MXPA03007929A - Adhesivos y composiciones adhesivas que contienen grupos tioeter. - Google Patents

Adhesivos y composiciones adhesivas que contienen grupos tioeter.

Info

Publication number
MXPA03007929A
MXPA03007929A MXPA03007929A MXPA03007929A MXPA03007929A MX PA03007929 A MXPA03007929 A MX PA03007929A MX PA03007929 A MXPA03007929 A MX PA03007929A MX PA03007929 A MXPA03007929 A MX PA03007929A MX PA03007929 A MXPA03007929 A MX PA03007929A
Authority
MX
Mexico
Prior art keywords
adhesives
compositions containing
adhesive compositions
thioether groups
containing thioether
Prior art date
Application number
MXPA03007929A
Other languages
English (en)
Inventor
V Pocius Alphonsus
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of MXPA03007929A publication Critical patent/MXPA03007929A/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/302—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing sulfur
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials
    • C09J2400/16—Metal
    • C09J2400/163—Metal in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/20—Presence of organic materials
    • C09J2400/22—Presence of unspecified polymer
    • C09J2400/226—Presence of unspecified polymer in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2479/00—Presence of polyamine or polyimide
    • C09J2479/08—Presence of polyamine or polyimide polyimide
    • C09J2479/086—Presence of polyamine or polyimide polyimide in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2483/00—Presence of polysiloxane
    • C09J2483/006—Presence of polysiloxane in the substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)

Abstract

En un aspecto, la invencion proporciona una composicion curable que comprende una mezcla de resina epoxi, catalizador y un compuesto que contiene tioeter reactivo con epoxi y los adhesivos resultantes. Los adhesivos resultantes son resistentes al agua y/o los solventes y se pegan a plasticos tales como ABS, policarbonato y PMMA; poliimida; metales nobles tales como oro y paladio y materiales que contienen silicio tales como molde de oblea de silicio y dioxido de silicio.
MXPA03007929A 2001-03-07 2002-02-05 Adhesivos y composiciones adhesivas que contienen grupos tioeter. MXPA03007929A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/801,234 US6800371B2 (en) 2001-03-07 2001-03-07 Adhesives and adhesive compositions containing thioether groups
PCT/US2002/003471 WO2002072725A1 (en) 2001-03-07 2002-02-05 Adhesives and adhesive compositions containing thioether groups

Publications (1)

Publication Number Publication Date
MXPA03007929A true MXPA03007929A (es) 2004-05-05

Family

ID=25180543

Family Applications (1)

Application Number Title Priority Date Filing Date
MXPA03007929A MXPA03007929A (es) 2001-03-07 2002-02-05 Adhesivos y composiciones adhesivas que contienen grupos tioeter.

Country Status (9)

Country Link
US (1) US6800371B2 (es)
EP (1) EP1366130B1 (es)
JP (1) JP4481568B2 (es)
KR (1) KR100933964B1 (es)
AT (1) ATE301174T1 (es)
DE (1) DE60205342T2 (es)
MX (1) MXPA03007929A (es)
MY (1) MY128233A (es)
WO (1) WO2002072725A1 (es)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050010003A1 (en) * 2003-07-11 2005-01-13 Prc-Desoto International, Inc. Epoxy-capped polythioethers
US7622548B2 (en) * 2003-07-11 2009-11-24 Prc Desoto International, Inc. Epoxy- or amine/hydroxy-capped polythioethers
US7183353B2 (en) * 2004-04-29 2007-02-27 Hewlett-Packard Development Company, L.P. UV curable coating composition
US20070236542A1 (en) * 2006-03-29 2007-10-11 Graham David C Adhesive Compositions, Micro-Fluid Ejection Devices, and Methods for Attaching Micro-Fluid Ejection Heads
US8623989B1 (en) 2006-05-05 2014-01-07 PRC De Soto International, Inc. Polyurea/polythiourea coatings
US7696296B2 (en) * 2006-05-05 2010-04-13 Ppg Industries Ohio, Inc. Compositions and articles prepared from the thioether functional oligomeric polythiols
US7879955B2 (en) * 2007-05-01 2011-02-01 Rao Chandra B Compositions including a polythioether
JP2011525207A (ja) * 2008-06-16 2011-09-15 スリーエム イノベイティブ プロパティズ カンパニー 強化硬化性組成物
CN101971259B (zh) * 2009-01-13 2014-06-18 松下电器产业株式会社 信息记录装置、信息再生装置以及信息记录介质
US20110014354A1 (en) * 2009-07-20 2011-01-20 David Christopher Graham Adhesive compositions and methods for use in failure analysis
US8785524B2 (en) 2010-06-24 2014-07-22 Funai Electric Co., Ltd. Spray coatable adhesive for bonding silicon dies to rigid substrates
JP5960524B2 (ja) * 2012-07-03 2016-08-02 株式会社Adeka 含硫黄エポキシ化合物、該化合物を含有する樹脂組成物、及び、該樹脂組成物を含有する接着剤
JP2014012778A (ja) * 2012-07-05 2014-01-23 Adeka Corp 樹脂組成物及びそれを含有してなる接着剤
US9707766B2 (en) 2014-01-29 2017-07-18 Hewlett-Packard Development Company, L.P. Fluid directing assembly
EP3316999A1 (en) 2015-07-01 2018-05-09 3M Innovative Properties Company Polymeric ionomer separation membranes and methods of use
JP6838819B2 (ja) 2015-07-01 2021-03-03 スリーエム イノベイティブ プロパティズ カンパニー 向上した性能及び／又は耐久性を有する複合膜並びに使用方法
CN107735163B (zh) 2015-07-01 2021-02-23 3M创新有限公司 含pvp和/或pvl的复合膜以及使用方法
TWI572675B (zh) * 2015-07-15 2017-03-01 臻鼎科技股份有限公司 聚醯亞胺組合物、聚醯亞胺膜及電路板
CN107621752B (zh) * 2016-07-13 2019-11-12 常州强力先端电子材料有限公司 一种混杂型光敏树脂及其制备方法
CN111925741B (zh) * 2016-10-28 2021-11-09 苏州太湖电工新材料股份有限公司 一种单面玻璃布补强少胶云母带及线棒

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE528443A (es) 1953-04-29
NL7000025A (es) 1969-01-08 1970-07-10
JPS55164254A (en) * 1979-06-06 1980-12-20 Dainippon Toryo Co Ltd Modified epoxy coating composition
US4521490A (en) 1983-08-11 1985-06-04 Minnesota Mining And Manufacturing Co. Two-part epoxy composition
US4816546A (en) 1987-06-23 1989-03-28 The Dow Chemical Company Mixed epoxy resins comprising sulfide containing aliphatic epoxy resins
AU602822B2 (en) 1988-10-05 1990-10-25 National Starch & Chemical Corporation Self fixturing structural adhesives
US5364914A (en) 1988-10-05 1994-11-15 Imperial Chemical Industries Plc Moulding composition comprising a thermoset component and thermoplast component
US5225486A (en) * 1989-08-31 1993-07-06 Amoco Corporation Epoxy resins containing epoxidized polybutenes
JPH04175376A (ja) * 1990-11-08 1992-06-23 Nippon Oil & Fats Co Ltd 熱硬化性組成物
US5405731A (en) * 1992-12-22 1995-04-11 E. I. Du Pont De Nemours And Company Aqueous processable, multilayer, photoimageable permanent coatings for printed circuits
JPH07179564A (ja) * 1993-12-24 1995-07-18 Nippon Steel Chem Co Ltd 低粘度結晶性エポキシ樹脂の製造方法
WO1996039454A1 (fr) 1995-06-06 1996-12-12 Nof Corporation Composition thermodurcissable, procede de finition d'un revetement et articles en etant revetus
US6180200B1 (en) * 1998-06-01 2001-01-30 Dsm N. V. Cationic and hybrid radiation curable pressure sensitive adhesives for bonding of optical discs
JP2000026828A (ja) * 1998-07-13 2000-01-25 Sekisui Chem Co Ltd 接着剤組成物
JP2000303053A (ja) * 1999-04-23 2000-10-31 Sekisui Chem Co Ltd 接着剤組成物
JP2000303052A (ja) * 1999-04-23 2000-10-31 Sekisui Chem Co Ltd 接着剤組成物
JP4718070B2 (ja) 1999-06-17 2011-07-06 ヘンケル コーポレイション アンダーフィル封止および補修方法

Also Published As

Publication number Publication date
ATE301174T1 (de) 2005-08-15
MY128233A (en) 2007-01-31
KR100933964B1 (ko) 2009-12-28
DE60205342T2 (de) 2006-06-01
WO2002072725A1 (en) 2002-09-19
JP4481568B2 (ja) 2010-06-16
EP1366130B1 (en) 2005-08-03
US20030017341A1 (en) 2003-01-23
JP2004532299A (ja) 2004-10-21
US6800371B2 (en) 2004-10-05
EP1366130A1 (en) 2003-12-03
DE60205342D1 (de) 2005-09-08
KR20040030526A (ko) 2004-04-09

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