JP2004532299A5 - - Google Patents

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Publication number
JP2004532299A5
JP2004532299A5 JP2002571782A JP2002571782A JP2004532299A5 JP 2004532299 A5 JP2004532299 A5 JP 2004532299A5 JP 2002571782 A JP2002571782 A JP 2002571782A JP 2002571782 A JP2002571782 A JP 2002571782A JP 2004532299 A5 JP2004532299 A5 JP 2004532299A5
Authority
JP
Japan
Prior art keywords
adhesive composition
combinations
silicon
substrate
polyimide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002571782A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004532299A (ja
JP4481568B2 (ja
Filing date
Publication date
Priority claimed from US09/801,234 external-priority patent/US6800371B2/en
Application filed filed Critical
Publication of JP2004532299A publication Critical patent/JP2004532299A/ja
Publication of JP2004532299A5 publication Critical patent/JP2004532299A5/ja
Application granted granted Critical
Publication of JP4481568B2 publication Critical patent/JP4481568B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP2002571782A 2001-03-07 2002-02-05 チオエーテル基含有接着剤および接着剤組成物 Expired - Lifetime JP4481568B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/801,234 US6800371B2 (en) 2001-03-07 2001-03-07 Adhesives and adhesive compositions containing thioether groups
PCT/US2002/003471 WO2002072725A1 (en) 2001-03-07 2002-02-05 Adhesives and adhesive compositions containing thioether groups

Publications (3)

Publication Number Publication Date
JP2004532299A JP2004532299A (ja) 2004-10-21
JP2004532299A5 true JP2004532299A5 (enExample) 2005-12-22
JP4481568B2 JP4481568B2 (ja) 2010-06-16

Family

ID=25180543

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002571782A Expired - Lifetime JP4481568B2 (ja) 2001-03-07 2002-02-05 チオエーテル基含有接着剤および接着剤組成物

Country Status (9)

Country Link
US (1) US6800371B2 (enExample)
EP (1) EP1366130B1 (enExample)
JP (1) JP4481568B2 (enExample)
KR (1) KR100933964B1 (enExample)
AT (1) ATE301174T1 (enExample)
DE (1) DE60205342T2 (enExample)
MX (1) MXPA03007929A (enExample)
MY (1) MY128233A (enExample)
WO (1) WO2002072725A1 (enExample)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050010003A1 (en) * 2003-07-11 2005-01-13 Prc-Desoto International, Inc. Epoxy-capped polythioethers
US7622548B2 (en) * 2003-07-11 2009-11-24 Prc Desoto International, Inc. Epoxy- or amine/hydroxy-capped polythioethers
US7183353B2 (en) * 2004-04-29 2007-02-27 Hewlett-Packard Development Company, L.P. UV curable coating composition
US20070236542A1 (en) * 2006-03-29 2007-10-11 Graham David C Adhesive Compositions, Micro-Fluid Ejection Devices, and Methods for Attaching Micro-Fluid Ejection Heads
US8623989B1 (en) 2006-05-05 2014-01-07 PRC De Soto International, Inc. Polyurea/polythiourea coatings
WO2007131145A1 (en) * 2006-05-05 2007-11-15 Ppg Industries Ohio, Inc. Compositions and articles prepared from thioether functional oligomeric polythiols
US7879955B2 (en) * 2007-05-01 2011-02-01 Rao Chandra B Compositions including a polythioether
WO2010005710A1 (en) * 2008-06-16 2010-01-14 3M Innovative Properties Company Toughened curable compositions
CN101971259B (zh) * 2009-01-13 2014-06-18 松下电器产业株式会社 信息记录装置、信息再生装置以及信息记录介质
US20110014354A1 (en) * 2009-07-20 2011-01-20 David Christopher Graham Adhesive compositions and methods for use in failure analysis
US20110318882A1 (en) 2010-06-24 2011-12-29 Xiaoming Wu Method of restricting chip movement upon bonding to rigid substrate using spray coatable adhesive
JP5960524B2 (ja) * 2012-07-03 2016-08-02 株式会社Adeka 含硫黄エポキシ化合物、該化合物を含有する樹脂組成物、及び、該樹脂組成物を含有する接着剤
JP2014012778A (ja) * 2012-07-05 2014-01-23 Adeka Corp 樹脂組成物及びそれを含有してなる接着剤
CN105934346B (zh) 2014-01-29 2017-09-08 惠普发展公司，有限责任合伙企业 流体引导组件
WO2017004492A1 (en) 2015-07-01 2017-01-05 3M Innovative Properties Company Pvp- and/or pvl-containing composite membranes and methods of use
CN107921370B (zh) 2015-07-01 2022-03-29 3M创新有限公司 聚合离聚物分离膜及其使用方法
US10478778B2 (en) 2015-07-01 2019-11-19 3M Innovative Properties Company Composite membranes with improved performance and/or durability and methods of use
TWI572675B (zh) * 2015-07-15 2017-03-01 臻鼎科技股份有限公司 聚醯亞胺組合物、聚醯亞胺膜及電路板
CN107621752B (zh) * 2016-07-13 2019-11-12 常州强力先端电子材料有限公司 一种混杂型光敏树脂及其制备方法
CN106497475B (zh) * 2016-10-28 2020-07-31 苏州太湖电工新材料股份有限公司 一种用于单面玻璃布补强少胶云母带的胶粘剂及其制备方法

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Publication number Priority date Publication date Assignee Title
BE528443A (enExample) 1953-04-29
NL7000025A (enExample) 1969-01-08 1970-07-10
JPS55164254A (en) * 1979-06-06 1980-12-20 Dainippon Toryo Co Ltd Modified epoxy coating composition
US4521490A (en) 1983-08-11 1985-06-04 Minnesota Mining And Manufacturing Co. Two-part epoxy composition
US4816546A (en) 1987-06-23 1989-03-28 The Dow Chemical Company Mixed epoxy resins comprising sulfide containing aliphatic epoxy resins
AU602822B2 (en) 1988-10-05 1990-10-25 National Starch & Chemical Corporation Self fixturing structural adhesives
US5364914A (en) 1988-10-05 1994-11-15 Imperial Chemical Industries Plc Moulding composition comprising a thermoset component and thermoplast component
US5225486A (en) * 1989-08-31 1993-07-06 Amoco Corporation Epoxy resins containing epoxidized polybutenes
JPH04175376A (ja) * 1990-11-08 1992-06-23 Nippon Oil & Fats Co Ltd 熱硬化性組成物
US5405731A (en) * 1992-12-22 1995-04-11 E. I. Du Pont De Nemours And Company Aqueous processable, multilayer, photoimageable permanent coatings for printed circuits
JPH07179564A (ja) * 1993-12-24 1995-07-18 Nippon Steel Chem Co Ltd 低粘度結晶性エポキシ樹脂の製造方法
JP3692539B2 (ja) 1995-06-06 2005-09-07 日本油脂株式会社 熱硬化性組成物、塗装仕上げ方法および塗装物品
US6180200B1 (en) * 1998-06-01 2001-01-30 Dsm N. V. Cationic and hybrid radiation curable pressure sensitive adhesives for bonding of optical discs
JP2000026828A (ja) * 1998-07-13 2000-01-25 Sekisui Chem Co Ltd 接着剤組成物
JP2000303053A (ja) * 1999-04-23 2000-10-31 Sekisui Chem Co Ltd 接着剤組成物
JP2000303052A (ja) * 1999-04-23 2000-10-31 Sekisui Chem Co Ltd 接着剤組成物
EP1194953A4 (en) 1999-06-17 2002-09-04 Loctite Corp CONTROLLED DEGRADABLE COMPOSITION BASED ON A HETEROATOM CARBONIC ACID OR EPOXY RESIN AND A CURING AGENT

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