JP2004532299A5 - - Google Patents
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- Publication number
- JP2004532299A5 JP2004532299A5 JP2002571782A JP2002571782A JP2004532299A5 JP 2004532299 A5 JP2004532299 A5 JP 2004532299A5 JP 2002571782 A JP2002571782 A JP 2002571782A JP 2002571782 A JP2002571782 A JP 2002571782A JP 2004532299 A5 JP2004532299 A5 JP 2004532299A5
- Authority
- JP
- Japan
- Prior art keywords
- adhesive composition
- combinations
- silicon
- substrate
- polyimide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 claims 9
- 239000000853 adhesive Substances 0.000 claims 5
- 230000001070 adhesive Effects 0.000 claims 5
- 239000000758 substrate Substances 0.000 claims 4
- 229920001721 Polyimide Polymers 0.000 claims 3
- 239000004642 Polyimide Substances 0.000 claims 3
- 239000004033 plastic Substances 0.000 claims 3
- 229920003023 plastic Polymers 0.000 claims 3
- 239000010703 silicon Substances 0.000 claims 3
- 229910052710 silicon Inorganic materials 0.000 claims 3
- 229910000510 noble metal Inorganic materials 0.000 claims 2
- 239000003054 catalyst Substances 0.000 claims 1
- 239000007795 chemical reaction product Substances 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 claims 1
- 239000010970 precious metal Substances 0.000 claims 1
- 239000000047 product Substances 0.000 claims 1
- 150000003568 thioethers Chemical class 0.000 claims 1
Claims (3)
- シリコン、貴金属、プラスチック、ポリイミドまたはその組み合わせを含む基材を接着するのに有用な硬化性接着剤組成物であって、
エポキシ樹脂と、触媒または硬化剤と、チオエーテルジエポキシドとの混合物を含む、組成物。 - シリコン、貴金属、プラスチック、ポリイミドまたはその組み合わせを含む基材と、
請求項１に記載の接着剤組成物の反応生成物を含む接着剤とを含む、製品。 - 基材と請求項１に記載の接着剤組成物とを接触させるステップと、
該接着剤組成物を硬化するステップとを含む基材の接着方法であって、
前記基材が、シリコン、貴金属、プラスチック、ポリイミドまたはその組み合わせを含む、方法。
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/801,234 US6800371B2 (en) | 2001-03-07 | 2001-03-07 | Adhesives and adhesive compositions containing thioether groups |
| PCT/US2002/003471 WO2002072725A1 (en) | 2001-03-07 | 2002-02-05 | Adhesives and adhesive compositions containing thioether groups |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004532299A JP2004532299A (ja) | 2004-10-21 |
| JP2004532299A5 true JP2004532299A5 (ja) | 2005-12-22 |
| JP4481568B2 JP4481568B2 (ja) | 2010-06-16 |
Family
ID=25180543
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002571782A Expired - Lifetime JP4481568B2 (ja) | 2001-03-07 | 2002-02-05 | チオエーテル基含有接着剤および接着剤組成物 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US6800371B2 (ja) |
| EP (1) | EP1366130B1 (ja) |
| JP (1) | JP4481568B2 (ja) |
| KR (1) | KR100933964B1 (ja) |
| AT (1) | ATE301174T1 (ja) |
| DE (1) | DE60205342T2 (ja) |
| MX (1) | MXPA03007929A (ja) |
| MY (1) | MY128233A (ja) |
| WO (1) | WO2002072725A1 (ja) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050010003A1 (en) * | 2003-07-11 | 2005-01-13 | Prc-Desoto International, Inc. | Epoxy-capped polythioethers |
| US7622548B2 (en) * | 2003-07-11 | 2009-11-24 | Prc Desoto International, Inc. | Epoxy- or amine/hydroxy-capped polythioethers |
| US7183353B2 (en) * | 2004-04-29 | 2007-02-27 | Hewlett-Packard Development Company, L.P. | UV curable coating composition |
| US20070236542A1 (en) * | 2006-03-29 | 2007-10-11 | Graham David C | Adhesive Compositions, Micro-Fluid Ejection Devices, and Methods for Attaching Micro-Fluid Ejection Heads |
| US8623989B1 (en) | 2006-05-05 | 2014-01-07 | PRC De Soto International, Inc. | Polyurea/polythiourea coatings |
| ES2447035T3 (es) * | 2006-05-05 | 2014-03-11 | Prc-Desoto International, Inc. | Formulaciones de sellantes y encapsulantes eléctricos que comprenden politioles oligoméricos con funcionalidad tioéter |
| US7879955B2 (en) * | 2007-05-01 | 2011-02-01 | Rao Chandra B | Compositions including a polythioether |
| EP2294119B1 (en) * | 2008-06-16 | 2018-08-01 | 3M Innovative Properties Company | Reinforced curable compositions |
| CN101971259B (zh) * | 2009-01-13 | 2014-06-18 | 松下电器产业株式会社 | 信息记录装置、信息再生装置以及信息记录介质 |
| US20110014354A1 (en) * | 2009-07-20 | 2011-01-20 | David Christopher Graham | Adhesive compositions and methods for use in failure analysis |
| US20110318882A1 (en) | 2010-06-24 | 2011-12-29 | Xiaoming Wu | Method of restricting chip movement upon bonding to rigid substrate using spray coatable adhesive |
| JP5960524B2 (ja) * | 2012-07-03 | 2016-08-02 | 株式会社Adeka | 含硫黄エポキシ化合物、該化合物を含有する樹脂組成物、及び、該樹脂組成物を含有する接着剤 |
| JP2014012778A (ja) * | 2012-07-05 | 2014-01-23 | Adeka Corp | 樹脂組成物及びそれを含有してなる接着剤 |
| US9707766B2 (en) | 2014-01-29 | 2017-07-18 | Hewlett-Packard Development Company, L.P. | Fluid directing assembly |
| CN107847867B (zh) | 2015-07-01 | 2021-06-25 | 3M创新有限公司 | 具有改善的性能和/或耐久性的复合膜及其使用方法 |
| US10618008B2 (en) | 2015-07-01 | 2020-04-14 | 3M Innovative Properties Company | Polymeric ionomer separation membranes and methods of use |
| US10737220B2 (en) | 2015-07-01 | 2020-08-11 | 3M Innovative Properties Company | PVP- and/or PVL-containing composite membranes and methods of use |
| TWI572675B (zh) * | 2015-07-15 | 2017-03-01 | 臻鼎科技股份有限公司 | 聚醯亞胺組合物、聚醯亞胺膜及電路板 |
| CN107621752B (zh) | 2016-07-13 | 2019-11-12 | 常州强力先端电子材料有限公司 | 一种混杂型光敏树脂及其制备方法 |
| CN111925741B (zh) * | 2016-10-28 | 2021-11-09 | 苏州太湖电工新材料股份有限公司 | 一种单面玻璃布补强少胶云母带及线棒 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE528443A (ja) | 1953-04-29 | |||
| NL7000025A (ja) | 1969-01-08 | 1970-07-10 | ||
| JPS55164254A (en) * | 1979-06-06 | 1980-12-20 | Dainippon Toryo Co Ltd | Modified epoxy coating composition |
| US4521490A (en) | 1983-08-11 | 1985-06-04 | Minnesota Mining And Manufacturing Co. | Two-part epoxy composition |
| US4816546A (en) | 1987-06-23 | 1989-03-28 | The Dow Chemical Company | Mixed epoxy resins comprising sulfide containing aliphatic epoxy resins |
| AU602822B2 (en) | 1988-10-05 | 1990-10-25 | National Starch & Chemical Corporation | Self fixturing structural adhesives |
| US5364914A (en) | 1988-10-05 | 1994-11-15 | Imperial Chemical Industries Plc | Moulding composition comprising a thermoset component and thermoplast component |
| US5225486A (en) * | 1989-08-31 | 1993-07-06 | Amoco Corporation | Epoxy resins containing epoxidized polybutenes |
| JPH04175376A (ja) * | 1990-11-08 | 1992-06-23 | Nippon Oil & Fats Co Ltd | 熱硬化性組成物 |
| US5405731A (en) * | 1992-12-22 | 1995-04-11 | E. I. Du Pont De Nemours And Company | Aqueous processable, multilayer, photoimageable permanent coatings for printed circuits |
| JPH07179564A (ja) * | 1993-12-24 | 1995-07-18 | Nippon Steel Chem Co Ltd | 低粘度結晶性エポキシ樹脂の製造方法 |
| JP3692539B2 (ja) | 1995-06-06 | 2005-09-07 | 日本油脂株式会社 | 熱硬化性組成物、塗装仕上げ方法および塗装物品 |
| US6180200B1 (en) * | 1998-06-01 | 2001-01-30 | Dsm N. V. | Cationic and hybrid radiation curable pressure sensitive adhesives for bonding of optical discs |
| JP2000026828A (ja) * | 1998-07-13 | 2000-01-25 | Sekisui Chem Co Ltd | 接着剤組成物 |
| JP2000303053A (ja) * | 1999-04-23 | 2000-10-31 | Sekisui Chem Co Ltd | 接着剤組成物 |
| JP2000303052A (ja) * | 1999-04-23 | 2000-10-31 | Sekisui Chem Co Ltd | 接着剤組成物 |
| JP4718070B2 (ja) | 1999-06-17 | 2011-07-06 | ヘンケル コーポレイション | アンダーフィル封止および補修方法 |
-
2001
- 2001-03-07 US US09/801,234 patent/US6800371B2/en not_active Expired - Lifetime
-
2002
- 2002-02-05 JP JP2002571782A patent/JP4481568B2/ja not_active Expired - Lifetime
- 2002-02-05 KR KR1020037011642A patent/KR100933964B1/ko active IP Right Grant
- 2002-02-05 MX MXPA03007929A patent/MXPA03007929A/es active IP Right Grant
- 2002-02-05 WO PCT/US2002/003471 patent/WO2002072725A1/en active IP Right Grant
- 2002-02-05 AT AT02717397T patent/ATE301174T1/de not_active IP Right Cessation
- 2002-02-05 EP EP20020717397 patent/EP1366130B1/en not_active Expired - Lifetime
- 2002-02-05 DE DE2002605342 patent/DE60205342T2/de not_active Expired - Lifetime
- 2002-02-26 MY MYPI20020656A patent/MY128233A/en unknown
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