrodes
    • H10D1/694—Electrodes comprising noble metals or noble metal oxides

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
KR1020067005772A 2003-09-23 2004-08-31 반도체 장치 및 그 제조 방법 Expired - Fee Related KR101054673B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/668,694 US7078785B2 (en) 2003-09-23 2003-09-23 Semiconductor device and making thereof
US10/668,694 2003-09-23
PCT/US2004/028262 WO2005036597A2 (en) 2003-09-23 2004-08-31 Semiconductor device and making thereof

Publications (2)

Publication Number Publication Date
KR20070017953A KR20070017953A (ko) 2007-02-13
KR101054673B1 true KR101054673B1 (ko) 2011-08-08

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Country Link
US (1) US7078785B2 (enExample)
EP (1) EP1668673A2 (enExample)
JP (1) JP2007515775A (enExample)
KR (1) KR101054673B1 (enExample)
CN (1) CN101160663B (enExample)
TW (1) TWI349367B (enExample)
WO (1) WO2005036597A2 (enExample)

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Also Published As

Publication number Publication date
CN101160663A (zh) 2008-04-09
TWI349367B (en) 2011-09-21
US20050062130A1 (en) 2005-03-24
JP2007515775A (ja) 2007-06-14
TW200518338A (en) 2005-06-01
KR20070017953A (ko) 2007-02-13
WO2005036597A2 (en) 2005-04-21
US7078785B2 (en) 2006-07-18
EP1668673A2 (en) 2006-06-14
WO2005036597A3 (en) 2007-12-06
CN101160663B (zh) 2010-10-27

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