JP4557553B2 - 高破壊靱性のヒドロシリル化反応硬化性シリコーン樹脂 - Google Patents
高破壊靱性のヒドロシリル化反応硬化性シリコーン樹脂 Download PDFInfo
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- JP4557553B2 JP4557553B2 JP2003574719A JP2003574719A JP4557553B2 JP 4557553 B2 JP4557553 B2 JP 4557553B2 JP 2003574719 A JP2003574719 A JP 2003574719A JP 2003574719 A JP2003574719 A JP 2003574719A JP 4557553 B2 JP4557553 B2 JP 4557553B2
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- hydrosilylation reaction
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/10—Block- or graft-copolymers containing polysiloxane sequences
- C08L83/12—Block- or graft-copolymers containing polysiloxane sequences containing polyether sequences
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/5403—Silicon-containing compounds containing no other elements than carbon or hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
- C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Silicon Polymers (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- Materials Applied To Surfaces To Minimize Adherence Of Mist Or Water (AREA)
Description
a)シルセスキオキサン重合体を準備する工程と、
b)架橋化合物としての70モル%のジフェニルシランと30モル%のヘキサメチルトリシロキサンとの混合物を準備する工程と、
c)a)およびb)の成分を混合して硬化性組成物を形成する工程と、
d)ヒドロシリル化反応触媒を、工程c)の硬化性組成物に添加する工程と、
e)反応触媒と硬化性組成物とを混合する前または後に、任意の反応抑制剤を工程d)の触媒に添加する工程と、
f)工程e)の硬化性組成物を硬化させて、硬化樹脂を形成する工程とを含み、
前記シルセスキオキサン重合体は、実験式R 1 a R 2 b R 3 c SiO (4-a-b-c)/2 を有する共重合体樹脂を含み、ここで、0.8≦(a+b+c)≦3.0という条件において、aは0または正の数であり、bは0または正の数であり、cは0または正の数であり、成分a)は、1分子あたり平均で少なくとも2つのR 1 基を有し、各R 1 基は、脂肪族不飽和を有する1価の炭化水素基から個別に選択される官能基であり、各R 2 基およびR 3 基は、1価の炭化水素基および水素原子から個別に選択される官能基である。
KlC=(P/(BW1/2))f(x)
Claims (7)
- ヒドロシリル化反応硬化性組成物であって、
a)シルセスキオキサン重合体と、
b)70モル%のジフェニルシランと30モル%のヘキサメチルトリシロキサンとの混合物である架橋化合物と、
c)ヒドロシリル化反応触媒とを含み、
前記シルセスキオキサン重合体は、実験式R 1 a R 2 b R 3 c SiO (4-a-b-c)/2 を有する共重合体樹脂を含み、ここで、0.8≦(a+b+c)≦3.0という条件において、aは0または正の数であり、bは0または正の数であり、cは0または正の数であり、成分a)は、1分子あたり平均で少なくとも2つのR 1 基を有し、各R 1 基は、脂肪族不飽和を有する1価の炭化水素基から個別に選択される官能基であり、各R 2 基およびR 3 基は、1価の炭化水素基および水素原子から個別に選択される官能基であり、
硬化組成物は、混合物の各架橋化合物のいずれかを単独で用いて形成した硬化組成物の破壊靱性よりも高い破壊靱性を示す。 - 前記シルセスキオキサン重合体は、(PhSiO3/2)0.75(ViMe2SiO1/2)0.25を含み、ここで、Phはフェニル基であり、Viはビニル基を表し、Meはメチル基を表す、請求項1に記載のヒドロシリル化反応硬化性組成物。
- 反応抑制剤をさらに含む、請求項1に記載のヒドロシリル化反応硬化性組成物。
- 硬化シルセスキオキサン樹脂を調製する方法であって、
a)シルセスキオキサン重合体を準備する工程と、
b)架橋化合物としての70モル%のジフェニルシランと30モル%のヘキサメチルトリシロキサンとの混合物を準備する工程と、
c)a)およびb)の成分を混合して硬化性組成物を形成する工程と、
d)ヒドロシリル化反応触媒を、工程c)の硬化性組成物に添加する工程と、
e)工程d)の硬化性組成物を硬化させ、硬化樹脂を形成する工程とを含み、
前記シルセスキオキサン重合体は、実験式R 1 a R 2 b R 3 c SiO (4-a-b-c)/2 を有する共重合体樹脂を含み、ここで、0.8≦(a+b+c)≦3.0という条件において、aは0または正の数であり、bは0または正の数であり、cは0または正の数であり、成分a)は、1分子あたり平均で少なくとも2つのR 1 基を有し、各R 1 基は、脂肪族不飽和を有する1価の炭化水素基から個別に選択される官能基であり、各R 2 基およびR 3 基は、1価の炭化水素基および水素原子から個別に選択される官能基である、
方法。 - 前記硬化させる工程は、1)金型内の硬化性組成物を85℃で24時間硬化させる工程と、2)前記金型内の硬化性組成物を150℃で24時間硬化させる工程と、3)前記金型内の硬化性組成物を200℃で24時間硬化させる工程とを含む、請求項4に記載の方法。
- 前記シルセスキオキサン重合体は、(PhSiO3/2)0.75(ViMe2SiO1/2)0.25を含み、ここで、Phはフェニル基であり、Viはビニル基を表し、Meはメチル基を表す、請求項4に記載の方法。
- 反応抑制剤を添加する工程をさらに含む、請求項4に記載の方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/092,055 US6689859B2 (en) | 2002-03-05 | 2002-03-05 | High fracture toughness hydrosilyation cured silicone resin |
PCT/US2003/005357 WO2003076507A2 (en) | 2002-03-05 | 2003-02-20 | High fracture toughness hydrosilyation cured silicone resin |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005529986A JP2005529986A (ja) | 2005-10-06 |
JP4557553B2 true JP4557553B2 (ja) | 2010-10-06 |
Family
ID=27804152
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003574719A Expired - Fee Related JP4557553B2 (ja) | 2002-03-05 | 2003-02-20 | 高破壊靱性のヒドロシリル化反応硬化性シリコーン樹脂 |
Country Status (10)
Country | Link |
---|---|
US (1) | US6689859B2 (ja) |
EP (1) | EP1543064B1 (ja) |
JP (1) | JP4557553B2 (ja) |
KR (1) | KR100961638B1 (ja) |
CN (1) | CN1312195C (ja) |
AT (1) | ATE441687T1 (ja) |
AU (1) | AU2003213207A1 (ja) |
CA (1) | CA2477970C (ja) |
DE (1) | DE60329112D1 (ja) |
WO (1) | WO2003076507A2 (ja) |
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US20020130444A1 (en) * | 2001-03-15 | 2002-09-19 | Gareth Hougham | Post cure hardening of siloxane stamps for microcontact printing |
US6646039B2 (en) * | 2002-03-05 | 2003-11-11 | Dow Corning Corporation | Hydrosilyation cured silicone resin containing colloidal silica and a process for producing the same |
US7037592B2 (en) * | 2003-02-25 | 2006-05-02 | Dow Coming Corporation | Hybrid composite of silicone and organic resins |
WO2006055231A1 (en) * | 2004-11-19 | 2006-05-26 | Dow Corning Corporation | Silicone composition and cured silicone resin |
US8008420B2 (en) * | 2004-11-19 | 2011-08-30 | Dow Corning Corporation | Organohydrogenpolysiloxane resin and silicone composition |
US8092910B2 (en) * | 2005-02-16 | 2012-01-10 | Dow Corning Toray Co., Ltd. | Reinforced silicone resin film and method of preparing same |
CN101120054B (zh) * | 2005-02-16 | 2013-01-09 | 陶氏康宁公司 | 增强的有机硅树脂膜及其制备方法 |
EP1910471B1 (en) * | 2005-08-04 | 2012-06-06 | Dow Corning Corporation | Reinforced silicone resin film and method of preparing same |
JP2007063394A (ja) * | 2005-08-31 | 2007-03-15 | Asahi Kasei Corp | かご状シルセスキオキサン重合体 |
EP1969065B1 (en) | 2005-12-21 | 2011-07-27 | Dow Corning Corporation | Silicone resin film, method of preparing same, and nanomaterial-filled silicone composition |
EP1973964B1 (en) * | 2006-01-19 | 2011-07-06 | Dow Corning Corporation | Silicone resin film, method of preparing same, and nanomaterial-filled silicone compositon |
WO2007097835A2 (en) * | 2006-02-20 | 2007-08-30 | Dow Corning Corporation | Silicone resin film, method of preparing same, and nanomaterial-filled silicone composition |
KR101358066B1 (ko) * | 2006-04-11 | 2014-02-06 | 다우 코닝 코포레이션 | 열변형이 적은 실리콘 복합 모울드 |
CN101522838B (zh) * | 2006-10-05 | 2012-07-04 | 陶氏康宁公司 | 有机硅树脂膜及其制备方法 |
KR20090107529A (ko) * | 2007-02-06 | 2009-10-13 | 다우 코닝 코포레이션 | 실리콘 수지, 실리콘 조성물, 피복된 기판 및 강화 실리콘 수지 필름 |
JP5377334B2 (ja) * | 2007-02-22 | 2013-12-25 | ダウ コーニング コーポレーション | 強化シリコーン樹脂フィルム |
WO2008103228A1 (en) * | 2007-02-22 | 2008-08-28 | Dow Corning Corporation | Reinforced silicone resin films |
US20100087581A1 (en) * | 2007-02-22 | 2010-04-08 | Mark Fisher | Reinforced Silicone Resin Film and Method of Preparing Same |
CN101627096B (zh) * | 2007-02-22 | 2012-11-07 | 道康宁公司 | 增强硅树脂膜及其制备方法 |
EP2142589A2 (en) * | 2007-05-01 | 2010-01-13 | Dow Corning Corporation | Reinforced silicone resin film |
JP5269885B2 (ja) * | 2007-05-01 | 2013-08-21 | ダウ・コーニング・コーポレイション | ナノ材料充填シリコーン組成物及び強化シリコーン樹脂フィルム |
WO2009051905A2 (en) * | 2007-10-12 | 2009-04-23 | Dow Corning Corporation | Aluminum oxide dispersion and method of preparing same |
EP2201063B1 (en) * | 2007-10-12 | 2011-07-06 | Dow Corning Corporation | Reinforced silicone resin film and nanofiber-filled silicone composition |
US20090171055A1 (en) * | 2007-12-31 | 2009-07-02 | John Kilgour | Low temperature hydrosilylation catalyst and silicone release coatings |
US20090171010A1 (en) * | 2007-12-31 | 2009-07-02 | John Kilgour | Low temperature cure silicone release coatings containing branched silylhydrides |
CN101544763B (zh) * | 2008-03-24 | 2011-08-31 | 中国科学院化学研究所 | 一种改性硅树脂及其制备方法 |
US7919225B2 (en) * | 2008-05-23 | 2011-04-05 | International Business Machines Corporation | Photopatternable dielectric materials for BEOL applications and methods for use |
WO2010059710A1 (en) * | 2008-11-19 | 2010-05-27 | Dow Corning Corporation | A silicone composition and a method for preparing the same |
JP5793824B2 (ja) * | 2009-06-02 | 2015-10-14 | Jnc株式会社 | 有機ケイ素化合物、該有機ケイ素化合物を含む熱硬化性組成物、および光半導体用封止材料 |
CN102892812B (zh) * | 2010-05-18 | 2017-02-08 | 捷恩智株式会社 | 液状有机硅化合物、热硬化性树脂组成物及其使用 |
JP2012097225A (ja) * | 2010-11-04 | 2012-05-24 | Daicel Corp | 硬化性樹脂組成物及び硬化物 |
WO2015194159A1 (ja) * | 2014-06-20 | 2015-12-23 | 東レ・ダウコーニング株式会社 | オルガノポリシロキサンおよびその製造方法 |
US10316148B2 (en) | 2015-03-20 | 2019-06-11 | Dow Toray Co., Ltd. | Organopolysiloxane, production method thereof, and curable silicone composition |
CN112996841B (zh) | 2018-08-17 | 2022-12-27 | 瓦克化学股份公司 | 可交联的有机硅氧烷组合物 |
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US6646039B2 (en) * | 2002-03-05 | 2003-11-11 | Dow Corning Corporation | Hydrosilyation cured silicone resin containing colloidal silica and a process for producing the same |
-
2002
- 2002-03-05 US US10/092,055 patent/US6689859B2/en not_active Expired - Fee Related
-
2003
- 2003-02-20 AU AU2003213207A patent/AU2003213207A1/en not_active Abandoned
- 2003-02-20 WO PCT/US2003/005357 patent/WO2003076507A2/en active Application Filing
- 2003-02-20 DE DE60329112T patent/DE60329112D1/de not_active Expired - Lifetime
- 2003-02-20 KR KR1020047013744A patent/KR100961638B1/ko not_active IP Right Cessation
- 2003-02-20 CN CNB038061473A patent/CN1312195C/zh not_active Expired - Fee Related
- 2003-02-20 JP JP2003574719A patent/JP4557553B2/ja not_active Expired - Fee Related
- 2003-02-20 AT AT03709253T patent/ATE441687T1/de not_active IP Right Cessation
- 2003-02-20 CA CA2477970A patent/CA2477970C/en not_active Expired - Fee Related
- 2003-02-20 EP EP03709253A patent/EP1543064B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE60329112D1 (de) | 2009-10-15 |
EP1543064A2 (en) | 2005-06-22 |
US20030171486A1 (en) | 2003-09-11 |
CA2477970A1 (en) | 2003-09-18 |
KR100961638B1 (ko) | 2010-06-09 |
AU2003213207A1 (en) | 2003-09-22 |
US6689859B2 (en) | 2004-02-10 |
WO2003076507A2 (en) | 2003-09-18 |
ATE441687T1 (de) | 2009-09-15 |
CA2477970C (en) | 2011-06-07 |
CN1656150A (zh) | 2005-08-17 |
EP1543064A4 (en) | 2005-07-20 |
CN1312195C (zh) | 2007-04-25 |
AU2003213207A8 (en) | 2003-09-22 |
WO2003076507A3 (en) | 2005-03-24 |
JP2005529986A (ja) | 2005-10-06 |
EP1543064B1 (en) | 2009-09-02 |
KR20050002838A (ko) | 2005-01-10 |
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