KR100933964B1 - 티오에테르기를 포함하는 접착제 및 접착제 조성물 - Google Patents

티오에테르기를 포함하는 접착제 및 접착제 조성물 Download PDF

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Publication number
KR100933964B1
KR100933964B1 KR1020037011642A KR20037011642A KR100933964B1 KR 100933964 B1 KR100933964 B1 KR 100933964B1 KR 1020037011642 A KR1020037011642 A KR 1020037011642A KR 20037011642 A KR20037011642 A KR 20037011642A KR 100933964 B1 KR100933964 B1 KR 100933964B1
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South Korea
Prior art keywords
adhesive
epoxy
adhesives
delete delete
test
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Expired - Fee Related
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KR1020037011642A
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English (en)
Korean (ko)
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KR20040030526A (ko
Inventor
그로스캐슬린비
노에수잔씨
포셔스알폰서스브이
슐츠윌리엄제이
톰슨웬디엘
Original Assignee
쓰리엠 이노베이티브 프로퍼티즈 캄파니
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Publication of KR20040030526A publication Critical patent/KR20040030526A/ko
Application granted granted Critical
Publication of KR100933964B1 publication Critical patent/KR100933964B1/ko
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/302—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing sulfur
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials
    • C09J2400/16—Metal
    • C09J2400/163—Metal in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/20—Presence of organic materials
    • C09J2400/22—Presence of unspecified polymer
    • C09J2400/226—Presence of unspecified polymer in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2479/00—Presence of polyamine or polyimide
    • C09J2479/08—Presence of polyamine or polyimide polyimide
    • C09J2479/086—Presence of polyamine or polyimide polyimide in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2483/00—Presence of polysiloxane
    • C09J2483/006—Presence of polysiloxane in the substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)
KR1020037011642A 2001-03-07 2002-02-05 티오에테르기를 포함하는 접착제 및 접착제 조성물 Expired - Fee Related KR100933964B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/801,234 US6800371B2 (en) 2001-03-07 2001-03-07 Adhesives and adhesive compositions containing thioether groups
US09/801,234 2001-03-07
PCT/US2002/003471 WO2002072725A1 (en) 2001-03-07 2002-02-05 Adhesives and adhesive compositions containing thioether groups

Publications (2)

Publication Number Publication Date
KR20040030526A KR20040030526A (ko) 2004-04-09
KR100933964B1 true KR100933964B1 (ko) 2009-12-28

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020037011642A Expired - Fee Related KR100933964B1 (ko) 2001-03-07 2002-02-05 티오에테르기를 포함하는 접착제 및 접착제 조성물

Country Status (9)

Country Link
US (1) US6800371B2 (enExample)
EP (1) EP1366130B1 (enExample)
JP (1) JP4481568B2 (enExample)
KR (1) KR100933964B1 (enExample)
AT (1) ATE301174T1 (enExample)
DE (1) DE60205342T2 (enExample)
MX (1) MXPA03007929A (enExample)
MY (1) MY128233A (enExample)
WO (1) WO2002072725A1 (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050010003A1 (en) * 2003-07-11 2005-01-13 Prc-Desoto International, Inc. Epoxy-capped polythioethers
US7622548B2 (en) * 2003-07-11 2009-11-24 Prc Desoto International, Inc. Epoxy- or amine/hydroxy-capped polythioethers
US7183353B2 (en) * 2004-04-29 2007-02-27 Hewlett-Packard Development Company, L.P. UV curable coating composition
US20070236542A1 (en) * 2006-03-29 2007-10-11 Graham David C Adhesive Compositions, Micro-Fluid Ejection Devices, and Methods for Attaching Micro-Fluid Ejection Heads
US8623989B1 (en) 2006-05-05 2014-01-07 PRC De Soto International, Inc. Polyurea/polythiourea coatings
WO2007131145A1 (en) * 2006-05-05 2007-11-15 Ppg Industries Ohio, Inc. Compositions and articles prepared from thioether functional oligomeric polythiols
US7879955B2 (en) * 2007-05-01 2011-02-01 Rao Chandra B Compositions including a polythioether
WO2010005710A1 (en) * 2008-06-16 2010-01-14 3M Innovative Properties Company Toughened curable compositions
CN101971259B (zh) * 2009-01-13 2014-06-18 松下电器产业株式会社 信息记录装置、信息再生装置以及信息记录介质
US20110014354A1 (en) * 2009-07-20 2011-01-20 David Christopher Graham Adhesive compositions and methods for use in failure analysis
US20110318882A1 (en) 2010-06-24 2011-12-29 Xiaoming Wu Method of restricting chip movement upon bonding to rigid substrate using spray coatable adhesive
JP5960524B2 (ja) * 2012-07-03 2016-08-02 株式会社Adeka 含硫黄エポキシ化合物、該化合物を含有する樹脂組成物、及び、該樹脂組成物を含有する接着剤
JP2014012778A (ja) * 2012-07-05 2014-01-23 Adeka Corp 樹脂組成物及びそれを含有してなる接着剤
CN105934346B (zh) 2014-01-29 2017-09-08 惠普发展公司，有限责任合伙企业 流体引导组件
WO2017004492A1 (en) 2015-07-01 2017-01-05 3M Innovative Properties Company Pvp- and/or pvl-containing composite membranes and methods of use
CN107921370B (zh) 2015-07-01 2022-03-29 3M创新有限公司 聚合离聚物分离膜及其使用方法
US10478778B2 (en) 2015-07-01 2019-11-19 3M Innovative Properties Company Composite membranes with improved performance and/or durability and methods of use
TWI572675B (zh) * 2015-07-15 2017-03-01 臻鼎科技股份有限公司 聚醯亞胺組合物、聚醯亞胺膜及電路板
CN107621752B (zh) * 2016-07-13 2019-11-12 常州强力先端电子材料有限公司 一种混杂型光敏树脂及其制备方法
CN106497475B (zh) * 2016-10-28 2020-07-31 苏州太湖电工新材料股份有限公司 一种用于单面玻璃布补强少胶云母带的胶粘剂及其制备方法

Citations (1)

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WO2000079582A1 (en) * 1999-06-17 2000-12-28 Loctite Corporation Controllably degradable composition of heteroatom carbocyclic or epoxy resin and curing agent

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JPS55164254A (en) * 1979-06-06 1980-12-20 Dainippon Toryo Co Ltd Modified epoxy coating composition
US4521490A (en) 1983-08-11 1985-06-04 Minnesota Mining And Manufacturing Co. Two-part epoxy composition
US4816546A (en) 1987-06-23 1989-03-28 The Dow Chemical Company Mixed epoxy resins comprising sulfide containing aliphatic epoxy resins
AU602822B2 (en) 1988-10-05 1990-10-25 National Starch & Chemical Corporation Self fixturing structural adhesives
US5364914A (en) 1988-10-05 1994-11-15 Imperial Chemical Industries Plc Moulding composition comprising a thermoset component and thermoplast component
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WO2000079582A1 (en) * 1999-06-17 2000-12-28 Loctite Corporation Controllably degradable composition of heteroatom carbocyclic or epoxy resin and curing agent

Also Published As

Publication number Publication date
JP2004532299A (ja) 2004-10-21
EP1366130A1 (en) 2003-12-03
KR20040030526A (ko) 2004-04-09
JP4481568B2 (ja) 2010-06-16
MXPA03007929A (es) 2004-05-05
US6800371B2 (en) 2004-10-05
US20030017341A1 (en) 2003-01-23
EP1366130B1 (en) 2005-08-03
MY128233A (en) 2007-01-31
WO2002072725A1 (en) 2002-09-19
DE60205342T2 (de) 2006-06-01
ATE301174T1 (de) 2005-08-15
DE60205342D1 (de) 2005-09-08

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