TW200611951A - Cohesive tape for dicing/die bonding - Google Patents

Cohesive tape for dicing/die bonding

Info

Publication number
TW200611951A
TW200611951A TW094120007A TW94120007A TW200611951A TW 200611951 A TW200611951 A TW 200611951A TW 094120007 A TW094120007 A TW 094120007A TW 94120007 A TW94120007 A TW 94120007A TW 200611951 A TW200611951 A TW 200611951A
Authority
TW
Taiwan
Prior art keywords
dicing
die bonding
adhesive layer
adhesive tape
adhesive
Prior art date
Application number
TW094120007A
Other languages
Chinese (zh)
Inventor
Shouhei Kozakai
Nobuhiro Ichiroku
Akio Suzuki
Toshio Shiobara
Original Assignee
Shinetsu Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Chemical Co filed Critical Shinetsu Chemical Co
Publication of TW200611951A publication Critical patent/TW200611951A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesive Tapes (AREA)
  • Die Bonding (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)

Abstract

The present invention provides an adhesive tape for dicing/die bonding, wherein an adhesive layer is laminated on an adhesive layer formed on a substrate so that an adhesive tape for dicing/die bonding can be formed. In this case, the adhesive layer contains (A) polyimide resin having siloxane coupling, (B) epoxy resin and (C) epoxy resin hardening catalyst as indispensable components, and consists of adhesive composition whose Young's modulus is 10 Mpa or more, and the adhesion of the adhesive layer and the adhesive layer is 0.2 to 2.0 N/25 mm. If the adhesive tape for dicing/die bonding of the present invention is adopted, the adhesive tape can be used for stably carrying out a dicing/die bonding process in a semiconductor manufacturing process, and for forming a highly reliable semiconductor device with high adhesiveness after humidification and high adhesiveness and high strength in high temperature.
TW094120007A 2004-06-17 2005-06-16 Cohesive tape for dicing/die bonding TW200611951A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004179981A JP2006005159A (en) 2004-06-17 2004-06-17 Cohesive tape for dicing/die bonding

Publications (1)

Publication Number Publication Date
TW200611951A true TW200611951A (en) 2006-04-16

Family

ID=35773273

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094120007A TW200611951A (en) 2004-06-17 2005-06-16 Cohesive tape for dicing/die bonding

Country Status (3)

Country Link
JP (1) JP2006005159A (en)
KR (1) KR20060046464A (en)
TW (1) TW200611951A (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4774999B2 (en) * 2006-01-18 2011-09-21 ソニー株式会社 Manufacturing method of semiconductor device
JP5183076B2 (en) * 2006-02-16 2013-04-17 信越化学工業株式会社 Manufacturing method of semiconductor device
JP2007321130A (en) * 2006-06-05 2007-12-13 Shin Etsu Chem Co Ltd Adhesive composition and adhesive film
JP5422878B2 (en) * 2006-10-24 2014-02-19 東レ株式会社 Adhesive composition for semiconductor, semiconductor device using the same, and method for manufacturing semiconductor device
JP4975514B2 (en) 2007-04-26 2012-07-11 信越化学工業株式会社 DIE BONDING AGENT AND SEMICONDUCTOR DEVICE USING THE SAME
KR101191121B1 (en) * 2007-12-03 2012-10-15 주식회사 엘지화학 Dicing die bonding film and dicing method
KR101240870B1 (en) * 2008-04-21 2013-03-07 주식회사 엘지화학 Die Attach films and semiconductor wafers
KR101019755B1 (en) * 2009-07-15 2011-03-08 제일모직주식회사 Die adhesive film, reel of die adhesive film and mounting apparatus comprising the same
JP5174092B2 (en) * 2009-08-31 2013-04-03 日東電工株式会社 Adhesive film with dicing sheet and method for producing the same
JP5653675B2 (en) * 2010-07-30 2015-01-14 古河電気工業株式会社 Wafer processing tape
KR101454069B1 (en) * 2011-10-31 2014-10-24 주식회사 엘지화학 Dicing die bonding film
JP6094029B2 (en) * 2011-12-27 2017-03-15 日立化成株式会社 Dicing and die bonding integrated tape
US8999817B2 (en) * 2012-02-28 2015-04-07 Shin-Etsu Chemical Co., Ltd. Wafer process body, wafer processing member, wafer processing temporary adhesive material, and method for manufacturing thin wafer
KR101730054B1 (en) 2013-12-13 2017-04-25 주식회사 엘지화학 Dicing film adhesion layer composition and dicing film
WO2015088282A1 (en) * 2013-12-13 2015-06-18 주식회사 엘지화학 Composition for forming adhesive layer of dicing film, and dicing film
EP3605202B1 (en) 2018-07-31 2022-11-09 Essilor International Method and system for determining a lens of customized color

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10214801A (en) * 1997-01-31 1998-08-11 Teijin Ltd Dicing tape
JP2000297267A (en) * 1999-04-16 2000-10-24 Kanegafuchi Chem Ind Co Ltd Solventless tack agent composition and production of tack product
JP2004043760A (en) * 2001-08-27 2004-02-12 Hitachi Chem Co Ltd Adhesive sheet, semiconductor device, and production method for the sheet
JP2004043762A (en) * 2001-08-27 2004-02-12 Hitachi Chem Co Ltd Adhesive sheet, semiconductor device, and production method of the sheet
JP3862004B2 (en) * 2002-05-10 2006-12-27 信越化学工業株式会社 Heat resistant resin composition and adhesive film using the same
JP4432316B2 (en) * 2002-06-26 2010-03-17 日立化成工業株式会社 Adhesive sheet, semiconductor device and manufacturing method thereof
JP2004043814A (en) * 2002-07-15 2004-02-12 Dow Corning Toray Silicone Co Ltd Silicone-based adhesive sheet, method for adhering semiconductor chip with mounting part therefor and semiconductor device
JP4344912B2 (en) * 2002-10-04 2009-10-14 信越化学工業株式会社 Silicone adhesive and silicone adhesive film

Also Published As

Publication number Publication date
JP2006005159A (en) 2006-01-05
KR20060046464A (en) 2006-05-17

Similar Documents

Publication Publication Date Title
TW200611951A (en) Cohesive tape for dicing/die bonding
TW200727446A (en) Stack type semiconductor device manufacturing method and stack type electronic component manufacturing method
ATE496104T1 (en) B CONDITION ADHESIVE FOR CHIP BONDING
JP2010199541A5 (en)
ATE477313T1 (en) ADHESIVE FILM FOR CHIP BONDING
MY137601A (en) Hardenable pressure-sensitive adhesive sheet for semiconductor and process for producing semiconductor device.
TW200642055A (en) Area mount type semiconductor device, and die bonding resin composition and encapsulating resin composition used for the same
MY145363A (en) Adhesive film and method for manufacturing semiconductor device using same
MY147837A (en) Semiconductor device, resin composition for buffer coating, resin composition for die bonding, and resin composition for encapsulating
TW200603245A (en) Adhesive sheet commonly used for dicing/die bonding and semiconductor device using the same
RU2009125008A (en) REMOVABLE ADHESIVE TAPE
JP2010199542A5 (en)
SG170099A1 (en) Integrated circuit package system with warp-free chip
TW200738841A (en) Adhesive composition, film-like adhesive, adhesive sheet and semiconductor device using the same
MY147687A (en) Wafer-processing tape
WO2008076635A3 (en) Stacked flip-assembled semiconductor chips embedded in thin hybrid substrate
WO2009011281A1 (en) Dicing/die bonding tape and method for manufacturing semiconductor chip
ATE384335T1 (en) CHIP ATTACHMENT
TW200722496A (en) Die bonding adhesive tape
TW200705603A (en) Dicing die adhesive film for semiconductor
TW200613503A (en) Dicing die bonding film
TW200728427A (en) Adhesive composition and adhesive thin film made of the same
WO2010099350A3 (en) Low cost bonding technique for integrated circuit chips and pdms structures
TWI231534B (en) Method for dicing a wafer
TW200741903A (en) Method of manufacturing a semiconductor apparatus