ATE301174T1 - Klebstoffe und klebstoffzusammensetzungen, die thioethergruppen enthalten - Google Patents

Klebstoffe und klebstoffzusammensetzungen, die thioethergruppen enthalten

Info

Publication number
ATE301174T1
ATE301174T1 AT02717397T AT02717397T ATE301174T1 AT E301174 T1 ATE301174 T1 AT E301174T1 AT 02717397 T AT02717397 T AT 02717397T AT 02717397 T AT02717397 T AT 02717397T AT E301174 T1 ATE301174 T1 AT E301174T1
Authority
AT
Austria
Prior art keywords
adhesives
compositions containing
adhesive compositions
thioether groups
containing thioether
Prior art date
Application number
AT02717397T
Other languages
German (de)
English (en)
Inventor
Kathleen B Gross
Susan C Noe
Alphonsus V Pocius
William J Schultz
Wendy L Thompson
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Application granted granted Critical
Publication of ATE301174T1 publication Critical patent/ATE301174T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/302—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing sulfur
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials
    • C09J2400/16—Metal
    • C09J2400/163—Metal in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/20—Presence of organic materials
    • C09J2400/22—Presence of unspecified polymer
    • C09J2400/226—Presence of unspecified polymer in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2479/00—Presence of polyamine or polyimide
    • C09J2479/08—Presence of polyamine or polyimide polyimide
    • C09J2479/086—Presence of polyamine or polyimide polyimide in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2483/00—Presence of polysiloxane
    • C09J2483/006—Presence of polysiloxane in the substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)
AT02717397T 2001-03-07 2002-02-05 Klebstoffe und klebstoffzusammensetzungen, die thioethergruppen enthalten ATE301174T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/801,234 US6800371B2 (en) 2001-03-07 2001-03-07 Adhesives and adhesive compositions containing thioether groups
PCT/US2002/003471 WO2002072725A1 (en) 2001-03-07 2002-02-05 Adhesives and adhesive compositions containing thioether groups

Publications (1)

Publication Number Publication Date
ATE301174T1 true ATE301174T1 (de) 2005-08-15

Family

ID=25180543

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02717397T ATE301174T1 (de) 2001-03-07 2002-02-05 Klebstoffe und klebstoffzusammensetzungen, die thioethergruppen enthalten

Country Status (9)

Country Link
US (1) US6800371B2 (enExample)
EP (1) EP1366130B1 (enExample)
JP (1) JP4481568B2 (enExample)
KR (1) KR100933964B1 (enExample)
AT (1) ATE301174T1 (enExample)
DE (1) DE60205342T2 (enExample)
MX (1) MXPA03007929A (enExample)
MY (1) MY128233A (enExample)
WO (1) WO2002072725A1 (enExample)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7622548B2 (en) * 2003-07-11 2009-11-24 Prc Desoto International, Inc. Epoxy- or amine/hydroxy-capped polythioethers
US20050010003A1 (en) * 2003-07-11 2005-01-13 Prc-Desoto International, Inc. Epoxy-capped polythioethers
US7183353B2 (en) * 2004-04-29 2007-02-27 Hewlett-Packard Development Company, L.P. UV curable coating composition
US20070236542A1 (en) * 2006-03-29 2007-10-11 Graham David C Adhesive Compositions, Micro-Fluid Ejection Devices, and Methods for Attaching Micro-Fluid Ejection Heads
US7553925B2 (en) * 2006-05-05 2009-06-30 Ppg Industries Ohio, Inc. Thioether functional oligomeric polythiols and articles prepared therefrom
US8623989B1 (en) 2006-05-05 2014-01-07 PRC De Soto International, Inc. Polyurea/polythiourea coatings
US7879955B2 (en) * 2007-05-01 2011-02-01 Rao Chandra B Compositions including a polythioether
CN102112536B (zh) * 2008-06-16 2015-06-24 3M创新有限公司 增韧可固化组合物
EP2362394B1 (en) * 2009-01-13 2018-11-21 Panasonic Intellectual Property Management Co., Ltd. Information recording device, information reproducing device, and information recording medium
US20110014354A1 (en) * 2009-07-20 2011-01-20 David Christopher Graham Adhesive compositions and methods for use in failure analysis
US8785524B2 (en) 2010-06-24 2014-07-22 Funai Electric Co., Ltd. Spray coatable adhesive for bonding silicon dies to rigid substrates
JP5960524B2 (ja) * 2012-07-03 2016-08-02 株式会社Adeka 含硫黄エポキシ化合物、該化合物を含有する樹脂組成物、及び、該樹脂組成物を含有する接着剤
JP2014012778A (ja) * 2012-07-05 2014-01-23 Adeka Corp 樹脂組成物及びそれを含有してなる接着剤
EP3099496A4 (en) 2014-01-29 2017-12-13 Hewlett-Packard Development Company L.P. Fluid directing assembly
WO2017004495A1 (en) 2015-07-01 2017-01-05 3M Innovative Properties Company Composite membranes with improved performance and/or durability and methods of use
EP3316997A1 (en) 2015-07-01 2018-05-09 3M Innovative Properties Company Pvp- and/or pvl-containing composite membranes and methods of use
WO2017004496A1 (en) 2015-07-01 2017-01-05 3M Innovative Properties Company Polymeric ionomer separation membranes and methods of use
TWI572675B (zh) * 2015-07-15 2017-03-01 臻鼎科技股份有限公司 聚醯亞胺組合物、聚醯亞胺膜及電路板
CN107621752B (zh) 2016-07-13 2019-11-12 常州强力先端电子材料有限公司 一种混杂型光敏树脂及其制备方法
CN111925741B (zh) * 2016-10-28 2021-11-09 苏州太湖电工新材料股份有限公司 一种单面玻璃布补强少胶云母带及线棒
US11453743B2 (en) * 2020-06-05 2022-09-27 Chanda Chemical Corp. Thermoset epoxy resin, its preparing composition and making process thereof

Family Cites Families (17)

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BE528443A (enExample) 1953-04-29
NL7000025A (enExample) 1969-01-08 1970-07-10
JPS55164254A (en) * 1979-06-06 1980-12-20 Dainippon Toryo Co Ltd Modified epoxy coating composition
US4521490A (en) 1983-08-11 1985-06-04 Minnesota Mining And Manufacturing Co. Two-part epoxy composition
US4816546A (en) 1987-06-23 1989-03-28 The Dow Chemical Company Mixed epoxy resins comprising sulfide containing aliphatic epoxy resins
US5364914A (en) 1988-10-05 1994-11-15 Imperial Chemical Industries Plc Moulding composition comprising a thermoset component and thermoplast component
AU602822B2 (en) 1988-10-05 1990-10-25 National Starch & Chemical Corporation Self fixturing structural adhesives
US5225486A (en) * 1989-08-31 1993-07-06 Amoco Corporation Epoxy resins containing epoxidized polybutenes
JPH04175376A (ja) * 1990-11-08 1992-06-23 Nippon Oil & Fats Co Ltd 熱硬化性組成物
US5405731A (en) * 1992-12-22 1995-04-11 E. I. Du Pont De Nemours And Company Aqueous processable, multilayer, photoimageable permanent coatings for printed circuits
JPH07179564A (ja) * 1993-12-24 1995-07-18 Nippon Steel Chem Co Ltd 低粘度結晶性エポキシ樹脂の製造方法
US5993909A (en) 1995-06-06 1999-11-30 Nof Corporation Thermosetting compositions, methods of coating and coated articles
US6180200B1 (en) * 1998-06-01 2001-01-30 Dsm N. V. Cationic and hybrid radiation curable pressure sensitive adhesives for bonding of optical discs
JP2000026828A (ja) * 1998-07-13 2000-01-25 Sekisui Chem Co Ltd 接着剤組成物
JP2000303053A (ja) * 1999-04-23 2000-10-31 Sekisui Chem Co Ltd 接着剤組成物
JP2000303052A (ja) * 1999-04-23 2000-10-31 Sekisui Chem Co Ltd 接着剤組成物
KR100372211B1 (ko) 1999-06-17 2003-02-14 헨켈 록타이트 코오포레이션 조절가능하게 분해가능한 열경화성 수지 조성물, 상기 조성물을 사용하여 반도체 칩과 회로판 사이를 밀봉 언더필링하는 방법, 및 상기 조성물을 사용하여 제조한 전자 장치

Also Published As

Publication number Publication date
KR100933964B1 (ko) 2009-12-28
JP2004532299A (ja) 2004-10-21
EP1366130B1 (en) 2005-08-03
DE60205342D1 (de) 2005-09-08
DE60205342T2 (de) 2006-06-01
JP4481568B2 (ja) 2010-06-16
MY128233A (en) 2007-01-31
KR20040030526A (ko) 2004-04-09
MXPA03007929A (es) 2004-05-05
EP1366130A1 (en) 2003-12-03
US6800371B2 (en) 2004-10-05
US20030017341A1 (en) 2003-01-23
WO2002072725A1 (en) 2002-09-19

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