DE60329112D1 - Durch hydrosilylierung gehärtetes silikonharz mit hoher bruchzähigkeit - Google Patents

Durch hydrosilylierung gehärtetes silikonharz mit hoher bruchzähigkeit

Info

Publication number
DE60329112D1
DE60329112D1 DE60329112T DE60329112T DE60329112D1 DE 60329112 D1 DE60329112 D1 DE 60329112D1 DE 60329112 T DE60329112 T DE 60329112T DE 60329112 T DE60329112 T DE 60329112T DE 60329112 D1 DE60329112 D1 DE 60329112D1
Authority
DE
Germany
Prior art keywords
hydrosilylation
silicone resin
high toughness
resin hardened
curable composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60329112T
Other languages
English (en)
Inventor
Zhongtao Li
Frederick J Mcgarry
John R Keryk
Bizhong Zhu
Dimitris E Katsoulis
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Massachusetts Institute of Technology
Dow Silicones Corp
Original Assignee
Dow Corning Corp
Massachusetts Institute of Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Corp, Massachusetts Institute of Technology filed Critical Dow Corning Corp
Application granted granted Critical
Publication of DE60329112D1 publication Critical patent/DE60329112D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/10—Block- or graft-copolymers containing polysiloxane sequences
    • C08L83/12—Block- or graft-copolymers containing polysiloxane sequences containing polyether sequences
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/5403—Silicon-containing compounds containing no other elements than carbon or hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
DE60329112T 2002-03-05 2003-02-20 Durch hydrosilylierung gehärtetes silikonharz mit hoher bruchzähigkeit Expired - Lifetime DE60329112D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/092,055 US6689859B2 (en) 2002-03-05 2002-03-05 High fracture toughness hydrosilyation cured silicone resin
PCT/US2003/005357 WO2003076507A2 (en) 2002-03-05 2003-02-20 High fracture toughness hydrosilyation cured silicone resin

Publications (1)

Publication Number Publication Date
DE60329112D1 true DE60329112D1 (de) 2009-10-15

Family

ID=27804152

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60329112T Expired - Lifetime DE60329112D1 (de) 2002-03-05 2003-02-20 Durch hydrosilylierung gehärtetes silikonharz mit hoher bruchzähigkeit

Country Status (10)

Country Link
US (1) US6689859B2 (de)
EP (1) EP1543064B1 (de)
JP (1) JP4557553B2 (de)
KR (1) KR100961638B1 (de)
CN (1) CN1312195C (de)
AT (1) ATE441687T1 (de)
AU (1) AU2003213207A1 (de)
CA (1) CA2477970C (de)
DE (1) DE60329112D1 (de)
WO (1) WO2003076507A2 (de)

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US6310146B1 (en) * 1999-07-01 2001-10-30 Dow Corning Corporation Silsesquioxane resin with high strength and fracture toughness and method for the preparation thereof
US20020130444A1 (en) * 2001-03-15 2002-09-19 Gareth Hougham Post cure hardening of siloxane stamps for microcontact printing
US6646039B2 (en) * 2002-03-05 2003-11-11 Dow Corning Corporation Hydrosilyation cured silicone resin containing colloidal silica and a process for producing the same
US7037592B2 (en) 2003-02-25 2006-05-02 Dow Coming Corporation Hybrid composite of silicone and organic resins
KR101214825B1 (ko) 2004-11-19 2012-12-24 다우 코닝 코포레이션 실리콘 조성물 및 경화된 실리콘 수지
EP1819775B1 (de) * 2004-11-19 2008-09-24 Dow Corning Corporation Zusammensetzung aus organohydrogenpolysiloxanharz und silizium
ATE551398T1 (de) * 2005-02-16 2012-04-15 Dow Corning Verstärkte silikonharzfolie und herstellungsverfahren dafür
US8092910B2 (en) * 2005-02-16 2012-01-10 Dow Corning Toray Co., Ltd. Reinforced silicone resin film and method of preparing same
CN101238181B (zh) * 2005-08-04 2011-10-05 陶氏康宁公司 增强的有机硅树脂膜及其制备方法
JP2007063394A (ja) * 2005-08-31 2007-03-15 Asahi Kasei Corp かご状シルセスキオキサン重合体
JP5362363B2 (ja) 2005-12-21 2013-12-11 ダウ・コーニング・コーポレイション シリコーン樹脂フィルム、その調製方法、及びナノ材料充填シリコーン組成物
US8084532B2 (en) * 2006-01-19 2011-12-27 Dow Corning Corporation Silicone resin film, method of preparing same, and nanomaterial-filled silicone composition
US8084097B2 (en) * 2006-02-20 2011-12-27 Dow Corning Corporation Silicone resin film, method of preparing same, and nanomaterial-filled silicone composition
KR101358066B1 (ko) * 2006-04-11 2014-02-06 다우 코닝 코포레이션 열변형이 적은 실리콘 복합 모울드
EP2066757A1 (de) * 2006-10-05 2009-06-10 Dow Corning Corporation Silikonharzfolie und verfahren zu ihrer herstellung
WO2008097435A1 (en) * 2007-02-06 2008-08-14 Dow Corning Corporation Silicone resin, silicone composition, coated substrate, and reinforced silicone resin film
CN101636270B (zh) * 2007-02-22 2012-07-04 道康宁公司 增强硅树脂膜
JP5426402B2 (ja) * 2007-02-22 2014-02-26 ダウ コーニング コーポレーション 強化シリコーン樹脂フィルム
CN101631833B (zh) * 2007-02-22 2012-07-18 道康宁公司 增强硅树脂薄膜及其制备方法
KR20100014391A (ko) * 2007-02-22 2010-02-10 다우 코닝 코포레이션 강화 실리콘 수지 필름 및 이의 제조방법
KR20100017500A (ko) * 2007-05-01 2010-02-16 다우 코닝 코포레이션 나노물질-충전된 실리콘 조성물 및 강화 실리콘 수지 필름
JP5250025B2 (ja) * 2007-05-01 2013-07-31 ダウ・コーニング・コーポレイション 強化シリコーン樹脂フィルム
CN101848960A (zh) * 2007-10-12 2010-09-29 陶氏康宁公司 强化的硅酮树脂膜和纳米纤维填充的硅酮组合物
JP5485896B2 (ja) * 2007-10-12 2014-05-07 ダウ コーニング コーポレーション 酸化アルミニウム分散物およびこれを調製する方法
US20090171010A1 (en) * 2007-12-31 2009-07-02 John Kilgour Low temperature cure silicone release coatings containing branched silylhydrides
US20090171055A1 (en) * 2007-12-31 2009-07-02 John Kilgour Low temperature hydrosilylation catalyst and silicone release coatings
CN101544763B (zh) * 2008-03-24 2011-08-31 中国科学院化学研究所 一种改性硅树脂及其制备方法
US7919225B2 (en) * 2008-05-23 2011-04-05 International Business Machines Corporation Photopatternable dielectric materials for BEOL applications and methods for use
WO2010059710A1 (en) * 2008-11-19 2010-05-27 Dow Corning Corporation A silicone composition and a method for preparing the same
JP5793824B2 (ja) * 2009-06-02 2015-10-14 Jnc株式会社 有機ケイ素化合物、該有機ケイ素化合物を含む熱硬化性組成物、および光半導体用封止材料
CN104744705B (zh) * 2010-05-18 2017-09-08 捷恩智株式会社 液状有机硅化合物的制造方法、热硬化性树脂组成物及其使用
JP2012097225A (ja) * 2010-11-04 2012-05-24 Daicel Corp 硬化性樹脂組成物及び硬化物
WO2015194159A1 (ja) * 2014-06-20 2015-12-23 東レ・ダウコーニング株式会社 オルガノポリシロキサンおよびその製造方法
JP6741678B2 (ja) * 2015-03-20 2020-08-19 ダウ・東レ株式会社 オルガノポリシロキサン、その製造方法、および硬化性シリコーン組成物
CN112996841B (zh) 2018-08-17 2022-12-27 瓦克化学股份公司 可交联的有机硅氧烷组合物

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US4529789A (en) * 1984-03-23 1985-07-16 Dow Corning Corporation Liquid curable polyorganosiloxane compositions
US4686271A (en) * 1986-03-03 1987-08-11 Dow Corning Corporation Hydraulic silicone crumb
JP3408277B2 (ja) * 1993-03-10 2003-05-19 鐘淵化学工業株式会社 硬化性組成物
US5623030A (en) * 1994-12-01 1997-04-22 Kanegafuchi Kagaku Kogyo Kabushiki Kaisha Curable composition and process for producing molded articles using the same
JP3499393B2 (ja) * 1996-02-16 2004-02-23 鐘淵化学工業株式会社 ケイ素系化合物を主成分とする予備硬化物及びそれを用いた成形体の作製方法
DE69728846T2 (de) * 1996-12-31 2005-04-21 Dow Corning Verfahren zur Herstellung von Gummi-modifizierte feste Silikon-Harze und daraus hergestellte Komposite
US5747608A (en) * 1996-12-31 1998-05-05 Dow Corning Corporation Rubber-modified rigid silicone resins and composites produced therefrom
JP3635179B2 (ja) * 1997-02-24 2005-04-06 ダウ コーニング アジア株式会社 シリル化ポリメチルシルセスキオキサン、その製造方法、それを用いた組成物
JPH1192563A (ja) * 1997-09-25 1999-04-06 Kanegafuchi Chem Ind Co Ltd 硬化性組成物及びそれを用いた成形体の作製方法
US6310146B1 (en) * 1999-07-01 2001-10-30 Dow Corning Corporation Silsesquioxane resin with high strength and fracture toughness and method for the preparation thereof
JP2001089662A (ja) * 1999-09-22 2001-04-03 Kanegafuchi Chem Ind Co Ltd 硬化性組成物及びそれを用いた成形体の作製方法
JP3757264B2 (ja) * 2001-03-27 2006-03-22 独立行政法人産業技術総合研究所 シルセスキオキサン系ポリマー成形体及びその製造方法
US6509423B1 (en) * 2001-08-21 2003-01-21 Dow Corning Corporation Silicone composition and cured silicone product
US6646039B2 (en) * 2002-03-05 2003-11-11 Dow Corning Corporation Hydrosilyation cured silicone resin containing colloidal silica and a process for producing the same

Also Published As

Publication number Publication date
ATE441687T1 (de) 2009-09-15
AU2003213207A1 (en) 2003-09-22
CN1312195C (zh) 2007-04-25
JP2005529986A (ja) 2005-10-06
CA2477970C (en) 2011-06-07
AU2003213207A8 (en) 2003-09-22
EP1543064A2 (de) 2005-06-22
KR100961638B1 (ko) 2010-06-09
KR20050002838A (ko) 2005-01-10
CN1656150A (zh) 2005-08-17
US20030171486A1 (en) 2003-09-11
CA2477970A1 (en) 2003-09-18
JP4557553B2 (ja) 2010-10-06
WO2003076507A2 (en) 2003-09-18
WO2003076507A3 (en) 2005-03-24
US6689859B2 (en) 2004-02-10
EP1543064B1 (de) 2009-09-02
EP1543064A4 (de) 2005-07-20

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