JP2007504320A5 - - Google Patents
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- JP2007504320A5 JP2007504320A5 JP2006525320A JP2006525320A JP2007504320A5 JP 2007504320 A5 JP2007504320 A5 JP 2007504320A5 JP 2006525320 A JP2006525320 A JP 2006525320A JP 2006525320 A JP2006525320 A JP 2006525320A JP 2007504320 A5 JP2007504320 A5 JP 2007504320A5
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- JP
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- Prior art keywords
- weight
- bisphenol
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- total weight
- reaction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- PXKLMJQFEQBVLD-UHFFFAOYSA-N Bis(4-hydroxyphenyl)methane Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims 4
- IISBACLAFKSPIT-UHFFFAOYSA-N Bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims 4
- 239000004593 Epoxy Substances 0.000 claims 4
- 238000005296 abrasive Methods 0.000 claims 4
- NIXOWILDQLNWCW-UHFFFAOYSA-M acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims 4
- 239000003054 catalyst Substances 0.000 claims 4
- QGBSISYHAICWAH-UHFFFAOYSA-N cyanoguanidine Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims 4
- 125000003700 epoxy group Chemical group 0.000 claims 4
- 239000003822 epoxy resin Substances 0.000 claims 4
- 229920003986 novolac Polymers 0.000 claims 4
- 239000003211 photoinitiator Substances 0.000 claims 4
- 229920000647 polyepoxide Polymers 0.000 claims 4
- 229920005989 resin Polymers 0.000 claims 4
- 239000011347 resin Substances 0.000 claims 4
- 239000011230 binding agent Substances 0.000 claims 3
- BRLQWZUYTZBJKN-UHFFFAOYSA-N epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 claims 3
- 239000007795 chemical reaction product Substances 0.000 claims 2
- 239000004744 fabric Substances 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000002245 particle Substances 0.000 claims 1
- OAICVXFJPJFONN-UHFFFAOYSA-N phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims 1
- 229910052698 phosphorus Inorganic materials 0.000 claims 1
- 239000011574 phosphorus Substances 0.000 claims 1
Claims (4)
- ａ）エピクロロヒドリンとビスフェノールＡまたはビスフェノールＦの少なくとも一方との反応によって調製可能な少なくとも１種のエポキシ樹脂５０〜９０重量％と、
ｂ）多官能性（メタ）アクリレート１〜２０重量％と、
ｃ）ジシアンジアミドと、
ｄ）光開始剤と、
ｅ）任意のエポキシ硬化触媒と、
を成分ａ）〜ｅ）の全重量を基準にして含み、前記全重量を基準にして２５重量％以下のノボラック樹脂を更に含む、硬化性組成物。 - 少なくともその一部に接触する組成物を有する布地を含む処理済みバッキングであって、前記組成物が
ａ）エピクロロヒドリンとビスフェノールＡまたはビスフェノールＦの少なくとも一方との反応によって調製可能な少なくとも１種のエポキシ樹脂５０〜９０重量％と、
ｂ）多官能性（メタ）アクリレート１〜２０重量％と、
ｃ）ジシアンジアミドと、
ｄ）光開始剤と、
ｅ）任意のエポキシ硬化触媒と、
を成分ａ）〜ｅ）の全重量を基準にして含む成分の反応生成物を含み、前記組成物が前記全重量を基準にして２５重量％以下のノボラック樹脂を更に含む、処理済みバッキング。 - 布地の少なくとも一部を硬化性組成物に接触させる工程および前記組成物を少なくとも部分的に硬化させる工程を含む処理済みバッキングを製造する方法であって、前記硬化性組成物が
ａ）エピクロロヒドリンとビスフェノールＡまたはビスフェノールＦの少なくとも一方との反応によって調製可能な少なくとも１種のエポキシ樹脂５０〜９０重量％と、
ｂ）多官能性（メタ）アクリレート１〜２０重量％と、
ｃ）ジシアンジアミドと、
ｄ）光開始剤と、
ｅ）任意のエポキシ硬化触媒と、
を成分ａ）〜ｅ）の全重量を基準にして含み、前記全重量を基準にして２５重量％以下のノボラック樹脂を更に含む成分から調整可能である方法。 - バッキングと研磨粒子および結合剤を含む研磨層とを含む被覆研磨物品であって、前記結合剤が
ａ）エピクロロヒドリンとビスフェノールＡまたはビスフェノールＦの少なくとも一方との反応によって調製可能な少なくとも１種のエポキシ樹脂５０〜９０重量％と、
ｂ）多官能性（メタ）アクリレート１〜２０重量％と、
ｃ）ジシアンジアミドと、
ｄ）光開始剤と、
ｅ）任意のエポキシ硬化触媒と、
を成分ａ）〜ｅ）の全重量を基準にして含む成分の反応生成物を含み、前記結合剤が前記全重量を基準にして２５重量％以下のノボラック樹脂を更に含む、被覆研磨材。
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/655,195 | 2003-09-04 | ||
| US10/655,195 US6843815B1 (en) | 2003-09-04 | 2003-09-04 | Coated abrasive articles and method of abrading |
| PCT/US2004/021942 WO2005026229A1 (en) | 2003-09-04 | 2004-07-08 | Composition, treated backing, and coated abrasive articles containing the same |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007504320A JP2007504320A (ja) | 2007-03-01 |
| JP2007504320A5 true JP2007504320A5 (ja) | 2007-09-20 |
| JP4714687B2 JP4714687B2 (ja) | 2011-06-29 |
Family
ID=33565312
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006525320A Active JP4714687B2 (ja) | 2003-09-04 | 2004-07-08 | 組成物、該組成物を含む処理済みバッキング、および被覆研磨物品 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US6843815B1 (ja) |
| EP (1) | EP1664150B1 (ja) |
| JP (1) | JP4714687B2 (ja) |
| CN (1) | CN100418996C (ja) |
| BR (1) | BRPI0414129A (ja) |
| WO (1) | WO2005026229A1 (ja) |
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| JP3084352B2 (ja) * | 1995-08-28 | 2000-09-04 | 太陽インキ製造株式会社 | 銅箔ラミネート方式ビルドアップ用絶縁樹脂組成物とこれを用いた多層プリント配線板の製造方法 |
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-
2003
- 2003-09-04 US US10/655,195 patent/US6843815B1/en not_active Expired - Lifetime
-
2004
- 2004-07-08 WO PCT/US2004/021942 patent/WO2005026229A1/en active Search and Examination
- 2004-07-08 CN CNB2004800255838A patent/CN100418996C/zh active Active
- 2004-07-08 BR BRPI0414129 patent/BRPI0414129A/pt not_active IP Right Cessation
- 2004-07-08 JP JP2006525320A patent/JP4714687B2/ja active Active
- 2004-07-08 EP EP20040777800 patent/EP1664150B1/en active Active
- 2004-12-10 US US11/009,179 patent/US6936083B2/en not_active Expired - Lifetime
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