TW200611951A - Cohesive tape for dicing/die bonding - Google Patents
Cohesive tape for dicing/die bondingInfo
- Publication number
- TW200611951A TW200611951A TW094120007A TW94120007A TW200611951A TW 200611951 A TW200611951 A TW 200611951A TW 094120007 A TW094120007 A TW 094120007A TW 94120007 A TW94120007 A TW 94120007A TW 200611951 A TW200611951 A TW 200611951A
- Authority
- TW
- Taiwan
- Prior art keywords
- dicing
- die bonding
- adhesive layer
- adhesive tape
- adhesive
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
- C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/35—Heat-activated
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesive Tapes (AREA)
- Die Bonding (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Dicing (AREA)
Abstract
The present invention provides an adhesive tape for dicing/die bonding, wherein an adhesive layer is laminated on an adhesive layer formed on a substrate so that an adhesive tape for dicing/die bonding can be formed. In this case, the adhesive layer contains (A) polyimide resin having siloxane coupling, (B) epoxy resin and (C) epoxy resin hardening catalyst as indispensable components, and consists of adhesive composition whose Young's modulus is 10 Mpa or more, and the adhesion of the adhesive layer and the adhesive layer is 0.2 to 2.0 N/25 mm. If the adhesive tape for dicing/die bonding of the present invention is adopted, the adhesive tape can be used for stably carrying out a dicing/die bonding process in a semiconductor manufacturing process, and for forming a highly reliable semiconductor device with high adhesiveness after humidification and high adhesiveness and high strength in high temperature.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004179981A JP2006005159A (en) | 2004-06-17 | 2004-06-17 | Cohesive tape for dicing/die bonding |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200611951A true TW200611951A (en) | 2006-04-16 |
Family
ID=35773273
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094120007A TW200611951A (en) | 2004-06-17 | 2005-06-16 | Cohesive tape for dicing/die bonding |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2006005159A (en) |
KR (1) | KR20060046464A (en) |
TW (1) | TW200611951A (en) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4774999B2 (en) * | 2006-01-18 | 2011-09-21 | ソニー株式会社 | Manufacturing method of semiconductor device |
JP5183076B2 (en) * | 2006-02-16 | 2013-04-17 | 信越化学工業株式会社 | Manufacturing method of semiconductor device |
JP2007321130A (en) * | 2006-06-05 | 2007-12-13 | Shin Etsu Chem Co Ltd | Adhesive composition and adhesive film |
JP5422878B2 (en) * | 2006-10-24 | 2014-02-19 | 東レ株式会社 | Adhesive composition for semiconductor, semiconductor device using the same, and method for manufacturing semiconductor device |
JP4975514B2 (en) | 2007-04-26 | 2012-07-11 | 信越化学工業株式会社 | DIE BONDING AGENT AND SEMICONDUCTOR DEVICE USING THE SAME |
KR101191121B1 (en) * | 2007-12-03 | 2012-10-15 | 주식회사 엘지화학 | Dicing die bonding film and dicing method |
KR101240870B1 (en) * | 2008-04-21 | 2013-03-07 | 주식회사 엘지화학 | Die Attach films and semiconductor wafers |
KR101019755B1 (en) * | 2009-07-15 | 2011-03-08 | 제일모직주식회사 | Die adhesive film, reel of die adhesive film and mounting apparatus comprising the same |
JP5174092B2 (en) * | 2009-08-31 | 2013-04-03 | 日東電工株式会社 | Adhesive film with dicing sheet and method for producing the same |
JP5653675B2 (en) * | 2010-07-30 | 2015-01-14 | 古河電気工業株式会社 | Wafer processing tape |
KR101454069B1 (en) * | 2011-10-31 | 2014-10-24 | 주식회사 엘지화학 | Dicing die bonding film |
JP6094029B2 (en) * | 2011-12-27 | 2017-03-15 | 日立化成株式会社 | Dicing and die bonding integrated tape |
US8999817B2 (en) * | 2012-02-28 | 2015-04-07 | Shin-Etsu Chemical Co., Ltd. | Wafer process body, wafer processing member, wafer processing temporary adhesive material, and method for manufacturing thin wafer |
KR101730054B1 (en) | 2013-12-13 | 2017-04-25 | 주식회사 엘지화학 | Dicing film adhesion layer composition and dicing film |
WO2015088282A1 (en) * | 2013-12-13 | 2015-06-18 | 주식회사 엘지화학 | Composition for forming adhesive layer of dicing film, and dicing film |
EP3605202B1 (en) | 2018-07-31 | 2022-11-09 | Essilor International | Method and system for determining a lens of customized color |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10214801A (en) * | 1997-01-31 | 1998-08-11 | Teijin Ltd | Dicing tape |
JP2000297267A (en) * | 1999-04-16 | 2000-10-24 | Kanegafuchi Chem Ind Co Ltd | Solventless tack agent composition and production of tack product |
JP2004043760A (en) * | 2001-08-27 | 2004-02-12 | Hitachi Chem Co Ltd | Adhesive sheet, semiconductor device, and production method for the sheet |
JP2004043762A (en) * | 2001-08-27 | 2004-02-12 | Hitachi Chem Co Ltd | Adhesive sheet, semiconductor device, and production method of the sheet |
JP3862004B2 (en) * | 2002-05-10 | 2006-12-27 | 信越化学工業株式会社 | Heat resistant resin composition and adhesive film using the same |
JP4432316B2 (en) * | 2002-06-26 | 2010-03-17 | 日立化成工業株式会社 | Adhesive sheet, semiconductor device and manufacturing method thereof |
JP2004043814A (en) * | 2002-07-15 | 2004-02-12 | Dow Corning Toray Silicone Co Ltd | Silicone-based adhesive sheet, method for adhering semiconductor chip with mounting part therefor and semiconductor device |
JP4344912B2 (en) * | 2002-10-04 | 2009-10-14 | 信越化学工業株式会社 | Silicone adhesive and silicone adhesive film |
-
2004
- 2004-06-17 JP JP2004179981A patent/JP2006005159A/en active Pending
-
2005
- 2005-06-16 TW TW094120007A patent/TW200611951A/en unknown
- 2005-06-16 KR KR1020050051732A patent/KR20060046464A/en not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
JP2006005159A (en) | 2006-01-05 |
KR20060046464A (en) | 2006-05-17 |
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