ATE277123T1 - Härtbare zusammensetzung - Google Patents

Härtbare zusammensetzung

Info

Publication number
ATE277123T1
ATE277123T1 AT01109322T AT01109322T ATE277123T1 AT E277123 T1 ATE277123 T1 AT E277123T1 AT 01109322 T AT01109322 T AT 01109322T AT 01109322 T AT01109322 T AT 01109322T AT E277123 T1 ATE277123 T1 AT E277123T1
Authority
AT
Austria
Prior art keywords
weight
parts
epoxy resin
curdable
composition
Prior art date
Application number
AT01109322T
Other languages
English (en)
Inventor
Katsuhiro Ando
Fumio Kawakubo
Junji Takase
Original Assignee
Kaneka Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaneka Corp filed Critical Kaneka Corp
Application granted granted Critical
Publication of ATE277123T1 publication Critical patent/ATE277123T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/02—Polyalkylene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/32—Polymers modified by chemical after-treatment
    • C08G65/329—Polymers modified by chemical after-treatment with organic compounds
    • C08G65/336—Polymers modified by chemical after-treatment with organic compounds containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
AT01109322T 2000-04-14 2001-04-12 Härtbare zusammensetzung ATE277123T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000113142 2000-04-14
JP2000273303A JP4520003B2 (ja) 2000-04-14 2000-09-08 硬化性組成物

Publications (1)

Publication Number Publication Date
ATE277123T1 true ATE277123T1 (de) 2004-10-15

Family

ID=26590118

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01109322T ATE277123T1 (de) 2000-04-14 2001-04-12 Härtbare zusammensetzung

Country Status (5)

Country Link
US (1) US6624260B2 (de)
EP (1) EP1146084B1 (de)
JP (1) JP4520003B2 (de)
AT (1) ATE277123T1 (de)
DE (1) DE60105682T2 (de)

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* Cited by examiner, † Cited by third party
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JP4800495B2 (ja) * 2001-02-13 2011-10-26 株式会社カネカ 硬化性組成物
JP4752131B2 (ja) * 2001-05-16 2011-08-17 味の素株式会社 エポキシ樹脂用潜在性硬化剤及び硬化性エポキシ樹脂組成物
JP4101632B2 (ja) * 2002-11-01 2008-06-18 株式会社カネカ 硬化性組成物および復元性、クリープ性改善方法
JP4723179B2 (ja) * 2002-11-27 2011-07-13 セメダイン株式会社 ゲル組成物
WO2004099318A1 (ja) * 2003-05-12 2004-11-18 Kaneka Corporation 硬化性組成物
US8003744B2 (en) * 2003-08-25 2011-08-23 Kaneka Corporation Curing composition with improved heat resistance
DE10355318A1 (de) * 2003-11-27 2005-06-23 Wacker-Chemie Gmbh Verfahren zur Herstellung von organyloxysilylterminierten Polymeren
EP1695989B1 (de) * 2003-12-18 2007-09-26 Kaneka Corporation Härtbare zusammensetzung
JP5068997B2 (ja) * 2004-04-01 2012-11-07 株式会社カネカ 一液型硬化性組成物
JP5112688B2 (ja) * 2004-04-01 2013-01-09 株式会社カネカ 硬化性組成物
JP5081448B2 (ja) * 2004-06-09 2012-11-28 株式会社カネカ 硬化性組成物
US20060052822A1 (en) * 2004-08-31 2006-03-09 Mirizzi Michael S Apparatus and material composition for permanent occlusion of a hollow anatomical structure
US7781525B2 (en) * 2004-12-28 2010-08-24 Kaneka Corporation Curable composition
US8759435B2 (en) * 2005-04-15 2014-06-24 Kaneka Corporation Curable composition and cured article excellent in transparency
EP2366733B1 (de) * 2005-09-30 2014-10-22 Kaneka Corporation Härtbare Zusammensetzung, mit verbesserter Härtbarkeit und Lagerungsstabilität
US20070293603A1 (en) * 2006-06-19 2007-12-20 Ashland Licensing And Intellectual Property Llc Epoxy adhesive composition and use thereof
KR100838346B1 (ko) 2006-09-07 2008-06-13 헨켈코리아 유한회사 고강성 접착 조성물
CN102408542B (zh) * 2006-11-15 2014-10-29 日立化成工业株式会社 光反射用热固化性树脂组合物、及使用了所述树脂组合物的光半导体元件搭载用基板及光半导体装置
DE102006055739A1 (de) * 2006-11-25 2008-05-29 Bayer Materialscience Ag Abformmassen
WO2009067113A1 (en) * 2007-11-20 2009-05-28 Henkel Ag & Co. Kgaa Low-voiding die attach film, semiconductor package, and processes for making and using same
US20100279469A1 (en) * 2007-11-20 2010-11-04 Hwail Jin Low-Voiding Die Attach Film, Semiconductor Package, and Processes for Making and Using Same
JP5774322B2 (ja) * 2011-01-28 2015-09-09 リンテック株式会社 半導体用接着剤組成物、半導体用接着シートおよび半導体装置の製造方法
EP2570450A1 (de) * 2011-09-14 2013-03-20 Sika Technology AG Formgedächtnis-Material auf Basis eines Strukturklebstoffs
CN104718255A (zh) * 2012-10-19 2015-06-17 陶氏环球技术有限公司 硅烷改性聚合物、环氧树脂与固化催化剂的组合物以及包含所述组合物的聚合物混凝土
CN105143307B (zh) 2013-03-26 2017-02-15 三菱瓦斯化学株式会社 活性能量射线固化性树脂以及包含该树脂的固化物的气体阻隔性层叠体
EP3002314A1 (de) * 2014-10-01 2016-04-06 Sika Technology AG Zweikomponentige Zusammensetzung
US20180305596A1 (en) * 2015-11-26 2018-10-25 Evonik Degussa Gmbh Binder systems comprising epoxide compounds and prepolymers bearing alkoxysilyl groups, and use thereof
CN108017776A (zh) * 2017-12-26 2018-05-11 湖南神力铃胶粘剂制造有限公司 一种改性脂环胺固化剂及其制备方法
CN108219130B (zh) * 2018-03-29 2020-03-27 广州市嵩达新材料科技有限公司 一种六官能度的环氧丙烯酸树脂及其制备方法和应用
CN114667320A (zh) * 2019-11-15 2022-06-24 陶氏环球技术有限责任公司 一种可固化组合物及其应用方法
CN114641537A (zh) * 2019-11-15 2022-06-17 陶氏环球技术有限责任公司 可固化组合物及其粘合基材的方法
US20220389295A1 (en) * 2019-11-15 2022-12-08 Dow Global Technologies Llc A curable composition and a method for adhering substrates with the same
CN112048262A (zh) * 2020-09-13 2020-12-08 成都科成精化科技有限公司 一种锂电池铝塑膜胶粘剂的固化体系设计方法
CN115505241B (zh) * 2022-09-09 2023-07-18 浙江铂淳新材料股份有限公司 一种快干型3d打印胶水及其制备方法

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JPS61148225A (ja) * 1984-12-21 1986-07-05 Kanegafuchi Chem Ind Co Ltd 硬化性組成物
US4657986A (en) * 1984-12-26 1987-04-14 Kanegafuchi Chemical Industry Co., Ltd. Curable resinous composition comprising epoxy resin and silicon-containing elastomeric polymer
JPH0613600B2 (ja) * 1986-05-14 1994-02-23 旭電化工業株式会社 硬化性エポキシ樹脂組成物
JPH021789A (ja) * 1988-02-24 1990-01-08 Matsushita Electric Works Ltd 電気回路板
JPH02140220A (ja) * 1988-11-21 1990-05-29 Kanegafuchi Chem Ind Co Ltd 硬化性樹脂組成物
JP2813801B2 (ja) * 1989-02-01 1998-10-22 鐘淵化学工業株式会社 接着方法
WO1991015533A1 (fr) * 1990-04-03 1991-10-17 Kanegafuchi Chemical Industry Co., Ltd. Composition de resine vulcanisable
JPH0657208A (ja) * 1992-06-12 1994-03-01 Cemedine Co Ltd 耐チッピング塗料組成物
JPH07242737A (ja) * 1994-03-07 1995-09-19 Kanegafuchi Chem Ind Co Ltd 硬化性樹脂組成物
JP3883215B2 (ja) * 1994-03-25 2007-02-21 株式会社カネカ コンタクト型接着剤
JP3923542B2 (ja) * 1994-04-08 2007-06-06 株式会社東芝 樹脂モールド品及びそれを用いた重電機器
KR960007637A (ko) * 1994-08-15 1996-03-22 알베르투스 빌헬무스·요아네스 쩨스트라텐 에폭시 수지 시스템

Also Published As

Publication number Publication date
EP1146084B1 (de) 2004-09-22
EP1146084A3 (de) 2002-06-05
US20020016411A1 (en) 2002-02-07
JP4520003B2 (ja) 2010-08-04
DE60105682T2 (de) 2006-02-16
DE60105682D1 (de) 2004-10-28
JP2001354835A (ja) 2001-12-25
EP1146084A2 (de) 2001-10-17
US6624260B2 (en) 2003-09-23

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